Abstract: A method of producing an optoelectronic component includes providing a wafer substrate that includes a light-emitting layer sequence, singulating the wafer substrate having the layer sequence into semiconductor components, applying the semiconductor components to an intermediate carrier, arranging a potting material on the intermediate carrier such that the potting material laterally surrounds the semiconductor components and is in direct contact, at least in places, with side surfaces of the semiconductor components, arranging one contact on one semiconductor component and the potting material, wherein one contact is arranged on a side of the semiconductor component and the potting material remote from the intermediate carrier, connecting the component to a carrier element, on a side of the semiconductor components remote from the intermediate carrier, removing the intermediate carrier and the wafer substrate of the semiconductor components, and bringing the semiconductor components into electrical contact b

Abstract: Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.

Abstract: In various embodiments, a lighting device for a motor vehicle is provided. The lighting device includes at least one light source, and at least one layer of a lacquer embodied such that light may be coupled into the lacquer for achieving a luminous effect. Scattering particles are provided in the lacquer for output coupling of the light.

Abstract: Methods and system to determine the health of wireless mesh networks are provided. Each radio node of a wireless mesh network transmits Link Quantification Messages (LQMs) interPAN at maximum power to enable adjacent nodes to determine the Received Signal Strength Indication (RSSI) on the wireless link to that radio node. Each radio node also transmits LQMs at successively lower power levels. The adjacent nodes detect a power level at measurable packet error rate to determine a noise floor for the wireless link. An aggregator collects link quantification information from the radio nodes and forms an intercommunication matrix for the wireless network. The RSSI and power level at measurable packet error rate information is used to remove unreliable links from the intercommunication matrix. Nodes are ranked and the reliability and dependability of the nodes is calculated to show the network health.

Abstract: The present application relates to a material comprising a monoarylamine of a formula (A) and a p-dopant of a defined formula. The present application further relates to the use of said material in an organic layer of an electronic device, the device preferably being an organic electroluminescent device (OLED).

Abstract: A video wall module and a method for producing a video wall module are disclosed. In embodiments, the video wall module includes a plurality of light emitting diode chips, each light emitting diode chip comprising a top electrode arranged at a top side of the light emitting diode chip, a bottom electrode arranged at a bottom side of the light emitting diode chip and a molded body embedding the light emitting diode chips, a front-side metallization arranged at the front side of the molded body, wherein the top electrodes are connected to the front-side metallization, a rear-side metallization arranged at a rear side of the molded body, wherein the bottom electrodes are connected to the rear-side metallization, a dielectric layer arranged at the rear side of the molded body and an outer metallization arranged at the dielectric layer, wherein the rear-side metallization is electrically conductively connected to the outer metallization.

Abstract: An optical converter is to be simply and reliably monitored. Thereto, a circuit device including a measurement bridge with a measurement branch, a first comparison branch and a second comparison branch is provided. A conductor path loop of the converter can be integrated in the measurement branch. The first comparison branch has a first series resistance variable via a first active element. Similarly, the second comparison branch has a second series resistance variable via a second active element. The first and the second active elements are respectively controllable by the same control signal. The circuit device further has an evaluation circuit with a first comparator and a second comparator, the outputs of which form the control signal and at the same time an output signal of the circuit device in AND-gated manner. Each comparator compares a tap of its respective comparison branch to a tap of the measurement branch.

Abstract: An optoelectronic component, a lighting apparatus and a car headlight are disclosed. In an embodiment an optoelectronic component includes a radiation side having a plurality of pixels arranged next to each other and a contact side, opposite of the radiation side, having a plurality of first contact structures, wherein a length of each pixel is greater than a width of the pixel, wherein the first contact structures are electrically contacted individually and independently of each other during operation, wherein each pixel is electrically uniquely associated with a first contact structure, and wherein, for each pixel and a pixel directly adjacent thereto, the two first contact structures of these two pixels are arranged differently with respect to the associated pixels so that a translation, which images the pixel in the directly adjacent pixel, does not image the two associated first contact structures congruently into each other.

Abstract: Various embodiments may relate to a light-emitting device. The light-emitting device includes an encapsulation housing and a light engine arranged in the encapsulation housing. The light engine is arranged in the encapsulation housing in such a manner that a cavity is formed between the light engine and the encapsulation housing. At least the exit surface of a light source arranged on one side of the light engine is located in the cavity.

Abstract: A lighting apparatus includes at least one primary light source for emitting primary light, at least one phosphor body arranged at a distance from the primary light source, for converting the wavelength of primary light into secondary light, and at least one at least partly dichroic mirror, which at least partly deflects primary light radiated thereon onto at least one phosphor body and which passes secondary light radiated by the phosphor body. Used light radiated by the lighting apparatus contains the secondary light and primary light radiated by at least one primary light source, and the dichroic mirror includes at least one first and second mirror regions, in such a way that the first mirror region deflects primary light onto at least one phosphor body and passes secondary light incident from the phosphor body, and that the second mirror region deflects primary light in a manner circumventing the phosphor body.

Abstract: A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).

Abstract: A light-emitting device includes a light-emitting semiconductor component that emits first light in a first wavelength range during operation A wavelength conversion element converts the first light at least partly into second light in a second wavelength range is arranged in the beam path of the first light. The second wavelength range differs from the first wavelength range. The wavelength conversion element includes nanoparticles containing organic luminescent molecules in a basic material formed from an SiO2-based material. A method for producing a light-emitting device is furthermore specified.

Abstract: An electronic converter, including a measurement circuit for determining a first signal indicative of the voltage or current supplied by the electronic converter, a regulation circuit for generating a regulation signal as a function of the first signal and one or more reference signals, and a driver circuit for driving the switching stage of the electronic converter as a function of the regulation signal. The electronic converter includes an optical, inductive or capacitive coupler and a transmission circuit configured to generate a pulse width modulated signal applied to the input of the optical, inductive or capacitive coupler, wherein the transmission circuit varies the duty cycle and the frequency of the pulse width modulated signal as a function of the first and second signal. The electronic converter includes a receiver circuit configured to monitor the received signal at the output of the optical, inductive or capacitive coupler.

Abstract: A semiconductor chip includes a semiconductor body with a semiconductor layer sequence. An active region intended for generating radiation is arranged between an n-conductive multilayer structure and a p-conductive semiconductor layer. A doping profile is formed in the n-conductive multilayer structure which includes at least one doping peak.

Abstract: The invention describes a radiation-emitting semiconductor component (100) having a first semiconductor layer sequence (10) which is designed to generate radiation of a first wavelength, a second semiconductor layer sequence (20), a first electrode area (1) and a second electrode area (2). It is provided that the second semiconductor layer sequence (20) has a quantum pot structure (21) with a quantum layer structure (22) and a barrier layer structure (23) and is designed to generate incoherent radiation of a second wavelength by means of absorption of the radiation of the first wavelength, and an electric field can be generated in the second semiconductor layer sequence (20) by the first electrode area (1) and the second electrode area (2).

Abstract: Techniques and architecture are disclosed for horticultural lighting systems and devices, such as a light module assembly. The assembly includes a housing with a first and second light module attached thereto. The first and second light modules include a mounting block to be received in the housing. The mounting block includes a plurality of light sources to generate light to stimulate growth of a plant. The first light module includes a first removable lens to focus light from the light sources to a first portion of the plant and in a first direction relative to the plant. The second light module includes an optical conduit attached thereto. The conduit is to focus light from the light sources to a second portion of the plant and in a second direction different from the first direction. The assembly transmits light to an upper portion and a lower portion of the plant.

Abstract: A solid-state automotive vehicle headlamp includes a solid-state light source (SSLS), a clamshell reflector, and a reflector optic. The clamshell reflector includes a reflective surface defining a clamshell cavity with an open end facing a field to be illuminated. The reflector optic is defined by a portion of a spherical surface in surrounding relation to the SSLC. The reflector optic defines a light-transmissive window permitting a direct line-of-sight transmission of light generated by the SSLC to the reflective surface of the clamshell reflector. The reflector optic further includes a reflective region at least partially surrounding the light-transmissive window and configured to reflect light generated by the SSLC and directed at the reflector optic back towards the SSLC. The reflector optic redirects some of the light emitted by the SSLC through the light-transmissive window towards the clamshell reflector to create a more controlled beam pattern and increase the overall light output.

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a component includes a semiconductor layer sequence having a first semiconductor layer, an active layer, a second semiconductor layer and a top side stacked in the recited order, a first contact layer arranged at the first semiconductor layer, a mirror layer arranged on the top side and a recess in the semiconductor layer sequence which extends from the top side through the entire second semiconductor layer and the active layer, wherein the recess has a bottom surface in a region of the first semiconductor layer, wherein the mirror layer covers a portion of the recess in plan view, wherein the first contact layer is in direct electrical and mechanical contact with a contact pin, and wherein the contact pin extends from the first contact layer to the top side of the semiconductor layer sequence.

Abstract: Accroding to the present disclosure, a heat sink, which may be used e.g. for LED lamps or bulbs for motor vehicle lights, includes: a plate-like portion extending along an axis with opposed mounting surfaces for at least one heat source, such as e.g. a LED lighting source, and a finned portion thermally coupled with the plate-like portion and including a plurality of annular fins extending around said axis.

Abstract: The invention relates to an optoelectronic semiconductor component (100) comprising the following —an optoelectronic semiconductor chip (2), the lateral surfaces (2c) and lower face (2b) of which are at least partly covered by a molded body (3) that is electrically conductive and is designed to electrically contact the optoelectronic semiconductor chip (2), —at least one via (6) which comprises an electrically conductive material and is laterally spaced from the semiconductor chip (2), said via (6) completely passing through the molded body (3), wherein the via (6) extends from an upper face (3a) of the molded body (3) to a lower face (3b) of the molded body (3), —at least one insulating element (9) which is arranged within the molded body (3) between the via (6) and the semiconductor chip (2) and extends from the upper face (3a) of the molded body (3) to the lower face (3b) of the molded body (3), and —an electrically conductive connection (7) which is connected to the semiconductor chip (2) and the via (6)