Abstract: An embodiment of a circuit comprises an output buffer, a data interface which is at least in a position to transmit data, the data interface being coupled to an output of the output buffer, a command/address interface coupled to an input of the output buffer, a memory core coupled to the input of the output buffer, and a controller circuit configured to cause data stored within the output buffer to be output to the data interface, further configured to cause data stored within the memory core to be output to the input of the output buffer, so that the data is stored within the output buffer, and further configured to cause provision of data received at the command/address interface to the input of the output buffer, so that the data is stored within the output buffer.
Abstract: One embodiment of the present invention provides a method for the deposition of a Carbon containing layer on a Silicon surface wherein a (i) substantially Silicon-oxide-free or reduced oxide interface results between Silicon and the Carbon containing layer during the deposition. In another embodiment, the present invention provides a method for deposition of a Carbon containing layer wherein the deposition process is substantially soot (particle)-free or reduction of soot.
Type:
Grant
Filed:
December 16, 2005
Date of Patent:
July 10, 2012
Assignee:
Qimonda AG
Inventors:
Maik Liebau, Franz Kreupl, Georg Duesberg, Eugen Unger
Abstract: An embodiment of a circuit includes an output buffer, a data interface which is at least in a position to transmit data, the data interface being coupled to an output of the output buffer, a command/address interface coupled to an input of the output buffer, a memory core coupled to the input of the output buffer, and a controller circuit configured to cause data stored within the output buffer to be output to the data interface, further configured to cause data stored within the memory core to be output to the input of the output buffer, so that the data is stored within the output buffer, and further configured to cause provision of data received at the command/address interface to the input of the output buffer, so that the data is stored within the output buffer.
Abstract: An integrated circuit includes a first bit line and a resistance changing memory element coupled to the first bit line. The integrated circuit includes a second bit line and a heater coupled to the second bit line. The integrated circuit includes an access device coupled to the resistance changing memory element and the heater.
Abstract: An information transmitting apparatus is described. An interface includes a first input for a valid data word, a second input for an information to be transmitted, and an output, wherein the interface provides the data word or a data word recognizable as an invalid data word at the output, depending on the information. Accordingly, an information receiving apparatus comprises an interface comprising an input for a data word and an output for an information, wherein the interface derives the information depending on whether the data word is a valid data word or an invalid data word.
Type:
Grant
Filed:
November 15, 2006
Date of Patent:
June 12, 2012
Assignee:
Qimonda AG
Inventors:
Thomas Hein, Rex Kho, Aaron John Nygren
Abstract: A memory module includes an electronic printed circuit board with at least one contact strip, a plurality of integrated memory components, at least one first and one second buffer component, and a number of conductor tracks, which proceed from the contact strip and which are arranged on or in the printed circuit board. The conductor tracks include data lines, control lines and address lines. The conductor tracks lead from the contact strip to the buffer components or to one of the buffer components. The printed circuit board has conductor tracks that are interposed between the first buffer component and the second buffer component and that lead from the first buffer component to the second buffer component.
Abstract: An integrated circuit includes a first electrode including an etched recessed portion. The integrated circuit includes a second electrode and a resistivity changing material filling the recessed portion and coupled to the second electrode.
Type:
Grant
Filed:
February 5, 2008
Date of Patent:
May 29, 2012
Assignees:
International Business Machines Corporation, Macronix International Co., Ltd., Qimonda AG
Inventors:
Matthew Breitwisch, Shihhung Chen, Thomas Happ, Eric Joseph
Abstract: The invention relates to a memory device, in particular to a resistively switching memory device such as a Phase Change Random Access Memory (“PCRAM”). In one disclosed method, a nanowire of non-conducting material is formed serving as a mould for producing a nanotube of conducting material. A volume of switching active material is deposited on top of the nanotube, so that the ring-shaped front face of the nanotube couples to the switching active material and thus forms a bottom electrode contact.
Abstract: A memory cell includes a first electrode having a first region and a second region, a second electrode and a phase change material. The phase change material is interposed between the first electrode and the second electrode with the first region of the first electrode arranged closer to the phase change material than the second region. The first region of the first electrode includes an inner portion laterally surrounded by an outer portion. The outer portion has a greater resistivity than the inner portion. The second region of the first electrode has the same resistivity as the inner portion of the first region.
Abstract: Embodiments of the invention relate to integrated circuits comprising inputs for receiving an input signal and a plurality of clock signals having a predetermined phase relationship. The integrated circuit may include a plurality of track-and-hold devices and a plurality of slicer devices. Signal outputs of two track-and-hold devices may be coupled to signal inputs of one slicer device, one of the two track-and-hold devices and the slicer device being coupled to a first input configured to receive a first clock signal and the other track-and-hold device being coupled to a second input being configured to receive a second clock signal.
Abstract: One embodiment relates to an integrated circuit that includes a memory array of pillars arranged in rows and columns. The pillars are separated from one another by row trenches and column trenches. The column trenches include a pair of parallel column trenches. A first trench of the pair includes two parallel bit lines coupled to pillars adjacent to the first trench. A second trench of the pair is free of bit lines. Other methods, devices, and systems are also disclosed.
Abstract: A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circuit includes a housing accommodating the multiple memory chips and the multiple ports.
Abstract: A memory system comprises a first memory having associated therewith a first local memory access controller configured to access the first local memory using physical memory addresses and a second memory having associated therewith a second local memory access controller configured to access the second local memory using physical memory addresses. A global controller coupled to the first and second local controllers is configured to communicate virtual memory addresses to the first and second local memory controllers.
Abstract: According to one embodiment of the present invention, a memory device includes a composite structure including a resistivity changing layer and an electrode layer being arranged on or above the resistivity changing layer. The resistivity changing memory device further includes a protection layer being arranged on or above the composite structure, the protection layer protecting the electrode layer against electromagnetic waves.
Abstract: In an embodiment, an integrated circuit is provided. The integrated circuit may include an active area extending along a first direction corresponding to a current flow direction through the active area, a contact structure having an elongate structure. The contact structure may be electrically coupled with the active area. Furthermore, the contact structure may be arranged such that the length direction of the contact structure forms a non-zero angle with the first direction of the active area.
Abstract: A memory arrangement comprises a first memory module and a second memory module. An item of information to be written to the memory arrangement is written with a first address both to the first memory module and to the second memory module. When reading, the item of information is read either from the first memory module by means of the first address or from the second memory module by means of a second address differing from the first address. Subsequently a check is made as to whether the item of information is defective. If this is the case, the item of information is read from the respective other memory module.
Abstract: A system for electronic components mounted on a circuit board is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conductive material, fixing the electronic component on the printed circuit board.
Abstract: Distributed command and address bus architecture for memory modules and circuit boards is described. In one embodiment, a memory module includes a plurality of connector pins disposed on an edge of a circuit board, the plurality of connector pins comprising first pins coupled to a plurality of data bus lines, second pins coupled to a plurality of command and address bus lines, wherein the second pins are disposed in a first and a second region, wherein a portion of the first pins is disposed between the first and the second regions.
Type:
Grant
Filed:
December 4, 2008
Date of Patent:
April 17, 2012
Assignee:
Qimonda AG
Inventors:
Michael Bruennert, Peter Gregorius, Georg Braun, Andreas Gärtner, Hermann Ruckerbauer, George William Alexander, Johannes Stecker
Abstract: A description is given of a circuit for creating an error coding data block for a first data block, including a first error coding path adapted to create the error coding data block in accordance with a first error coding; and a second error coding path adapted to create the error coding data block in accordance with a second error coding; the error coding data block for the first data block being created optionally by the first or second error coding paths, as a function of a control indicator, and at least the first error coding path comprising a data arrangement alteration device.
Abstract: An integrated circuit device includes a substrate with a first layer situated on the substrate. The first layer defines a first opening with a cover layer deposited on the first layer and coating a sidewall portion of the first opening. A second layer is situated on the cover layer. The second layer defines a second opening extending through the second layer and through the cover layer to connect the first and second openings.
Type:
Grant
Filed:
May 7, 2007
Date of Patent:
April 17, 2012
Assignee:
Qimonda AG
Inventors:
Daniel Köhler, Manfred Engelhardt, Peter Baars, Hans-Peter Sperlich