Abstract: Light modulator displays may be illuminated using a light guide comprising diffractive optics that directs light onto an array of light modulators. A holographic light turning element may be included with the light guide to turn light propagating within the light guide onto the light modulators. In some embodiments, the holographic element is configured to distribute a substantially uniform amount of light across the array of modulators. The holographic element may, for example, have a turning efficiency that changes along the length of the holographic element. A holographic element can also be used to function as a light bar. Such a holographic element may receive light from a light source such as a light emitting diode and distribute the light along a light guide disposed in front of an array of light modulators.

Abstract: A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.

Abstract: An optical interference display cell is described. A first electrode and a sacrificial layer are sequentially formed on a transparent substrate and at least two openings are formed in the first electrode and the sacrificial layer to define a position of the optical interference display cell. An insulated heat-resistant inorganic supporter is formed in each of the openings. A second electrode is formed on the sacrificial layer and the supporters. Finally, a remote plasma etching process is used for removing the sacrificial layer.

Abstract: A spatial light modulator includes an array of elements to modulate light in accordance with image data. The modulator has a display panel having first and second surfaces arranged adjacent to the array of elements such that the second surface is directly adjacent the array of elements to allow a viewer to view an image produced by modulation of light. The modulator may also include a light source to provide light to the display panel and illumination dots on the first surface of the display panel to reflect light from the source to the array of elements.

Abstract: Embodiments of MEMS devices include support structures having substantially vertical sidewalls. Certain support structures are formed through deposition of self-planarizing materials or via a plating process. Other support structures are formed via a spacer etch. Other MEMS devices include support structures at least partially underlying a movable layer, where the portions of the support structures underlying the movable layer include a convex sidewall. In further embodiments, a portion of the support structure extends through an aperture in the movable layer and over at least a portion of the movable layer.

Abstract: A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

Abstract: Devices incorporating an interferometric stack in a photovoltaic device and method of manufacturing a photovoltaic device comprising an interferometric stack. In one example, a photovoltaic device includes a photovoltaic active layer, an absorber layer, and a first optical resonant cavity layer. The optical resonant cavity layer is disposed between the absorber layer and photovoltaic active layer forming an interferometric modulator. The interferometric modulator is configured to reflect a uniform color. In another example, a method of manufacturing a photovoltaic device includes depositing a photovoltaic active layer on an interferometric stack. The interferometric stack can include an absorber layer and a first optical resonant cavity. The photovoltaic active layer is deposited on the optical resonant cavity and the formed photovoltaic device is reflects a uniform color.

Abstract: Devices incorporating an interferometric stack configured to reflect a certain color and transmit longer wavelengths through the interferometric stack. In one example, a color filtering includes two partial reflectors comprising an extinction coefficient that is less than about one at wavelengths greater than about 800 nm. The two partial reflectors define an optical resonant cavity forming an interferometric stack configured to reflect color and transmit some electromagnetic waves. In another example, a photovoltaic device includes two photovoltaic active layers that act as partial reflectors to form an interferometric stack. The photovoltaic device is configured to reflect color and produce power.

Abstract: Systems and methods for driving a display of MEMS devices are disclosed. In one embodiment, a display device comprises an array of MEMS display elements, at least one test deflecting element, and a deflection sensing circuit connected to the test deflecting element, the deflection sensing circuit being configured to monitor deflection of the test deflecting element without actuating the test deflection element and to provide a signal indicative of one or more parameters affecting operation of the array of MEMS display elements based on the deflection.

Abstract: Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The packaging system disclosed herein comprises a patterned spacer that, in some embodiments, is fabricated using thin-film methods. In some embodiments, the spacer together with a substrate and backplate package an electronic device.

Abstract: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Abstract: In certain embodiments, a microelectromechanical (MEMS) device comprises a substrate having a top surface, a movable element over the substrate, and an actuation electrode disposed laterally from the reflective surface. The movable element comprises a deformable layer and a reflective element mechanically coupled to the deformable layer. The reflective element includes a reflective surface. The movable element is responsive to a voltage difference applied between the actuation electrode and the movable element by moving in a direction generally perpendicular to the top surface of the substrate.

Abstract: In various embodiments of the invention, an anti-stiction coating is formed on at least one surface of an interior cavity of a MEMS device. Particular embodiments provide an anti-stiction on one or mirror surfaces of an interferometric light modulation device, also known as an iMoD in some embodiments. In other embodiments, an interferometric light modulation device is encapsulated within a package and the anti-stiction coating is applied after the package is fabricated. In one embodiment, one or more orifices are defined in the package, e.g., in a seal, a substrate or a backplate and the anti-stiction coating material is supplied into the interior of the package via the orifice(s). In one embodiment, the anti-stiction coating material includes a self-aligned (or self-assembled) monolayer. In yet another embodiment, the anti-stiction layer coating can be incorporated into a release process where a sacrificial layer of an interferometric light modulation device is etched away with the use of a gas.

Abstract: Improvements in an interferometric modulator that has a cavity defined by two walls.

Abstract: An interferometric modulator is formed having a dielectric with charge persistence. The interferometric modulator is addressed by a method making advantageous use of the charge persistence property, wherein the interferometric modulator is pre-charged in such a way that the pre-charging is not observable to a viewer, and the actuation voltage threshold of the imod is significantly lowered. Subsequently the interferometric modulator may be actuated with a significantly lower actuation voltage, thereby saving power.

Abstract: By varying the spacing between a partially-reflective, partially-transmissive surface and a highly reflective surface positioned behind the partially-reflective, partially-transmissive surface, an interferometric modulator selectively creates constructive and/or destructive interference between light waves reflecting off the two surfaces. The spacing can be varied by applying a voltage to create electrostatic attraction between the two surfaces, which causes one or both surfaces to deform and move closer together. In the absence of such attraction, the surfaces are in a relaxed position, where they are farther apart from one another. A actuation voltage is needed to create sufficient electrostatic attraction to cause a surface to deform. The actuation voltage can be modified by implanting ions in a dielectric layer attached to one or both surfaces.

Abstract: In various embodiments described herein, methods for forming a plurality of microelectromechanical systems (MEMS) devices on a substrate are described. The MEMS devices comprise x number of different sacrificial or mechanical structures with x number of different sacrificial structure thicknesses or mechanical structure stiffnesses and wherein the x number of sacrificial or mechanical structures are formed by x-1 depositions and x-1 masks.

Abstract: A microelectromechanical (MEMS) device is presented which comprises a metallized semiconductor. The metallized semiconductor can be used for conductor applications because of its low resistivity, and for transistor applications because of its semiconductor properties. In addition, the metallized semiconductor can be tuned to have optical properties which allow it to be useful for optical MEMS devices.

Abstract: Air gap variation in an interferometric modulator over a two-dimensional spatial map of the modulator is determined by acquiring a digital photograph of the modulator. Color parameters of individual pixels in the photograph are determined and compared to a model of color parameters as a function of air gap distance. The model and individual pixel color parameters may be plotted on a color space plot for comparison. The determined distances may be plotted over a two-dimensional spatial map of the interferometric modulator to visualize the mirror curvature and air gap variation.

Abstract: Systems and methods for driving a display of MEMS devices are disclosed. In one embodiment, a display includes an array comprising a plurality of interferometric modulators, and a driving circuit coupled to said array, said driving circuit configured to provide actuation signals to drive said array based on a temperature of the display. In another embodiment, a method of driving an array having a plurality of interferometric modulators configured into a display is disclosed, where the method includes sensing the temperature at a predetermined location in display, communicating a signal based on the sensed temperature to a display driver, generating an actuation signal to drive said display based on the received signal, and providing the actuation signal to the array.