Patents Assigned to Pulse Engineering, Inc.
  • Patent number: 7994891
    Abstract: Improved inductive electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises an inductive device module comprising N inductors and N+1 core elements. The core elements comprise ferrite core pieces that are optionally identical to one another. These core elements are stacked (e.g., in a longitudinal coaxial arrangement) such that the back of one core element associated with a first inductor provides a magnetic flux path for a second inductor. Form-less (bonded) windings are also optionally used to simplify the manufacture of the device, reduce its cost, and allow it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: August 9, 2011
    Assignee: Pulse Engineering, Inc.
    Inventor: Timothy Craig Wedley
  • Patent number: 7982572
    Abstract: Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: July 19, 2011
    Assignee: Pulse Engineering, Inc.
    Inventors: Christopher P. Schaffer, Aurelio J. Gutierrez, Alan Lindner
  • Patent number: 7959473
    Abstract: An advanced modular plug connector assembly incorporating an insert assembly disposed in the rear portion of the connector housing. In one embodiment, the connector has a plurality of ports in multi-row configuration, and the insert assembly includes a substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. The substrate also interfaces with the conductors of two modular ports of the connector, and is removable from the housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet and 10/100). In yet another embodiment, the connector assembly comprises a plurality of light sources (e.g., LEDs) received within the housing. Methods for manufacturing the aforementioned embodiments are also disclosed.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: June 14, 2011
    Assignee: Pulse Engineering, Inc.
    Inventors: Russell Lee Machado, Victor H. Renteria, Thuyen Dinh
  • Patent number: 7942700
    Abstract: A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.
    Type: Grant
    Filed: May 10, 2010
    Date of Patent: May 17, 2011
    Assignee: Pulse Engineering, Inc.
    Inventors: Aurelio J. Gutierrez, Russell L. Machado, Christopher P. Schaffer, Victor H. Renteria
  • Patent number: 7876189
    Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: January 25, 2011
    Assignee: Pulse Engineering, Inc.
    Inventors: Michael T. Gilmartin, Frederick J. Kiko, Alan H. Benjamin
  • Patent number: 7845984
    Abstract: A connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a multi-port modular jack, and incorporates a PSE controller board disposed in the rear portion of the connector assembly, e.g., outside the connector housing. The PSE controller board controls the power to a powered device and may be adapted to, for example, distinguish whether the device is a short circuit or a network interface card, guarantee the supply of power to selected ports, and prevent cables from transmitting abnormal power. Heat removal features are also optionally utilized to dissipate heat produced by the electronic or signal conditioning components utilized on said multi-port modular jack. In some embodiments, the PSE controller board is also optionally made removable from the jack housing.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: December 7, 2010
    Assignee: Pulse Engineering, Inc.
    Inventors: Christopher P. Schaffer, Thomas Rascon
  • Patent number: 7845975
    Abstract: An electrical connector assembly having shielded cage assembly with a plurality of ports for receiving modules. In one embodiment, the modules comprise SFP (small form-factor pluggable) modules, and the electrical connector assembly is adapted for low-profile applications, thereby optimizing the amount of area and volume occupied by the SFP assembly. In one variant, the SFP modules are pluggable into individual ports, whereby two modules are interconnected to a single header connector interconnected to a motherboard. Methods of manufacturing the connector assembly are also disclosed.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: December 7, 2010
    Assignee: Pulse Engineering, Inc.
    Inventors: Yican Cheng, Tsou Cheng Jung, Mark Jackson
  • Patent number: 7786009
    Abstract: An advanced modular plug connector assembly incorporating an insert assembly disposed in the rear portion of the connector housing. In one embodiment, the connector has a plurality of ports in multi-row configuration, and the insert assembly includes a substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. The substrate also interfaces with the conductors of two modular ports of the connector, and is removable from the housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet and 10/100). In yet another embodiment, the connector assembly comprises a plurality of light sources (e.g., LEDs) received within the housing. Methods for manufacturing the aforementioned embodiments are also disclosed.
    Type: Grant
    Filed: February 15, 2010
    Date of Patent: August 31, 2010
    Assignee: Pulse Engineering, Inc.
    Inventors: Russell Lee Machado, Victor H. Renteria, Thuyen Dinh
  • Patent number: 7724204
    Abstract: Improved electrical connector apparatus including a wireless antenna acting as a transceiver in conjunction with a wireless integrated circuit is disclosed. In one embodiment, the modular connector comprises an RJ45 modular jack, and the wireless transceiver comprises a Bluetooth transceiver transmitting via an integrated antenna disposed on the front face of the Faraday shield at least partly surrounding the modular connector. In another embodiment, an 802.11 transceiver is used. In yet another embodiment, an ultra-wideband (UWB) interface is used.
    Type: Grant
    Filed: October 1, 2007
    Date of Patent: May 25, 2010
    Assignee: Pulse Engineering, Inc.
    Inventors: Petteri Annamaa, Alan H. Benjamin
  • Patent number: 7708602
    Abstract: Connector apparatus and methods providing for “keep-out” functionality against improperly sized plugs or inserts are disclosed. In one embodiment the invention discloses a connector assembly incorporating an integrated keep-out feature associated with the housing. In one variant, the connector assembly comprises a modular jack connector, and the keep-out feature(s) is/are formed substantially within one or more the sidewall(s) of the housing, thereby simplifying its assembly and reducing its cost, as well as conserving on connector interior space. In another embodiment, the keep-out feature comprises an element disposed substantially within a plane parallel to the front face of the connector. Methods for manufacturing and using connectors with integrated keep-out features are also disclosed.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: May 4, 2010
    Assignee: Pulse Engineering, Inc.
    Inventors: Thomas Rascon, Christopher P. Schaffer, Gary L. Hurd
  • Patent number: 7661994
    Abstract: An advanced modular plug connector assembly incorporating an insert assembly disposed in the rear portion of the connector housing. In one embodiment, the connector has a plurality of ports in multi-row configuration, and the insert assembly includes a substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. The substrate also interfaces with the conductors of two modular ports of the connector, and is removable from the housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet and 10/100). In yet another embodiment, the connector assembly comprises a plurality of light sources (e.g., LEDs) received within the housing. Methods for manufacturing the aforementioned embodiments are also disclosed.
    Type: Grant
    Filed: May 5, 2008
    Date of Patent: February 16, 2010
    Assignee: Pulse Engineering, Inc.
    Inventors: Russell Lee Machado, Victor H. Renteria, Thuyen Dinh
  • Patent number: 7612641
    Abstract: A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer, inductor, or mixer is required. In one exemplary embodiment, the device includes a “binocular” ferrite core comprising a plurality of core apertures and windings. The core is shaped with one or more channels which are at least partly plated (metallized) so as to allow bonding of the winding terminations directly to the core. The placement of these plated areas allows simplified surface mounting. The plated areas also obviate a termination header, thereby simplifying the manufacture of the device and reducing its cost. Methods for manufacturing the device are also disclosed.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: November 3, 2009
    Assignee: Pulse Engineering, Inc.
    Inventors: Henry Jean, Hamlet Abedmamoore, Peter J. Gutierrez, III, David Thanh Phan
  • Patent number: 7598837
    Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.
    Type: Grant
    Filed: July 6, 2004
    Date of Patent: October 6, 2009
    Assignee: Pulse Engineering, Inc.
    Inventors: Michael T. Gilmartin, Frederick J. Kiko, Alan H. Benjamin
  • Patent number: 7598839
    Abstract: Improved inductive electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises an inductive device module comprising N inductors and N+1 core elements. The core elements comprise ferrite core pieces that are optionally identical to one another. These core elements are stacked (e.g., in a longitudinal coaxial arrangement) such that the back of one core element associated with a first inductor provides a magnetic flux path for a second inductor. Form-less (bonded) windings are also optionally used to simplify the manufacture of the device, reduce its cost, and allow it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB.
    Type: Grant
    Filed: August 12, 2005
    Date of Patent: October 6, 2009
    Assignee: Pulse Engineering, Inc.
    Inventor: Timothy Craig Wedley
  • Patent number: 7567163
    Abstract: A low cost, low profile, small size and high performance inductive device for use in, e.g., electronic circuits. In one exemplary embodiment, the device includes a ferrite core comprising multiple inductors and optimized for electrical and magnetic performance. Improvements in performance are obtained by, inter alia, control of the properties of the gap region(s) as well as placement of the windings relative to the gap. The magnetic path properties of the inductors at the ends of the device are also optionally controllable so as to provide precise matching of inductances. Optionally, the device is also self-leaded, thereby simplifying its installation and mating to a parent device (e.g., PCB). Methods for manufacturing and utilizing the device are also disclosed.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: July 28, 2009
    Assignee: Pulse Engineering, Inc.
    Inventors: Majid Dadafshar, Francisco Michel
  • Patent number: 7524206
    Abstract: An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a single port modular jack, and incorporates an insert assembly disposed in the rear portion of the connector housing. The insert assembly includes first and second substrates and a cavity adapted to receive one or more electronic or signal conditioning components. Heat removal features are also utilized within the jack to effectively dissipate heat produced by the electronic or signal conditioning components. The insert assembly is also optionally made removable from the jack housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet, 10/100, etc.). Methods for manufacturing the aforementioned embodiments are also disclosed.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: April 28, 2009
    Assignee: Pulse Engineering, Inc.
    Inventors: Aurelio J. Gutierrez, Victor H. Renteria, Russell L. Machado, Chris Schaffer, Henry Hinrichs
  • Patent number: 7489225
    Abstract: A low cost, low profile and high performance inductive device for use in, e.g., electronic circuits. In one exemplary embodiment, the device includes a four-legged ferrite core optimized for fitting with four or more windings, thereby providing four close-tolerance inductors. Optionally, the device is also self-leaded, thereby simplifying its installation and mating to a parent device (e.g., PCB). In another embodiment, multiple windings per leg are provided. In yet another embodiment, the device has only to opposed legs, thereby reducing footprint. Methods for manufacturing and utilizing the device are also disclosed.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: February 10, 2009
    Assignee: Pulse Engineering, Inc.
    Inventor: Majid Dadafshar
  • Patent number: 7367851
    Abstract: An advanced modular plug connector assembly incorporating an insert assembly disposed in the rear portion of the connector housing. In one embodiment, the connector has a plurality of ports in multi-row configuration, and the insert assembly includes a substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. The substrate also interfaces with the conductors of two modular ports of the connector, and is removable from the housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet and 10/100). In yet another embodiment, the connector assembly comprises a plurality of light sources (e.g., LEDs) received within the housing. Methods for manufacturing the aforementioned embodiments are also disclosed.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: May 6, 2008
    Assignee: Pulse Engineering, Inc
    Inventors: Russell Lee Machado, Victor H. Renteria, Thuyen Dinh
  • Patent number: RE41145
    Abstract: An impedance blocking filter circuit is provided for use in telecommunication systems for interconnecting between incoming telephone lines and customer's terminal equipment so as to unconditionally block impedances above 20 KHz a desired frequency range due to the customer's terminal equipment from an ADSL a DSL network unit and/or home networking interface unit. The filter circuit includes first, second, and third inductors connected in series between a first input terminal and a first common point. A first resistor has its one end connected also to the first common point and its other end connected to a first output terminal. Fourth, fifth and sixth inductors are connected in series between a second input terminal and a second common point. A second resistor has its one end also connected to the second common point and its other end connected to a second output terminal. A capacitor has its ends connected across the first and second common points.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: February 23, 2010
    Assignee: Pulse Engineering, Inc.
    Inventor: Frederick J. Kiko
  • Patent number: RE41164
    Abstract: An impedance blocking filter circuit is provided for use in telecommunication systems for interconnecting between incoming telephone lines and customer's terminal equipment so as to unconditionally block impedances above 20 KHz a desired frequency range due to the customer's terminal equipment from an ADSL a DSL network unit and/or home networking interface unit. The filter circuit includes first, second, and third inductors connected in series between a first input terminal and a first common point. A first resistor has its one end connected also to the first common point and its other end connected to a first output terminal. Fourth, fifth and sixth inductors are connected in series between a second input terminal and a second common point. A second resistor has its one end also connected to the second common point and its other end connected to a second output terminal. A capacitor has its ends connected across the first and second common points.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: March 16, 2010
    Assignee: Pulse Engineering, Inc.
    Inventor: Frederick J. Kiko