Abstract: A method for creating a photomask which includes a layer of hard mask material the inclusion of which improves the uniformity of critical dimensions on the photomask by minimizing the affect of macro and micro loading. The method for producing the photomask of the instant invention includes two etching processes. The first etching process etches the layer of hard mask, and the second etching process etches the anti-reflective material and opaque material.

Abstract: A method of producing a particle beam mask and mask structures to allow for the use of dummy fill shapes. This invention overcomes distortion in by adding a dummy shape in unexposed regions and applying a blocking layer to cover the dummy shape. The blocking layer is comprised of an aperture or additional mask mounted close to the mask or can be added to the mask itself.

Abstract: A fused silica pellicle for use on photomasks having increased durability and improved transmission uniformity and birefringence properties. The pellicle may be secured to the photomask using an adhesive or a slide rail system, or may be held in place using a static charge.

Abstract: A method for creating a phase shift photomask which includes a layer of hard mask material, the inclusion of which improves the uniformity of critical dimensions on the photomask by minimizing the affect of macro and micro loading. The method for producing the phase shift photomask of the instant invention includes two etching processes. The first etching process etches the layer of hard mask, and the second etching process etches opaque material (and anti-reflective layer, if used) and phase shift layers.

Abstract: A method for creating a phase shift photomask which includes a layer of hard mask material, the inclusion of which improves the uniformity of critical dimensions on the photomask by minimizing the affect of macro and micro loading. The method for producing the phase shift photomask of the instant invention includes two etching processes. The first etching process etches the layer of hard mask, and the second etching process etches opaque material (and anti-reflective layer, if used) and phase shift layers.

Abstract: A chirped Bragg grating is fabricated in an optical fiber by exposing the fiber to a coherent beam of light through a parallel phase mask having a series of progressively chirped segments produced on a lithography tool. The chirped phase mask is fabricated by exposing a photoresist-coated substrate to an image writing element such as an electron beam or a laser according to a set of parameters provided to the lithography tool. The parameters include a basic grating pattern for each segment, a value that defines the expansion or contraction of the grating pattern and an axis location to which the grating pattern is to be written to the substrate. By selecting machine commands that implement these parameters with a minimum throughput overhead, the mask can be produced in a reduced time, and therefore with increased accuracy.

Abstract: An method for creating an image on a photosensitive material with enhanced inside corner resolution using a raster scan exposure system. The photosensitive material may comprise a layer of an unexposed photomask. An energy beam scan is extended by one or more addressable locations beyond the boundaries of the desire pattern at inside corner locations in both X and Y axes. Thus, the image formed in the photosensitive material and, in turn, the attenuator material more accurately reflects the desired image as defined in a data file.

Abstract: A chirped Bragg grating is fabricated in an optical fiber by exposing the fiber to a coherent beam of light through a parallel phase mask having a series of progressively chirped segments produced on a lithography tool. The chirped phase mask is fabricated by exposing a photoresist-coated substrate to an image writing element such as an electron beam or a laser according to a set of parameters provided to the lithography tool. The parameters include a basic grating pattern for each segment, a value that defines the expansion or contraction of the grating pattern and an axis location to which the grating pattern is to be written to the substrate. By selecting machine commands that implement these parameters with a minimum throughput overhead, the mask can be produced in a reduced time, and therefore with increased accuracy.

Abstract: A method for adjusting out of tolerance critical dimensions of an under processed photomask to be within predetermined defined limits after the photosensistive resist material has been removed from the exposed photomask. The method includes measuring the critical dimensions of the opaque material of the under processed photomask after the photosensitive resist material has been removed, and exposing the photomask to electrified plasma gases for removing excess opaque material without degrading the reflectivity of the photomask beyond specified limits.

Abstract: A method for measuring critical dimensions on photomasks, and more specifically to a method for measuring critical dimensions on photomasks using an electrical test structure. The test structure 30 may be comprised of a cross resistor 32 for van der Pauw sheet resistance measurements, a bridge resistor 34, and a split-bridge resistor 36.

Abstract: A fused silica pellicle for use on photomasks having increased durability and improved transmission uniformity and birefringence properties. The pellicle may be secured to the photomask using an adhesive or a slide rail system, or may be held in place using a static charge.

Abstract: A method for creating a photomask which includes a layer of hard mask material the inclusion of which improves the uniformity of critical dimensions on the photomask by minimizing the affect of macro and micro loading. The method for producing the photomask of the instant invention includes two etching processes. The first etching process etches the layer of hard mask, and the second etching process etches the anti-reflective material and opaque material.

Abstract: A step mask having a plurality of test cells and a method for producing the same. Each test cell of the step mask is etched for a different amount of time and therefore has a different etch depth or height. The number of phase shifter layer etch iterations can be conducted on a column-by-column and row-by-row basis to decrease the number of etch iterations.

Abstract: A method for adjusting out of tolerance critical dimensions of an under processed photomask to be within predetermined defined limits after the photosensistive resist material has been removed from the exposed photomask. The method includes measuring the critical dimensions of the opaque material of the under processed photomask after the photosensitive resist material has been removed, and exposing the photomask to electrified plasma gases for removing excess opaque material without degrading the reflectivity of the photomask beyond specified limits.

Abstract: An method for creating an image on a photosensitive material with enhanced inside corner resolution using a raster scan exposure system. The photosensitive material may comprise a layer of an unexposed photomask. An energy beam scan is extended by one or more addressable locations beyond the boundaries of the desire pattern at inside corner locations in both X and Y axes. Thus, the image formed in the photosensitive material and, in turn, the attenuator material more accurately reflects the desired image as defined in a data file.