Patents Assigned to Pulse Engineering, Inc.
  • Patent number: 5973932
    Abstract: A printed circuit assembly comprises a module with a component secured to a pad on a dielectric substrate using a tin-free metal composition. A terminal of the module is coupled to a second printed circuit board with a solder composition of at least approximately 40% tin. The tin-free solder composition may comprise approximately 90% lead and 10% antimony.
    Type: Grant
    Filed: February 14, 1997
    Date of Patent: October 26, 1999
    Assignee: Pulse Engineering, Inc.
    Inventor: Tuan D. Nguyen
  • Patent number: 5971805
    Abstract: The present invention is a modular jack assembly which includes an outer insulative housing having top and bottom walls and opposed lateral walls while defining an interior section. This housing also has front and rear open ends. This assembly also includes an insulative insert having a top section, an upper side and a rear section having a base side and a recess. This jack is positioned so that the upper side of its top section is adjacent to top side of the insulative housing such that its terminal end extends into the interior section of the insulative housing and the rear section at least partially covers the rear open end of the insulative housing. This assembly also includes an electronic component mounted in the recess in the rear section of the insulative insert. A conductor is mounted in the electrical insert.
    Type: Grant
    Filed: May 27, 1997
    Date of Patent: October 26, 1999
    Assignees: Berg Technology, Inc., Pulse Engineering, Inc.
    Inventors: Yakov Belopolsky, Robert E. Marshall, James A. Somerville, Gary J. Oleynick, Lee W. Potteiger, John M. Spickler, Ronald A. Shutter, Miguel A. Contreras
  • Patent number: 5952907
    Abstract: A blind hole pot core transformer comprised of a base member having a toroidal channel with a central post and a cover member also having a toroidal channel with a central post. A bobbin winding is positioned within a cavity defined by the toroidal channels of the base and cover members with a core comprised of the central posts of the base and cover member positioned within an opening in the bobbin winding. A compressible alignment member is positioned within an opening formed on outer mating surfaces of the central posts of both the base and cover members to retain the base and cover members in a desired orientation with respect to each other. The compressible alignment member has a cross-sectional area that is greater than the openings in the base and cover members so that any gap between the alignment member and the inner walls of at least one of the openings is eliminated thereby facilitating alignment between the central posts comprising the core of the device.
    Type: Grant
    Filed: April 7, 1997
    Date of Patent: September 14, 1999
    Assignee: Pulse Engineering, Inc.
    Inventors: Michael D. McWilliams, Russell L. Machado
  • Patent number: 5675121
    Abstract: An electronic component mounting holder for surface mounting of an electronic component having a plurality of tape leads, includes a non-conducting three dimensional rectangular frame having vertical peripheral walls formed of nonconducting material for receiving an electronic component having a plurality of tape leads, the peripheral walls having a top peripheral edge and a bottom peripheral edge, a support ledge extending inward from inner surface of said peripheral wall for supporting an electrical component, a coil formed of foil windings having leads formed by extensions of said foil windings, a plurality of tape lead receiving areas formed in at least two sides of said bottom peripheral edge, said receiving areas each positioning a tape lead for surface bonding to a conductor on a PC board, a plurality of lead receiving recesses formed in corresponding sides of said top peripheral edge for receiving an outermost end of a tape lead, and a retainer for mounting in engagement with latch means in said frame
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: October 7, 1997
    Assignee: Pulse Engineering, Inc.
    Inventor: Russell L. Machado
  • Patent number: 5640763
    Abstract: A panel of a plurality of circuits to be separated into individual circuits, comprises a panel of conductive foil and insulator laminate formed into a plurality of separate circuits, a shear trace disposed between adjacent circuits, and a pull tab at one end of each of said the shear traces. In the depanelizing operation, the shear traces are pulled for cutting through the insulator to remove the corresponding circuits from the panel.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: June 24, 1997
    Assignee: Pulse Engineering, Inc.
    Inventor: Paul M. Lindberg
  • Patent number: 5534838
    Abstract: A low profile transformer comprises a support member for supporting a coil winding, a first elongated conductive tape forming at least one conductor having lead terminals formed integral therewith formed into a first coil of multiple turns, a second elongated conductive tape having lead terminals formed integral therewith forming at least one conductor formed into a second coil of at least one turn interleaved with the first coil, and each terminal lead of each of the tapes extending from the support member and having a portion disposed at a base of the transformer for engagement and surface bonding to a PC board.
    Type: Grant
    Filed: August 5, 1993
    Date of Patent: July 9, 1996
    Assignee: Pulse Engineering, Inc.
    Inventor: Paul M. Lindberg
  • Patent number: 5455741
    Abstract: An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element mounted in the cavity and having a plurality of leads, a plurality of the leads extending via the through holes from the element to the second surface, and a plurality of lead terminal recesses formed at the second surface for for receiving and forming terminal ends and connections of the leads to the circuit on the second surface.
    Type: Grant
    Filed: October 26, 1993
    Date of Patent: October 3, 1995
    Assignee: Pulse Engineering, Inc.
    Inventors: Ka K. Wai, Moin Ahmad, Aurelio J. Gutierrez, James D. Lint
  • Patent number: 5351167
    Abstract: An electronic component adapted for surface mounting on a PC board has an elongate bobbin made of a dielectric material. A coil of wire is wound about the winding support surface of the bobbin. The coil has a pair of lead terminations which are wrapped around a pair of T-shaped lead termination support members extending from the same side of the bobbin. When the bobbin rests on top of a PC board, the support members position the wrapped lead terminations slightly above solder pads.
    Type: Grant
    Filed: May 17, 1993
    Date of Patent: September 27, 1994
    Assignee: Pulse Engineering, Inc.
    Inventors: Ka K. Wai, Aurelio J. Gutierrez
  • Patent number: 5309130
    Abstract: A self leaded holder for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, lead ports extending from the cavity through the sides, an inductance coil mounted in the cavity, and a lead extending from the coil via the lead ports to and wound a partial turn around each of the lead support members and disposed for surface bonding to a PC board.
    Type: Grant
    Filed: October 26, 1992
    Date of Patent: May 3, 1994
    Assignee: Pulse Engineering, Inc.
    Inventor: James D. Lint
  • Patent number: 5262745
    Abstract: A bobbin for surface mounting on a printed circuit board comprises an elongated support body constructed of a non-conducting material having a plurality of curved winding support areas bound on each side by a generally rectangular mounting member having recesses in opposed surfaces thereof, and a combined mounting and lead terminal member having opposed gripping fingers engaging the recesses, one of the fingers having a free end extending outward therefrom for conductively connecting with a lead.
    Type: Grant
    Filed: January 27, 1992
    Date of Patent: November 16, 1993
    Assignee: Pulse Engineering, Inc.
    Inventor: Aurelio J. Gutierrez
  • Patent number: 5253145
    Abstract: A compliant lead structure for mounting a circuit element to a PC board comprises a support body for supporting a circuit element, a plurality of elongated compliant cylindrical conductive lead members secured at an inner end to the support body and extending outward from the support body substantially perpendicular to a mounting plane of a PC board to which the support body is to be mounted and to a position for surface bonding to a PC board, the lead members having an elongated unrestricted section between the inner end and the outer end for enabling relative movement between the support body and a PC board to which the lead member is bonded, and a lead wire extends from a circuit element on the support body and connected to the lead member.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: October 12, 1993
    Assignee: Pulse Engineering, Inc.
    Inventor: James D. Lint
  • Patent number: 5212345
    Abstract: A self leaded header for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of feet extending downward from the base for supporting the same on a PC board, a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, an inductance coil mounted in the cavity, and a lead extending from the coil to and wound multiple turns around each of the lead support members and disposed for surface bonding to a PC board.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: May 18, 1993
    Assignee: Pulse Engineering, Inc.
    Inventor: Aurelio J. Gutierrez
  • Patent number: 5032953
    Abstract: A single in-line package adapted for surface mounting to a printed circuit board comprises an electronic component, a plurality of leads and a specially configured housing that encloses and protects the electronic component. The outer ends of the leads extend adjacent a tapered lower edge of the housing. The housing further has projections for engaging the upper surface of a printed circuit board to maintain the housing in a stable upright orientation with the outer ends of the leads in physical contact with corresponding solder pads on the printed circuit board during solder re-flow. The tapered edge of the housing is configured to permit subsequent inspection of a plurality of resulting solder joints for acceptable whetting.
    Type: Grant
    Filed: August 15, 1990
    Date of Patent: July 16, 1991
    Assignee: Pulse Engineering, Inc.
    Inventors: Robert L. Carl, Ka K. Wai, Jose L. V. Ortega
  • Patent number: 5015981
    Abstract: An electronic device having a plurality of leads comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity therein and a plurality of lead slots extending from the cavity to a base of the holder, an electronic element mounted in the cavity and having a plurality of leads extending therefrom, a plurality of the leads extending within the slots from the element to the base, and a plurality of lead terminals mounted on the holder and each having one end extending into one of the slots into conducting engagement with a lead and a free end extending outward therefrom.
    Type: Grant
    Filed: August 21, 1990
    Date of Patent: May 14, 1991
    Assignee: Pulse Engineering, Inc.
    Inventors: James D. Lint, Aurelio J. Gutierrez
  • Patent number: 3985310
    Abstract: A method for winding wire strands onto toroidal cores in which a length of wire is fed along a radially inwardly facing channel in an arcular guide to form a loop. As the leading end of the wire completes this loop it hugs the channel's radial boundary to form a second loop radially inside the first as the wire feeding continues. A gap is provided in the radial boundary of the channel for receiving the core with the core's central aperture in this gap so as each loop is formed the wire in that loop passes through the core. The upper and lower boundaries of the channel are spaced apart so as to maintain the loops in a single concentric layer around the guide and through the core. When enough wire has been fed the feeding is stopped, but the movement of the loops around the guide continues and winds (tightens) at least one new turn of wire onto the core for every complete circulation of the loops around the guide.
    Type: Grant
    Filed: October 7, 1974
    Date of Patent: October 12, 1976
    Assignee: Pulse Engineering Inc.
    Inventors: Bryan Kent, Duane Kent