Abstract: The present invention in one embodiment provides a memory device including a first electrode; a second electrode; and a memory cell positioned between the first electrode and the second electrode, the memory cell including a core of a first phase change material and a cladding of a second phase change material, wherein the first phase change material has a lower crystallization temperature than the second phase change material. The present invention also provides methods of forming the above described memory device.

Abstract: An integrated circuit includes a substrate including isolation regions, a first conductive line formed in the substrate between isolation regions, and a vertical diode formed in the substrate. The integrated circuit includes a contact coupled to the vertical diode and a memory element coupled to the contact. The first conductive line provides a portion of the vertical diode.

Abstract: An integrated circuit with a substrate with a lower and an upper surface is described. A via extends between the upper and the lower surface of the substrate. The via contains a conductive filling material that comprises carbon.

Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.

Abstract: A common Delay Locked Loop (DLL) circuit and/or voltage generator circuit is provided in, or associated with. a memory interface interposed between a memory controller and a plurality of memory components. Corresponding circuits in the memory components are disabled and/or bypassed, or the memory components are manufactured without the circuits. Both the DLL circuit and voltage generator draw current, which is multiplied by the number of memory components in a memory system. By operating a single DLL circuit and/or voltage generator in or associated with the memory interface, that generates a read clock signal and/or various voltage levels, respectively, for all memory components in the memory system, power consumption may be significantly reduced.

Abstract: An integrated circuit includes a first SONOS memory cell and a second SONOS memory cell. The second memory cell is stacked on the first memory cell.

Abstract: Embodiments of the invention relate to a control circuit comprising a clock signal connection for receiving a system clock signal, a write signal connection for receiving a write signal, and a write control circuit for executing write commands, wherein the write control circuit is designed to start executing a write command when a write signal is applied to the write signal connection during an edge of the system clock signal.

Abstract: An integrated circuit includes a memory cell with a resistance changing memory element. The resistance changing memory element includes a first electrode, a second electrode, and a resistivity changing material disposed between the first and second electrodes, where the resistivity changing material is configured to change resistive states in response to application of a voltage or current to the first and second electrodes. In addition, at least one of the first electrode and the second electrode comprises an insulator material including a self-assembled electrically conductive element formed within the insulator material. The self-assembled electrically conductive element formed within the insulator material remains stable throughout the operation of switching the resistivity changing material to different resistive states.

Abstract: A memory module system, a method for operating a memory module system, and an adapter card is disclosed. One embodiment provides last one memory buffer device, and a first plug mechanism for connecting the adapter card to a memory module system, and a second plug mechanism for connecting the adapter card to a memory module.

Abstract: An embodiment of a circuit comprises an output buffer, a data interface which is at least in a position to transmit data, the data interface being coupled to an output of the output buffer, a command/address interface coupled to an input of the output buffer, a memory core coupled to the input of the output buffer, and a controller circuit configured to cause data stored within the output buffer to be output to the data interface, further configured to cause data stored within the memory core to be output to the input of the output buffer, so that the data is stored within the output buffer, and further configured to cause provision of data received at the command/address interface to the input of the output buffer, so that the data is stored within the output buffer.

Abstract: An integrated circuit includes a substrate including isolation regions, a first conductive line formed in the substrate between isolation regions, and a vertical diode formed in the substrate. The integrated circuit includes a contact coupled to the vertical diode and a memory element coupled to the contact. The first conductive line provides a portion of the vertical diode.

Abstract: A circuit is disclosed. The circuit includes at least one nanostructure and a carbon interconnect formed by a substantially carbon layer, wherein the nanostructure and the carbon interconnect are directly coupled to one another.

Abstract: An integrated circuit and method for manufacturing an integrated circuit are described. In one embodiment, the integrated circuit includes a memory cell that includes a resistivity changing memory element. The resistivity changing memory element is electrically coupled to a select transistor that includes a FinFET including a source, a drain, and a fin structure formed above a surface of a substrate between the source and the drain. The fin structure includes a channel area extending in a direction substantially parallel to the surface of the substrate, and a dielectric layer formed around at least a portion of the channel area such that an effective channel width of the select transistor depends at least in part on a height of the fin structure.

Abstract: The present invention, in one embodiment, provides a method of producing a PN junction the method including at least the steps of providing a Si-containing substrate; forming an insulating layer on the Si-containing substrate; forming a via through the insulating layer to expose at least a portion of the Si-containing substrate; forming a seed layer of the exposed portion of the Si containing substrate; forming amorphous Si on at least the seed layer; converting at least a portion of the amorphous Si to provide crystalline Si; and forming a first dopant region abutting a second dopant region in the crystalline Si.

Abstract: A photovoltaic device is described. The photovoltaic device comprises an organic-based antireflection layer. A method of making a photovoltaic device is also described.

Abstract: The invention relates to a method for reading data from a semiconductor memory, said method comprising the following steps in this order: providing at least one first memory bank and at least one shadow memory bank which are each designed to store a multiplicity of binary data items, the same data as in the first memory bank being stored in the shadow memory bank; receiving a command for reading data which are to be read from the first memory bank; utilizing a state checking device of the semiconductor memory to check whether the first memory bank is in an open memory bank state, and, if the first memory bank is in the open memory bank state, reading the data which are to be read from the at least one shadow memory bank, and, if the first memory bank is not in the open memory bank state, reading the data which are to be read from the first memory bank, the open memory state being such a memory state of the memory bank which does not allow the data which are to be read to be read without previously closing an

Abstract: A description is given of a method for charge reversal of a circuit part of an integrated circuit from a first electrical potential to a second electrical potential of a first voltage network. In this case, the circuit part is connected to the first voltage network for charge reversal. Furthermore, the circuit part is connected to a second voltage network for charge reversal, said second voltage network providing a third electrical potential between the first and the second electrical potential. The circuit part is automatically isolated from the second voltage network before its electrical potential reaches the second electrical potential.

Abstract: An integrated circuit according to an embodiment of the invention includes a substrate having a first cell and a second cell, the first and the second cells being adapted to perform a substantially same functionality. Corresponding functional structures of the first and the second cell are electrically connected, at different locations inside the standard cells, to information carrying signal interconnection lines, wherein the functional structures are adapted to serve as an information carrying signal input or as an information carrying signal output.

Abstract: Integrated circuits including a buried wiring lien. One embodiment provides a field effect transistor including a first active area and a gate electrode buried below a main surface of a semiconductor substrate. A gate wiring line may be buried below the main surface and a section of the gate wiring line may form the gate electrode. Above the gate wiring line, a buried contact structure is formed that is adjacent to and in direct contact with the first or a second active area.

Abstract: Embodiments of the invention are related to methods, systems, and articles of manufacture for transferring data between two devices using an interconnect bus. On each conductive line of the bus, a bit representing a first logic state is transferred if a current bit is the same as an immediately previously transmitted bit. If the current bit is different from the immediately previously transmitted bit, then a bit representing a second logic state is transferred.