Patents Assigned to R&D Center
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Patent number: 9312223Abstract: The present invention relates to an interconnection structure and a method for fabricating the same. According to the present invention, cavities are formed between the interconnection dielectric by using a sacrificial layer, carbon nanotubes are used as the interconnection material for local interconnection between via holes, graphene nanoribbons are used as the interconnection material for metal lines, and cavities are included in the interconnection dielectric. In addition, the conventional CMOS BEOL Cu interconnection technique is applied to the intermediate interconnection level and the global interconnection level. In this way, the high parasitic resistance and parasitic capacitance in the Cu interconnection technique, which may occur when the local interconnection is relatively small in size, can be effectively overcome.Type: GrantFiled: December 31, 2011Date of Patent: April 12, 2016Assignee: SHANGHAI IC R&D CENTER CO., LTDInventors: Yuhang Zhao, Xiaoxu Kang
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Patent number: 9305951Abstract: A pixel structure of a CMOS image sensor pixel structure and a manufacturing method thereof. The structure comprises a photosensitive element (37) and a multi-layer structure of a standard CMOS device arranged on the silicon substrate (31). A deep groove (38) having a light-transmitting space therein is formed above the photosensitive element, a side wall of the deep groove is surrounded by a light reflection shielding layer (39) continuously arranged in a longitudinal direction to reflect the light incident on the light reflection shielding layer. The side wall of the deep groove is surrounded by metal interconnects, vias, contact holes and polysilicon in annular configurations, thus the incident light on the deep grove is substantially completely reflected, which avoids the optical crosstalk and effectively improves the optical resolution and sensitivity of the pixel and the performance and reliability of the chip.Type: GrantFiled: December 28, 2012Date of Patent: April 5, 2016Assignee: SHANGHAI IC R&D CENTER CO., LTDInventors: Xiaoxu Kang, Yuhang Zhao
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Patent number: 9294767Abstract: The invention discloses an inter picture prediction method for video coding and decoding and a codec. The inter picture prediction method for video coding comprises: performing motion estimation over integer pixel positions of a reference picture, to determine an optimal motion vector for a current prediction unit in a current picture; and performing interpolation filtering processing for motion estimation over fractional pixel position by using the integer pixel position information to which the optimal motion vector directs in the reference picture, and spatially neighboring pixel information of the current prediction unit in the current picture.Type: GrantFiled: August 31, 2011Date of Patent: March 22, 2016Assignee: LG ELECTRONICS (CHINA) R&D CENTER CO., LTD.Inventor: Jie Jia
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Patent number: 9278519Abstract: The present invention provides a control system for use in digital printing, comprising: a host; multiple main control boards connected to the host, multiple sets of nozzle plates, wherein each set of nozzle plate respectively is connected to one main control board and to one set of nozzle. The present invention also provides a control method for use in digital printing, comprising: the host decomposing a job into multiple portions, and distributing each portion of the job to one main control board; the main control boards concurrently converting received portions of the job into pages and distributing the pages to a set of nozzle plates connected thereto; the nozzle plates converting the pages into printing data and driving the nozzle sets connected to the nozzle boards to print the printing data thereof. The present invention achieves the effect of improving processing performance of the control system.Type: GrantFiled: September 26, 2012Date of Patent: March 8, 2016Assignees: Peking University Founder Group Co., Ltd., Peking University, Beijing Founder Electronics Co., Ltd., Peking University Founder R&D CenterInventors: Dan Li, Shaowei Guo, Xiaohui Wen, Zhihong Liu
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Patent number: 9269613Abstract: A method is disclosed for manufacturing a semiconductor device with a copper interconnect structure. The method includes providing a substrate, forming a first interconnect dielectric layer on the substrate, and forming a second interconnect dielectric layer on a surface of the first interconnect dielectric layer. The method also includes forming a plurality of conduits extending through the first interconnect dielectric layer and the second interconnect dielectric layer, and depositing copper in the plurality of conduits to form a copper interconnect layer of the copper interconnect structure. Further, the first interconnect dielectric layer, between neighboring conduits, contains cavities such that dielectric constant of the first interconnect dielectric layer is reduced. The second interconnect dielectric layer seals the top of the cavities, the substrate is the bottom of the cavities, and a width of the top of the cavities is less than a width of the bottom of the cavities.Type: GrantFiled: December 20, 2011Date of Patent: February 23, 2016Assignee: SHANGHAI IC R&D CENTER CO., LTDInventors: Yuhang Zhao, Xiaoxu Kang
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Patent number: 9250295Abstract: The present invention relates to a high-voltage battery charging simulation system that includes a simulation high-voltage battery pack, a simulation battery management system, a multi-party communication device, and a charging station. The voltage of the simulation high-voltage battery pack can be calculated and updated immediately by the simulation battery management system to simulate the feature of real battery pack, so that it can detect the operation of the multi-party communication device and the charging station.Type: GrantFiled: July 19, 2012Date of Patent: February 2, 2016Assignee: SHIP AND OCEAN INDUSTRIES R&D CENTERInventors: Shean-Kwang Chou, Hung-Hsi Lin, Chih-Hung Lin, Sheng-Hua Chen
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Patent number: 9234203Abstract: One aspect of the present disclosure relates to a stabilized recombinant expression plasmid vector comprising a polynucleotide encoding an antitoxin gene which expresses a polypeptide that neutralizes a polypeptide toxic to a host cell, the toxic polypeptide being expressed by a toxin gene in the host cell, and a polynucleotide encoding a polypeptide expression product, and the stabilized recombinant expression plasmid vector is derived from a Hafnia alvei autonomously replicable backbone plasmid. Other aspects of the present disclosure relate to a transformant transformed with the stabilized recombinant expression plasmid vector disclosed herein, a method of producing biobased cadaverine using the transformant disclosed herein, and biobased cadaverine prepared by the method disclosed herein. Another aspect of the present disclosure relates to a polyamide formed using biobased cadaverine disclosed herein, and a composition thereof.Type: GrantFiled: March 12, 2013Date of Patent: January 12, 2016Assignees: Cathay Industrial Biotech Ltd., Cathay R&D Center Co., Ltd.Inventors: Zhenhua Pang, Naiqiang Li, Charlie Liu, Xiucai Liu
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Patent number: 9222837Abstract: This invention involves structure and fabrication method of a black silicon-based MEMS thermopile IR detector. The high-performance black silicon-based MEMS thermopile IR detector includes a substrate; a releasing barrier band on the substrate; a thermal isolation cavity constructed by the releasing barrier band; a black silicon-based IR absorber located right above the thermal isolation cavity; a number of thermocouples are set around the lateral sides of the black silicon-based IR absorber. The thermopiles around the black silicon-based IR absorber are electrically connected in series thus to form a thermopile. Metallic electrodes are located beside the electrically-connected thermopiles for signal output. The cold junctions of the thermopile are connected to the substrate through the first thermal-conductive-electrical-isolated structures, the heat conductor is located at the lateral sides of the thermal isolation cavity.Type: GrantFiled: January 21, 2013Date of Patent: December 29, 2015Assignee: JIANGSU R&D CENTER FOR INTERNET OF THINGSInventors: Haiyang Mao, Wen Ou
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Patent number: 9224804Abstract: The present invention provides a guarding ring structure of a semiconductor high voltage device and the manufacturing method thereof. The guarding ring structure comprises a first N type monocrystalline silicon substrate (3), a second N type monocrystalline silicon substrate (8), a discontinuous oxide layer (2), a metal field plate (1), a device region (9), multiple P+ type diffusion rings (5) and an equipotential ring (4). The second N type monocrystalline silicon substrate (8) is a single N type crystalline layer epitaxially formed on the first N type monocrystalline silicon substrate (3) and has lower doping concentration than the first N type monocrystalline silicon substrate (3). N type diffusion rings (6) are embedded in the inner side of the P+ type diffusion rings (5) and are fully depleted at zero bias voltage. The guarding ring structure can achieve the same withstand voltage with less area and design time.Type: GrantFiled: November 21, 2012Date of Patent: December 29, 2015Assignee: Shanghai IC R&D Center Co., Ltd.Inventor: Deming Sun
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Patent number: 9218551Abstract: The application discloses a method and an apparatus for rasterizing a page digital image. The method comprises steps of parsing a page digital image to obtain basic information, position information and rasterization information of the image, with the basic information including image data, image type, a width, height and bit depth of the image (S10); decoding data encoding type to obtain the image data and saving the image data into a buffer (S20); acquiring the image data from the buffer and rasterizing the image data by using the image type, the width, height and bit depth of the image and the position information to obtain a rasterized page lattice (S30). The solution may reduce the reading and writing operations for data files on disk and improve the rasterization efficiency of the digital image.Type: GrantFiled: December 21, 2011Date of Patent: December 22, 2015Assignees: PEKING UNIVERSITY FOUNDER GROUP CO., LTD., PEKING UNIVERSITY FOUNDER R & D CENTER, BEIJING FOUNDER ELECTRONIC CO., LTD.Inventor: Yong Ji
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Patent number: 9208414Abstract: The application discloses a method for double-sided printing with two colors. The method comprises a step of receiving two pages of original four-color page lattice according to a printing order each time, a step of extracting effective data of first and second colors in the two pages of original four-color page lattice, respectively and a step of writing the data of the first and second colors extracted respectively into data of first color, second color, third color and fourth color of a new page of four-color page lattice, respectively.Type: GrantFiled: December 24, 2011Date of Patent: December 8, 2015Assignees: Peking University Founder Group Co., Ltd., Peking University, Beijing Founder Electronics Co., Ltd., Peking University Founder R & D CenterInventors: Linyi Li, Weiping Huang
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Patent number: 9198192Abstract: Disclosed is a method for transmitting control information in a media access control-enhanced packet data unit (MAC-e PDU), including determining a data size of a transport format combination (TFC) selected by a user equipment (UE), including control information into the MAC-e PDU when a size of data and a header for the MAC-e PDU is shorter than the data size of the TFC, padding data of the MAC-e PDU with padding bits if a size of data including a corresponding header is shorter than the data size of the TFC, including the control information into the padding bits if the length of the padding bits is suitable for the transmission of the control information, and sending, by the UE, the MAC-e PDU including the control information to a node B.Type: GrantFiled: September 16, 2014Date of Patent: November 24, 2015Assignees: Samsung Electronics Co., Ltd, Beijing Samsung Telecom R&D CenterInventors: Hong Wang, Gaoke Du, Xiaoqiang Li
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Patent number: 9191222Abstract: A method for providing notifications for Multi-media Broadcast/Multicast Service comprising steps of configuring a MBMS notification channel or a service channel by a RNC; sending information relevant to the MBMS service to a base station by the RNC; calculating a location indicated by a transmission notification according to the received information by the base station; and transmitting the MBMS notification channel by the base station. With the service relevant parameters transferred to the Node B, the notification indicated location NI corresponding to each service in each frame can be calculated by the Node B to reduce the traffic through the interface lub. The traffic of information transferred between the RNC and the base station is decreased so that the network resource is utilized effectively.Type: GrantFiled: July 29, 2005Date of Patent: November 17, 2015Assignees: Samsung Electronics Co., Ltd., Beijing Samsung Telecom R&D CenterInventors: Chunying Sun, Xiaoqiang Li
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Patent number: 9182661Abstract: The present application provides a screen method for intaglio printing, comprising: dividing multiple classes of regions according to a brightness range; and generating screen dots with various screen patterns for the grouped classes of regions. The present application also provides a screen device for intaglio printing, comprising: a dividing module configured to group multiple classes of regions according to the brightness range; and a generating module configured to generate screen dots with various screen patterns for the grouped classes of regions. Since multiple kinds of screen patterns are applied in the technical solutions in present application, the problem, i.e., water ripple will occur in the prior art, may be addressed, so as to improve the quality of printing.Type: GrantFiled: December 24, 2011Date of Patent: November 10, 2015Assignees: Peking University Founder Group Co., Ltd., Peking University, Beijing Founder Electronics Co., Ltd., Peking University Founder R&D CenterInventors: Haifeng Li, Bin Yang
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Patent number: 9168865Abstract: An organic EL lighting device for a vehicle is provided, which includes an organic EL lighting portion provided in a matrix form on a ceiling of the vehicle, an organic EL touch portion provided on the organic EL lighting portion, an organic EL detection portion for detecting a position in which the organic EL touch portion is touched, an organic EL determination portion for determining a lighting area of the organic EL lighting portion based on the position detected by the organic EL detection portion, and an organic EL driving portion for lighting the lighting area of the organic EL lighting portion determined by the organic EL determination portion.Type: GrantFiled: July 30, 2012Date of Patent: October 27, 2015Assignees: Hyundai Motor Company, Kia Motors Corporation, Hyundai Motor Japan R&D Center, Inc.Inventor: Hiroshi Nakamura
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Publication number: 20150290820Abstract: A razor having an attachment portion and a shaving aid is provided. The attachment portion includes a blade body. The shaving aid is provided with a deformable portion that deforms when contacted by the skin surface. When the razor is used, the shaving aid itself deforms to decrease the frictional resistance between the shaving aid and the skin surface. This improves the tactile sensation on the skin surface and thus the shaving sensation.Type: ApplicationFiled: November 5, 2013Publication date: October 15, 2015Applicant: KAI R&D Center Co., Ltd.Inventor: Daisuke Haba
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Publication number: 20150287891Abstract: Disclosed is an LED packaging structure using a distant fluorescent powder layer and a manufacturing method thereof. A fluorescent powder layer (10) with a recessed cavity cover structure is used in the packaging structure. A group of dies for manufacturing the fluorescent powder layer are specifically designed in the present invention. The fluorescent powder layer manufactured by using the dies has a regular structure and an even thickness. The fluorescent powder layer and a substrate (30) form a closed cavity for accommodating a chip (20) on the substrate, the cavity is vacuum, and the effect of distant fluorescent powder coating can be achieved. The manufacturing method can be also used for batch manufacturing of the fluorescent powder layers, and repeated adhesive dispensing for each chip in the traditional batch packaging process of the fluorescent powder layers is avoided, thereby improving the LED packaging efficiency.Type: ApplicationFiled: November 25, 2013Publication date: October 8, 2015Applicant: HKUST LED-FPD TECHNOLOGY R&D CENTER AT FOSHANInventors: Huihua Liu, Chichuen Lo, Rong Zhang, Shiwei Lee
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Patent number: D750459Type: GrantFiled: February 5, 2015Date of Patent: March 1, 2016Assignee: Kai R&D Center Co., Ltd.Inventor: Katsumi Hasegawa
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Patent number: D751352Type: GrantFiled: January 15, 2013Date of Patent: March 15, 2016Assignee: Kai R & D Center Co., Ltd.Inventor: Takashi Koide
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Patent number: D751365Type: GrantFiled: February 5, 2015Date of Patent: March 15, 2016Assignee: Kai R & D Center Co., LtdInventor: Katsumi Hasegawa