Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component are routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices.

Abstract: A connector assembly (1) has a lower row of side-by-side terminal arrays (28) having a common dielectric carrier (30), and an upper row of side-by side terminal arrays (34) having a common dielectric carrier (3), each of the carriers (30) has guide sections (40) at opposite lateral ends, the carriers (30) are installed one behind the other, with the guide sections (40) being guided along common guides (19) of the housing (4), and the housing (4) has a resilient latch arm (20) that extends between the side-by-side terminal arrays (28 and 34), and holds the carriers (30) one behind the other.

Abstract: A multi-layer and multi-functioning printed circuit board (PCB) defines a magnetic component formed using planar technology and multiple PCBs, each having four or six layers and each including a single winding. One set of windings is configured as an inductor and a second set of windings is configured as a transformer. The PCBs are stacked in an offset arrangement such that pins connecting one set of windings on a PCB or PCBs to a main circuit board do not penetrate the PCB or PCBs including another set of windings. The invention is configured to function both as an inductor and a transformer.

Abstract: A multi-piece microelectronic connector is disclosed which permits rapid assembly of the connector components during manufacture. The connector is comprised of an insert and a connector body. The insert has a cavity configured to receive at least one electrical component. The insert also has leads for electrically connecting the electrical component with a modular plug. The connector body has a front, a back and a dividing wall separating the front and the back. The front of the connector body has a cavity for receiving a modular plug therein. The back has a cavity for receiving the insert therein. The dividing wall has a set of openings providing communication between the cavity in the front and the cavity in the back. The set of leads of the insert are configured to protrude through the set of openings in the dividing wall and into the cavity in the front of the connector body.

Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices.

Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component are routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices.

Abstract: A microelectronic connector having indicating devices which are located external to the connector body. In one embodiment, one or more channels are formed in the exterior of the connector body which receive the devices and their leads. The channels are formed generally on the connector surface proximate to the circuit board to which the connector leads are being mated, thereby minimizing the length of the leads. The channels are designed to retain the leads of the indicating devices in a substantially fixed relationship to the connector body, thereby obviating the need for a cavity or recess for the indicating device, or apertures leading from the cavity/recess to the exterior of the package. A noise shield may further be installed on the connector body which helps retain the aforementioned indicating devices within external channels formed in the connector body.

Abstract: An advanced microelectronic component package incorporating a specially shaped base element which holds and electrically separates the individual conductors associated with the microelectronic component(s) so that the individual conductors may be bonded to external package leads and other conductors within the package. In a first embodiment, jacketed, insulated wire is used as one winding of a toroidal transformer, while unjacketed insulated wire is used as another winding. The jacketing is stripped from the first winding and the exposed conductors are routed into channels along the sides of the base element. The unjacketed conductors are also routed into the same channels, where both conductors are bonded to the external package leads. Raised elements along the sides of the base provide the required electrical separation between the conductors during both manufacture and operation. A method of manufacturing the improved microelectronic package is also disclosed.

Abstract: A modular microelectronic connector having an electrical component or component package molded directly within the connector body and preformed electrical leads which facilitate rapid and simplified connector assembly. In a first embodiment, the component package is molded directly within a one-piece connector body having a series of grooves on the exterior of the body, and the elongated leads of the package are deformed so as to extend into place within the grooves and ultimately within a modular plug receptacle so as to mate with the contacts of the plug. In a second embodiment, a component package having substantially elongated leads is molded within a rear body element or trailer which is then mated with a front body element (sleeve) having a modular plug receptacle. The leads are inserted through a series of apertures in the sleeve and deformed so as to extend into the cavity of the receptacle to form the electrical contacts for the plug.

Abstract: A monolithic inductor (10) comprises an elongated substrate having opposite distal ends (14) and (16), each end having an end cap extending from the opposite ends to support the substrate (12) in spaced relation from a PC board, the end caps being formed with non-mounting areas and a deflection area for preventing the substrate resting on the non-mounting area, a substantially steep side wall (16) on the substrate side of the end cap (14) at the non-mounting area, and an inclined ramp extending up to a top of the end cap on the substrate side substantially opposite the non-mounting area, an electrically conductive soldering band (30) extending partially around each end cap, each soldering band having a gap (34) at the non-mounting area for thereby reducing parasitic conduction in the band (30), and an electrically conductive layer formed on the substrate in a helical path extending between the opposite ends and in electrical contact with the conductive soldering bands (30) at the ramps (120).

Abstract: An advanced microelectronic component package incorporating a specially shaped base element which holds and electrically separates the individual conductors associated with the microelectronic component(s) so that the individual conductors may be bonded to external package leads and other conductors within the package. In a first embodiment, jacketed, insulated wire is used as one winding of a toroidal transformer, while unjacketed insulated wire is used as another winding. The jacketing is stripped from the first winding and the exposed conductors are routed into channels along the sides of the base element. The unjacketed conductors are also routed into the same channels, where both conductors are bonded to the external package leads. Raised elements along the sides of the base provide the required electrical separation between the conductors during both manufacture and operation. A method of manufacturing the improved microelectronic package is also disclosed.

Abstract: A connector assembly (1) has a lower row of side-by-side terminal arrays (28) having a common dielectric carrier (30), and an upper row of side-by side terminal arrays (34) having a common dielectric carrier (3), each of the carriers (30) has guide sections (40) at opposite lateral ends, the carriers (30) are installed one behind the other, with the guide sections (40) being guided along common guides (19) of the housing (4), and the housing (4) has a resilient latch arm (20) that extends between the side-by-side terminal arrays (28 and 34), and holds the carriers (30) one behind the other.

Abstract: A simplified modular microelectronic connector having an internal component cavity and integral crimped leads, and a method of manufacturing same. One or more electrical components are located within the cavity, with their conductors being routed to the crimp leads integral to the connector body. The conductor terminations are completed via crimping or other bonding techniques. The crimped leads are deformed into the desired position to minimize connector size, and the component is sealed within the cavity using an epoxy or other electrically non-conductive material. The connector body may be further mounted to a multi-connector carrier assembly, which utilizes one or more pins to secure the individual connectors to the carrier so that they may be arranged in both vertically-stacked and horizontal (“side-by-side”) configurations, and each connector may be removed separately and replaced in the event of component failure.

Abstract: The present invention is a modular jack assembly which includes an outer insulative housing having top and bottom walls and opposed lateral walls while defining an interior section. This housing also has front and rear open ends. This assembly also includes an insulative insert having a top section, an upper side and rear section having a base side and a recess. This jack is positioned so that the upper side of its top section is adjacent to top side of the insulative housing such that its terminal end extends into the interior section of the insulative housing and the rear section at least partially covers the rear open end of the insulative housing. This assembly also includes an electronic component mounted in the rear section of the insulative insert. A conductor is mounted in the electrical insert.

Abstract: A multi-piece, low profile microelectronic connector having a simplified, "snap-together" construction requiring no lead carrier. One or more electrical components are located within a rear connector body element, which mates with a front connector body element upon assembly. The leads of the rear body element are shaped so as to cooperate with a series of contour elements ("bumps" in one embodiment) formed inside the plug receptacle cavity in the front connector body element. The shape of the leads and bumps provide a continuous normal force on the distal end of the leads, thereby maintaining them in contact with the corresponding leads of the modular plug. In a second aspect of the invention, a series of mounting pins are provided to permit tandem mounting of multiple connectors to an external device using a minimum number of mounting holes, and maintaining a minimum lateral connector width. A method of manufacturing and assembling the aforementioned connector is also disclosed.

Abstract: A monolithic inductor (10) comprises an elongated substrate having opposite distal ends (14) and (16), each end having an end cap extending from the opposite ends to support the substrate (12) in spaced relation from a PC board, the end caps being formed with non-mounting areas and a deflection area for preventing the substrate resting on the non-mounting area, a substantially steep side wall (16) on the substrate side of the end cap (14) at the non-mounting area, and an inclined ramp extending up to a top of the end cap on the substrate side substantially opposite the non-mounting area, an electrically conductive soldering band (30) extending partially around each end cap, each soldering band having a gap (34) at the non-mounting area for thereby reducing parasitic conduction in the band (30), and an electrically conductive layer formed on the substrate in a helical path extending between the opposite ends and in electrical contact with the conductive soldering bands (30) at the ramps (120).

Abstract: A monolithic inductor comprises an elongated substrate having opposite distal ends and, each end having an end cap extending radially from the respective end to support the substrate in spaced relation from a PC board, each end cap having a plurality of intersecting planar surfaces defining corners, an electrically conductive layer forming a winding on the substrate and extending between the opposite ends to provide a winding, and an electrically conductive soldering pad extending partially around at least some of the corners of said end caps at each end of the substrate in electrical contact with the conductive layer, each soldering pad providing a terminal on each of the intersecting planar surfaces.

Abstract: A connector module for mounting on a circuit board includes a housing and at least one plug-receiving opening for receiving an RJ-45 or other similar jack. Each plug-receiving opening includes contact portions that make electrical contact with individual conductors, e.g., twisted pair conductors, connected to the RJ-45 jack. A plurality of connection pins protrude from a bottom surface of the housing and facilitate mounting of the modular connector onto the circuit board. Protection/filtering circuitry, located within vertical space inside of the housing so as to reside adjacent the connection pins, electrically couples and minimizes the electrical distance between the contact portions associated with each plug-receiving opening and the plurality of connection pins. The protection/filtering circuitry includes at least one ring-shaped ferrite core.

Abstract: A trimmable inductor, comprises a supporting substrate (12) having spaced apart lead terminals, a coil (20) defined by an electrically conductive member mounted on the substrate in a continuous path of multiple turns forming a winding about an axis and extending between the lead terminals, and an electric conductive shorting member (30) extending and electrically connected between one or more turns (20) and (22) a terminal of the coil to enable selective inclusion and elimination of at least part of one of the turns of the coil.

Abstract: A microelectronic component carrier package and method of its manufacture. A non-conducting component carrier having vertical risers and guide channels permits the rapid and accurate routing of microelectronic component leads with respect to the leadframe. Specially shaped perforations in the leadframe adjacent to and aligned with the guide channels receive the leads, strip away the necessary amount of insulation, and sever the leads to the proper length in one manufacturing process step. The leads are joined to the leadframe by an interference fit, conventional bonding technique (such as solder or thermal compression bonding), or other techniques. The perforations further provide for stress relief of the leads in the assembled package, and permit the joints between the leadframe and leads to reside outside of the package, thereby minimizing the overall volume of the package.