Abstract: A transmissive backlit display is disclosed. In one aspect, the backlit display comprises a backlight and an array of transmissive interferometric modulators. Each interferometric modulator comprises a fixed and moving dielectric mirror stack. The interferometric modulators cause light within the desired wavelength range to be transmitted while reflecting at least a portion of the remaining light.
Abstract: An illumination device includes a holographic film and a light source, such as a point light source. The point light source is positioned at an edge of the holographic film and has a light emitting face that faces the edge of the holographic film. The holographic film includes a hologram formed of diffractive refractive index structures. The density of the diffractive refractive index structures increases with increasing distance from the light source. Light is propagated from the light source through the holographic film, such as by total internal reflection. The diffractive refractive index structures turn the light, thereby causing the light to propagate out of the holographic film in a desired direction. In some embodiments, the light propagating out of the holographic film has a high uniformity across the surface of the holographic film.
Type:
Application
Filed:
October 14, 2008
Publication date:
December 31, 2009
Applicant:
QUALCOMM MEMS Technologies, Inc.
Inventors:
Russell Wayne Gruhlke, Clarence Chui, Marek Mienko, Gang Xu, Ion Bita
Abstract: A transmissive backlit display is disclosed. In one aspect, the backlit display comprises a backlight and an array of transmissive interferometric modulators. Each interferometric modulator comprises a fixed and moving dielectric mirror stack. The interferometric modulators cause light within the desired wavelength range to be transmitted while reflecting at least a portion of the remaining light.
Abstract: A device to measure pressure is disclosed. In one embodiment, the device comprises at least one element comprising two layers separated by a space, wherein a dimension of the space changes over a variable time period in response to a voltage applied across the two layers and a measuring module configured to measure the time period, wherein the time period is indicative of the ambient pressure about the device.
Abstract: In some embodiments, each interferometric modulator has a stiction threshold voltage. If a voltage above the stiction threshold voltage is applied to the interferometric modulator, the interferometric modulator enters a stiction state permanently, i.e., becomes “stuck,” and the interferometric modulator becomes inoperable. Disclosed are apparatuses, methods and computer-readable media for testing a panel of interferometric modulators. A ramped voltage waveform is applied to a plurality of interferometric modulators of the panel. In response to applying the ramped voltage, the stiction threshold voltage is identified. At or above this voltage, the number of stuck interferometric modulators in the panel reaches or exceeds a first threshold number, for example, 50% of the total number of the interferometric modulators constituting the panel. The embodiments can be used to establish stiction benchmark for panel manufacturing processes, to collect data for generating statistical distribution, etc.
Abstract: A method of fabricating a MEMS device includes conditioning of an insulating layer by applying a voltage across the insulating layer via a conductive sacrificial layer for a period of time, prior to removal of the conductive sacrificial layer. This conditioning process may be used to saturate or stabilize charge accumulated within the insulating layer. The resistance across the insulating layer may also be measured to detect possible defects in the insulating layer.
Type:
Application
Filed:
June 16, 2009
Publication date:
December 24, 2009
Applicant:
QUALCOMM MEMS Technologies, Inc.
Inventors:
Chen-Jean Chou, Chun-chen Wu, Patrick F. Brinkley
Abstract: Microelectronic devices may be fabricated while being protected from damage by electrostatic discharge. In one embodiment, a shorting circuit is connected to elements of the microelectronic device, where the microelectronic device is part of a chip-on-glass system. In one aspect of this embodiment, a portion of the shorting circuit is in an area of a substrate where a microchip is bonded. In another embodiment, shorting links of the shorting circuit are comprised of a fusible material, where the fusible material may be disabled by an electrical current capable of fusing the shorting links.
Abstract: The invention comprises systems and methods determining residual stress such as that found in interferometric modulators. In one example, a test unit can be configured to indicate residual stress in a film by interferometrically modulating light indicative of an average residual stress in two orthogonal directions of the substrate. The test unit can include a reflective membrane attached to the substrate where membrane is configured as a parallelogram with at least a portion of each side attached to the substrate, and an interferometric cavity formed between a portion of the membrane and a portion of the substrate, and where the membrane is configured to deform based on the residual stress of in the film and modulate light indicative of the amount of membrane deformation.
Abstract: Methods and apparatus for providing lighting in a display are provided. In one embodiment, a microelectromechanical system (MEMS) is provided that includes a transparent substrate and a plurality of interferometric modulators. The interferometric modulators include an optical stack coupled to the transparent substrate, a reflective layer over the optical stack, and one or more posts to support the reflective layer and to provide a path for light from a backlight for lighting the display.
Abstract: Embodiments of the present invention relate to interferometric display devices comprising an interferometric modulator and a solar cell and methods of making thereof. In some embodiments, the solar cell is configured to provide energy to the interferometric modulator. The solar cell and the interferometric modulator may be formed above the same substrate. A layer of the solar cell may be shared with a layer of the interferometric modulator.
Abstract: Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.
Abstract: Embodiments herein relate to light systems designed to reduce Moiré interference while simultaneously reducing dark regions due to the edge shadow effect. For example, configurations of light sources, light guides and turning features may direct light across a display while reducing Moiré interference.
Type:
Application
Filed:
June 4, 2009
Publication date:
December 10, 2009
Applicant:
QUALCOMM MEMS Technologies, Inc.
Inventors:
Lai Wang, Gang Xu, Ion Bita, Marek Mienko, Russell Gruhlke
Abstract: In one embodiment of the invention, a display is provided and includes a plurality of interferometric display elements. The display further includes at least one diffuser. Optical properties of the diffuser are selected to reduce color shift of the display when viewed from at least one angle.
Abstract: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.
Type:
Grant
Filed:
August 12, 2005
Date of Patent:
December 8, 2009
Assignee:
QUALCOMM MEMS Technologies, Inc.
Inventors:
Ming-Hau Tung, Brian W. Arbuckle, Philip D. Floyd, William J. Cummings
Abstract: An interferometric spatial light modulator comprises of two cavities. One is the optical resonant cavity having a partially reflective film and a movable reflective membrane as two walls, and the other is the electromechanical actuation cavity having the movable reflective membrane and a bottom metal layer as electrodes. The spatial light modulator is built on silicon substrate and is actively addressed. A microdisplay apparatus of such spatial light modulators and a projection display system using such microdisplay are also disclosed.
Abstract: In certain embodiments, a microelectromechanical (MEMS) device comprises a substrate having a top surface, a movable element over the substrate, and an actuation electrode disposed laterally from the reflective surface. The movable element comprises a deformable layer and a reflective element mechanically coupled to the deformable layer. The reflective element includes a reflective surface. The movable element is responsive to a voltage difference applied between the actuation electrode and the movable element by moving in a direction generally perpendicular to the top surface of the substrate.
Abstract: A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, where the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method includes forming a metal seal on the substrate proximate a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
Abstract: A illumination device comprises a light guide having a first end for receiving light and configured to support propagation of light along the length of the light guide. A turning microstructure is disposed on a first side of the light guide configured to turn light incident on the first side and to direct the light out a second opposite side of the light guide, wherein the turning microstructure comprises a plurality of indentations. A cover is physically coupled to the light guide and disposed over the turning microstructure. An interlayer is between the cover and the light guide, wherein the interlayer physically couples the cover to the light guide. A plurality of open regions is between the interlayer and the plurality of indentations. Various embodiments include methods of coupling the cover to the light guide while preserving open regions between the cover and plurality of indentations.
Type:
Application
Filed:
May 28, 2009
Publication date:
December 3, 2009
Applicant:
QUALCOMM MEMS TECHNOLOGIES, INC.
Inventors:
Ion BITA, Gang XU, Kollengode S. NARAYANAN, Russell W. GRUHLKE, Marek MIENKO, Lai WANG
Abstract: A method of making a microelectromechanical system (MEMS) device is disclosed. The method includes forming a stationary layer over a substrate. A sacrificial layer is formed over the stationary layer. The sacrificial layer is formed of a first material. A mechanical layer is formed over the sacrificial layer. A hard mask layer is formed over the mechanical layer. The hard mask layer is formed of a second material. The first and second materials are etchable by a single etchant which is substantially selective for etching the first and second materials relative to the mechanical layer. The hard mask layer is patterned after forming the hard mask layer. Subsequently, the mechanical layer is etched through the patterned hard mask layer. The patterned hard mask layer is removed simultaneously with the sacrificial layer after etching the mechanical layer.
Abstract: Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. A non-planar surface is formed on one or more layers by flowing an etchant through a permeable layer. In one embodiment the non-planar surface is formed on a sacrificial layer. A movable layer formed over the non-planar surface of the sacrificial layer results in a non-planar interface between the sacrificial and movable layers. Removal of the sacrificial layer results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.