Abstract: A light generating device, comprising: at least one light emitting diode having a semiconductor layer that emits a first primary light, and having a phosphor layer arranged on the semiconductor layer, and at least one laser for generating at least one laser beam composed of a second primary light, by means of which the phosphor layer is irradiatable, wherein the phosphor layer is configured for at least partly converting the first primary light into at least one first secondary light and for at least partly converting the second primary light into at least one second secondary light. The light generating device is configured to dynamically illuminate the phosphor layer by means of the second primary light.

Abstract: A method of arranging a plurality of semiconductor structural elements on a carrier includes arranging at least some of the semiconductor structural elements in multiple groups G and at least one semiconductor structural element of a group G has a property E that determines the position of the respective group G of semiconductor structural elements on the carrier.

Abstract: An optoelectronic chip includes a semiconductor layer sequence including at least one n-doped semiconductor layer, at least one p-doped semiconductor layer, an active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer, wherein the p-doped semiconductor layer is electrically contacted by a p-connection contact, the n-doped semiconductor layer is electrically contacted by an n-connection contact, the semiconductor chip has at least two trenches, the p-connection contact is located within the first trench and the n-connection contact is located within the second trench, below the p-connection contact and within the first trench a first dielectric mirror element is arranged, which is electrically insulated, and below the n-connection contact and within the second trench and between the n-connection contact and the n-doped semiconductor layer, a second dielectric mirror element is arranged at least in regions, the second dielectric mirror element be

Abstract: An electronic assembly for lighting applications. The assembly includes a printed circuit board (PCB) having a first PCB surface, which is designed for populating with electronic components, and a second PCB surface opposite the first PCB surface. The PCB has a continuous cutout from the first PCB surface to the second PCB surface. The electronic assembly further includes a heat distributor having at least one first contact surface and at least one second contact surface opposite the first contact surface. The first contact surface is connected in a material-bonded manner to the PCB arranged in parallel therewith at the second printed circuit board surface. The electronic assembly further includes at least one first light emitting diode element, which is arranged on a section of the first contact surface, which section is exposed within the cutout, and is connected in a material-bonded manner to the first contact surface.

Abstract: A digitally compensated hysteretic power supply with enhanced resolution is provided. Such a power supply includes a comparator that is used to compare a load current sense signal with an internal signal generated from a digital-to-analog converter (DAC). A compensation circuit at a DAC input operates to improve current accuracy beyond the given DAC resolution. The current sense signal is converted to its digital equivalent, which is fed to a proportional-integral (PI) compensation loop, which in turn generates a relatively precise high resolution DAC input value. The DAC uses the higher part of the DAC value. The lower part of the DAC value is treated as a duty cycle number, and the DAC output is toggled between two levels at this duty cycle. This toggling generates a current output signal having a value that is the average of the two toggled values.

Abstract: A luminaire includes a microcontroller and program logic that calculates the operational age of a light engine that includes a plurality of light emitting diodes connected in series. The program logic uses changes in transition voltage to calculate the operational age of a light engine. Changes in forward voltage across the light engine are used to detect sudden catastrophic failure of individual light emitting diodes. In response to the sudden catastrophic failure of one of the light emitting diodes, the program logic adjusts the power provided to the light engine based on the calculated operational age of the light engine. For example, the operational age of the light engine may be compared with a warrantied lifespan, and the power may be adjusted to increase the likelihood of compliance with the warranty.

Abstract: A building monitoring system includes a plurality of image capture devices deployed to obtain images of target building systems, the target building systems being associated with optical landmarks visible by the image capture devices. A plurality of audio beacons are configured to output audio landmarks. A plurality of audio capture devices are deployed to obtain sound clips of the target building systems, each sound clip of the target building systems including at least one of the audio landmarks from the audio beacons. A data analysis system is configured to receive the images of the target building systems and identify each target building system from at least one of the optical landmarks and the audio landmarks.

Abstract: The invention relates to an optoelectronic component. The component includes a semiconductor layer sequence having an active layer that is designed to emit electromagnetic radiation during operation of the component, at least one current-spreading layer on a radiation outlet surface of the semiconductor layer sequence, wherein the current-spreading layer is connected to a contact structure in an electrically conductive manner by means of an adhesion layer. The adhesion layer comprises a titanium oxide, wherein in the titanium oxide the oxygen has the oxidation state W0, with W0=?2, and the titanium has the oxidation state WT, with 0 <WT<+4.

Abstract: An electronic component may include e.g. a solid-state light radiation source, preferably a LED light radiation source, is provided with electrical contact pads for soldering onto a mounting board. The electrical contact pads are arranged over a soldering area having a central portion and a peripheral portion surrounding said central portion. The electrical contact pads include at least one first electrical contact pad arranged at central portion of the soldering area, and at least one second electrical contact pad arranged at peripheral portion of the soldering area.

Abstract: The invention relates to an optoelectronic semiconductor chip (100), comprising an n-doped semiconductor layer (3), a p-doped semiconductor layer (5) and an active layer (4) arranged between the n-doped semiconductor layer (3) and the p-doped semiconductor layer (5), wherein the p-doped semiconductor layer (5) has an electrically conductive layer (7) arranged above it that is set up for making electrical contact with the p-doped semiconductor layer (5), wherein a lateral edge (2) is arranged laterally with respect to the n-doped semiconductor layer (3), the p-doped semiconductor layer (5) and the active layer (4), wherein the lateral edge (2) has at least two oblique edge portions, wherein a first edge portion (21) has at least areas arranged laterally with respect to the p-doped semiconductor layer (5), wherein a second lateral edge (22) has at least areas arranged laterally with respect to the n-doped semiconductor layer (3), wherein the angle of the first edge portion (21) in relation to the active layer (

Abstract: A light guide arrangement for a mobile communications device for optical data transmission by an optoelectronic interface component of the communications device is provided. The light guide arrangement includes a light guide body with a greatest extent in the principal light guiding direction, a first optical coupling member for coupling the optoelectronic interface component to the light guide body, a second optical coupling member with a first lens element that has a first optical axis transverse to the principal light guiding direction and with a first optical deflection element arranged along the first optical axis, and a third optical coupling member with a second lens element that has a second optical axis transverse to the principal light guiding direction and with a second optical deflection element arranged along the second optical axis. The second optical axis differs from the first optical axis.

Abstract: A lighting device, such as a LED module, comprising an elongated support structure having a longitudinal direction and electrically-powered light radiation sources distributed along the support structure, the support structure including at least one light-permeable layer, one or more optical signal sources coupled with the light-permeable layer, for injecting therein an optical signal propagating in the longitudinal direction, and one or more optical signal detectors coupled with the light-permeable layer, for detecting the optical signal injected by the optical signal source(s).

Abstract: An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed. In an embodiment, a component includes a semiconductor layer sequence including a first main side, a first layer, an active layer, a second layer and a second main side, a first contact element arranged on the second main side filling a recess in the semiconductor layer sequence, wherein the recess extends from the second main side through the second layer and the active layer and opens out into the first layer and a second contact element arranged on the second main side, the second contact element being arranged laterally next to the recess in a plan view of the second main side, wherein the first contact element comprises a first transparent intermediate layer, a metallic first mirror layer and a metallic injection element.

Abstract: In various embodiments, a phosphor element is provided. The phosphor element includes a monocrystal composed of a phosphor element material for at least partly converting a pump radiation into a conversion radiation. The monocrystal is formed with a multiplicity of scattering centers incorporated into the monocrystal—Apart from that, however, the phosphor element material in the monocrystal is present in a monocrystalline fashion. The scattering centers for scattering the conversion radiation are incorporated into the monocrystal.

Abstract: The present disclosure is directed to light converter assemblies with enhanced heat dissipation. A light converter assembly may comprise a confinement material applied to at least a first substrate and a phosphor material also deposited on the first substrate so as to be surrounded by the confinement material. The first substrate may be hermetically sealed to a second substrate using the confinement material so that the phosphor material is confined between the substrates and protected from atmospheric contamination. The substrates may comprise, for example, sapphire to allow for light beam transmission and heat conductance. Confinement materials that may be employed to seal the first substrate to the second substrate may include, for example, silicon or a metal (e.g., silver, copper, aluminum, etc.) The phosphor material may comprise, for example, at least one quantum dot material.

Abstract: A lighting device and a method for producing a lighting device are disclosed. In an embodiment, the lighting device includes a carrier, at least one optoelectronic illuminant arranged on the carrier, the illuminant configured to emit light into an emission area and a color scattering layer located in the emission area, the color scattering layer configured to generate a color by scattering of light at a surface of the color scattering layer facing away from the illuminant.

Abstract: A solid state driver to adapt current ripple characteristics therein, at least partially based on operating characteristics of a solid state lighting device operated by the driver, is provided. The driver senses operating voltage, operating current, or a combination of operating voltage and operating current of a solid state lighting device. The driver stores pre-determined current ripple percentage settings in a data structure, for example, in a controller circuit. The driver selects and implements one of the pre-determined current ripple percentage settings based on one or more of the sensed operating characteristics of the solid state lighting device, to improve efficiency, to reduce the operating frequency, and/or to lower the operating temperature of one or more components of the driver.

Abstract: A module for a video wall includes a plurality of light-emitting components; and a carrier including conduction regions, wherein the light-emitting components each include a top side including a top-side contact and an underside including an underside contact, the light-emitting components are configured to emit electromagnetic radiation via the top side, the underside contacts of the light-emitting components electrically conductively connect to the conduction regions, the top-side contacts electrically contact a conductive layer, the light-emitting components each include at least four light-emitting semiconductor chips, the light-emitting semiconductor chips within a light-emitting component interconnect in parallel with one another, the light-emitting semiconductor chips within a light-emitting component each electrically conductively connect to the top-side contacts and the underside contacts of the light-emitting component, a plurality of adjacent light-emitting components constitute a cluster, and the

Abstract: The preferred embodiments are directed to discloses a metal halide high-pressure discharge lamp comprising a burner which is enclosed by an outer bulb. In the outer bulb samarium is provided.

Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.