Electronics component package element

- Pulse Engineering, Inc.
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Description

FIG. 1 is a side elevation view of a first embodiment of an electronics component package, showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevation view thereof;

FIG. 5 is a side elevation view of a second embodiment of an electronics component package, showing our new design;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a front plan view thereof.

Claims

The ornamental design of an electronics components package element, as shown and described herein.

Referenced Cited
U.S. Patent Documents
3638149 January 1972 Bopp et al.
4292614 September 29, 1981 Ono et al.
4507633 March 26, 1985 Minks
4924213 May 8, 1990 Decho et al.
5438307 August 1, 1995 Chou
5801930 September 1, 1998 Dittmann
6549108 April 15, 2003 Fausch
Other references
  • Allied Electronics, 1990,pp. 402 (upper left), 615 (upper right and middle left).
Patent History
Patent number: D487255
Type: Grant
Filed: Mar 10, 2003
Date of Patent: Mar 2, 2004
Assignee: Pulse Engineering, Inc. (San Diego, CA)
Inventors: Tung Dang (San Marcos, CA), Glen Alan Cotant (Ramona, CA)
Primary Examiner: Nanda Bondade
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Gazdzinski & Associates
Application Number: 29/177,596
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;