Abstract: A micro light emitting diode includes an epitaxial structure, a first electrode, and a second electrode. The epitaxial structure has a surface. The first electrode and the second electrode are respectively disposed on the surface of the epitaxial structure. The second electrode is located outside the first electrode, and the second electrode is symmetrically disposed with respect to a geometric center of the epitaxial structure.

Abstract: An alignment structure is provided. The alignment structure includes a substrate, an alignment portion, and an extension portion. The alignment portion is disposed on the substrate. The extension portion is disposed on the substrate. The extension portion at least partially surrounds the alignment portion and is spaced apart from the alignment portion by a void. A side of the extension portion adjacent to the alignment portion and a side of the alignment portion adjacent to the extension portion are conformal to each other.

Abstract: A micro light-emitting device module includes a circuit substrate, a planarization layer and a micro light-emitting device. The planarization layer is disposed on an upper surface of the circuit substrate and has a first surface and a second surface opposite to each other. The second surface is in contact with the upper surface of the circuit substrate. The micro light-emitting device is disposed on the first surface of the planarization layer. A maximum height difference of the second surface of the planarization layer is greater than a thickness of the micro light-emitting device.

Abstract: A structure with micro device includes a substrate, at least one micro device, and at least one holding structure. The micro device includes an epitaxial structure and an overcoat layer. The epitaxial structure has a top surface and a bottom surface opposite to each other and a peripheral surface connecting the top surface and the bottom surface. The overcoat layer includes a contact portion and an extension portion. The contact portion covers the peripheral surface and the bottom surface of the epitaxial structure. The extension portion connects the contact portion and extends in a direction away from the peripheral surface. The holding structure includes at least one connecting portion, at least one sacrificial portion and at least one holding portion. The connecting portion is disposed on the top surface of the epitaxial structure and the extension portion of the overcoat layer. The sacrificial portion connects the connecting portion and the holding portion.

Abstract: An electrode structure includes a first electrode and a second electrode disposed opposite to each other. The first electrode has a first side and a second side. The second side is located between the first side and the second electrode. The first electrode has a maximum vertical length and a minimum vertical length from the first side to the second side, and a ratio of the minimum vertical length to the maximum vertical length is less than 0.8. The second electrode and the first electrode are separated by a first vertical gap and a second vertical gap, and the second vertical gap is greater than the first vertical gap.

Abstract: A display apparatus including a first display surface and a second display surface opposite to each other is provided. The display apparatus includes a reflective display panel and a micro light-emitting diode (LED) panel. The reflective display panel is provided with the first display surface and a visible light transmittance of the reflective display panel is higher than 30%. The micro LED panel is disposed overlapping with the reflective display panel and provided with the second display surface. The micro LED panel includes a drive circuit layer and a plurality of micro LED elements. The drive circuit layer is located between the reflective display panel and the second display surface. The micro LED elements are electrically bonded to the drive circuit layer. A visible light transmittance of the micro LED panel is higher than 50%.

Abstract: A micro light-emitting device display apparatus includes a driving substrate and a plurality of micro light-emitting devices. The micro light-emitting devices are disposed on the driving substrate. The micro light-emitting devices include a plurality of first, second and third micro light-emitting devices. Each of the first, the second and the third micro light-emitting devices respectively has a plurality of first, second, and third light-emitting regions independently controlled. A first light-emitting region of a first micro light-emitting device, a second light-emitting region of a second micro light-emitting device, and a third light-emitting region of a third micro light-emitting device are located in a first pixel region. A first light-emitting region of another first micro light-emitting device, a second light-emitting region of another second micro light-emitting device, and another third light-emitting region of the third micro light-emitting device are located in a second pixel region.

Abstract: A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

Abstract: A micro light-emitting device display apparatus includes a circuit substrate, at least one micro light-emitting device, and at least one conductive bump. The circuit substrate includes at least one pad. The micro light-emitting device is disposed on the circuit substrate and includes at least one electrode. At least one of the pad and the electrode has at least one closed opening. The conductive bump is disposed between the circuit substrate and the micro light-emitting device. The conductive bump extends into the closed opening and defines at least one void with the closed opening. The electrode of the micro light-emitting device is electrically connected to the pad of the circuit substrate with the conductive bump.

Abstract: A tray structure adapted to a deposition apparatus is provided. The tray structure includes a first tray and a second tray, wherein the first tray is disposed on the deposition apparatus for control of temperature and includes a first carrying portion and at least one heat-conducting structure. The first carrying portion is disposed on a top surface of the first tray. The at least one heat-conducting structure is disposed in a recess of the first carrying portion. The second tray is disposed on the first carrying portion and the at least one heat-conducting structure.

Abstract: An alignment structure is provided. The alignment structure includes a substrate, an alignment portion, and an extension portion. The alignment portion is disposed on the substrate. The extension portion is disposed on the substrate. The extension portion at least partially surrounds the alignment portion and is spaced apart from the alignment portion by a void. A side of the extension portion adjacent to the alignment portion and a side of the alignment portion adjacent to the extension portion are conformal to each other.

Abstract: A display apparatus including an electrically-controlled phase retardation layer, a reflective polarizer, a micro light emitting diode panel and a reflective layer is provided. The electrically-controlled phase retardation layer has a first side and a second side opposite to each other. The reflective polarizer is disposed at the first side of the electrically-controlled phase retardation layer. The micro light emitting diode panel is disposed at the second side of the electrically-controlled phase retardation layer and includes a circuit substrate and a plurality of micro light emitting diodes. The reflective layer is disposed between the reflective polarizer and the circuit substrate. An orthogonal projection of the reflective layer on the circuit substrate is not overlapped with orthogonal projections of the micro light emitting diodes on the circuit substrate.

Abstract: A micro light-emitting device includes an epitaxial structure layer, a first-type electrode, a second-type electrode, and a light guide structure. The epitaxial structure layer has a top surface and a bottom surface opposite to each other and a plurality of first grooves located on the top surface. The first-type electrode and the second-type electrode separated from each other are disposed on the epitaxial structure layer and located at the bottom surface. The light guide structure is disposed on the epitaxial structure layer. The light guide structure covers a portion of the top surface and a portion of inner walls of the first grooves to define a plurality of second grooves corresponding to the portion of the first grooves.

Abstract: A micro light emitting diode display panel is provided, which includes a substrate, a plurality of first signal lines, a plurality of transparent conductive patterns, a plurality of metal conductive patterns, a plurality of first pads, a plurality of second pads, and a plurality of micro light emitting diode devices. The first signal lines are disposed on the substrate. The transparent conductive patterns are separately distributed on the substrate. The metal conductive patterns and the transparent conductive patterns are alternately arranged on the substrate. The metal conductive patterns are electrically connected between the transparent conductive patterns. The first pads are respectively connected to the first signal lines. The second pads are electrically connected to the transparent conductive patterns. Each of the micro light emitting diode devices is electrically bonded to one of the first pads and one of the second pads.

Abstract: A micro light emitting diode structure includes a temporary substrate, a plurality of micro light emitting elements, a plurality of light blocking structures, and a connection layer. The micro light emitting elements and the light blocking structures are disposed on the temporary substrate and arranged alternately. Each of the light blocking structures includes a light blocking layer, and a light shielding layer disposed on the light blocking layer. The micro light emitting elements and the light blocking structures are fixed to the temporary substrate by the connection layer. A reflectivity of the light blocking layer is greater than a reflectivity of the connection layer, and a Young's modulus of the light blocking layer is greater than a Young's modulus of the connection layer.

Abstract: A micro LED display device includes a display substrate. The display substrate has a first transfer area and a second transfer area adjacent to each other. Both the first transfer area and the second transfer area include a plurality of pixel areas. The pixel area of the first transfer area includes a first micro light-emitting element arranged in a straight line along a first direction. The pixel area of the second transfer area includes a second micro light-emitting element arranged in another straight line along the first direction. In the first direction, the first micro light-emitting element and the second micro light-emitting element are arranged in a staggered manner. A manufacturing method of a micro LED display device is also provided.

Abstract: A patterned epitaxial substrate includes a substrate and a plurality of patterns. The substrate has a first zone and a second zone surrounding the first zone. The first zone is disposed around a center of the substrate. The patterns and the substrate are integrally formed, and the patterns are disposed on the substrate. The patterns include a plurality of first patterns and a plurality of second patterns. The first patterns are disposed in the first zone. The second patterns are disposed in the second zone. Sizes of the first patterns are different from sizes of the second patterns.

Abstract: A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

Abstract: An epitaxial structure adapted to a semiconductor pickup element is provided. The semiconductor pickup element has at least one guiding structure and provided with a pickup portion. The epitaxial structure includes a semiconductor layer corresponding to the pickup portion and capable of being picked up by the semiconductor pickup element. The epitaxial structure also includes at least one alignment structure disposed on the semiconductor layer and corresponding to the at least one guiding structure, so that the epitaxial structure and the semiconductor pickup element are positioned relative to each other. The number of the at least one alignment structure matches the number of the at least one guiding structure.

Abstract: A micro component structure includes a substrate, at least one micro component and a fixing structure. The micro component is disposed on the substrate, has a spacing from the substrate and has at least one top surface. The fixing structure is disposed on the substrate and includes at least one covering portion and at least one connecting portion. The covering portion is disposed on a portion of the top surface of the micro component, and the connecting portion is connected to an edge of the covering portion and extends onto the substrate. At least one of the covering portion and the connecting portion includes at least one patterned structure.