Abstract: A memory system includes a memory module which further includes a set of memory devices. The set of memory devices includes a first subset of memory devices and a second subset of memory devices. An address bus is disposed on the memory module, wherein the address bus includes a first segment coupled to the first subset and a second segment coupled to the second subset. An address signal traverses the set of memory devices in sequence. The memory system also includes a memory controller which is coupled to the memory module. The memory controller includes a first circuit to output a first control signal that controls the first subset, such that the first control signal and the address signal arrive at a memory device in the first subset at substantially the same time.

Abstract: A semiconductor memory system includes a first semiconductor memory die and a second semiconductor memory die. The first semiconductor memory die includes a primary data interface to receive an input data stream during write operations and to deserialize the input data stream into a first plurality of data streams, and also includes a secondary data interface, coupled to the primary data interface, to transmit the first plurality of data streams. The second semiconductor memory die includes a secondary data interface, coupled to the secondary data interface of the first semiconductor memory die, to receive the first plurality of data streams.

Abstract: In one embodiment, a memory device includes a memory core and input receivers to receive commands and data. The memory device also includes a register to store a value that indicates whether a subset of the input receivers are powered down in response to a control signal. A memory controller transmits commands and data to the memory device. The memory controller also transmits the value to indicate whether a subset of the input receivers of the memory device are powered down in response to the control signal. In addition, in response to a self-fresh command, the memory device defers entry into a self-refresh operation until receipt of the control signal that is received after receiving the self-refresh command.

Abstract: A memory module comprises a module interface having module data-group ports to communicate data as respective data groups, a command port to receive memory-access commands, a first memory device including a first device data-group port, a second memory device including a second device data-group port, and a signal buffer coupled between the module interface and each of the first and second devices. In a first mode, in response to the memory-access commands, the signal buffer communicates the data group associated with each of the first and second device data-group ports via a respective one of the module data-group ports. In a second mode, in response to the memory-access commands, the signal buffer alternatively communicates the data group associated with the first device data-group port or the data group associated with the second device data-group port via the same one of the module data-group ports.

Abstract: A receiver that is selectively reconfigurable in a first and a second selectable configuration is disclosed. Configured in the first selectable configuration, the receiver may provide a low impedance input. Configured in the first selectable configuration, a low common-mode input signal may be received. In an embodiment, configured in the first selectable configuration, signaling technologies, such as a Near Ground Signaling (NGS) may be received. Configured in the second selectable configuration, the receiver may provide a high impedance input. Configured in the second selectable configuration, a high common-mode input signal may be received. In an embodiment, configured in the second selectable configuration, signaling technologies, such as a Low Voltage Differential Signaling (LVDS), Pseudo Open Drain Logic (PODL) signaling, Differential Rambus Signaling Level (DRSL), and/or Series Stub Terminated Logic (SSTL) signaling may be received.

Abstract: A memory cell includes a first resistive memory element, a second resistive memory element electrically coupled with the first resistive memory element at a common node, and a switching element comprising an input terminal electrically coupled with the common node, the switching element comprising a driver configured to float during one or more operations.

Abstract: An on-chip AC coupled receiver with baseline wander compensation. The receiver may be used for either single ended or differential signals. The receiver includes an input terminal to receive an input signal. AC coupling circuitry is between the input terminal and a node and couples the input signal into a coupled signal at the node. A control loop senses low frequency signal content at the node and uses a linear buffer in adjusting the coupled signal at the node based on the low frequency signal content. The operation of the control loop compensates for potential baseline wander in the coupled signal. An input stage to recovers data from the coupled signal at the node.

Abstract: A memory module comprises a data interface including a plurality of data lines and a plurality of configurable switches coupled between the data interface and a data path to one or more memories. The effective width of the memory module can be configured by enabling or disabling different subsets of the configurable switches. The configurable switches may be controlled by manual switches, by a buffer on the memory module, by an external memory controller, or by the memories on the memory module.

Abstract: A signaling system supports main and auxiliary communication channels between integrated circuits in the same direction over a single link. An equalizing transmitter applies appropriate filter coefficients to minimize the impact of intersymbol interference when transmitting the main data over a communication channel. The transmitter modulates at least one of the filter coefficients with the auxiliary data to induce apparent ISI in the transmitted signal. A main receiver ignores the apparent ISI to recover the main data, while an auxiliary receiver detects and demodulates the apparent ISI to recover the auxiliary data. The auxiliary data may be encoded using spread-spectrum techniques to reduce the impact of the auxiliary data on the main data.

Abstract: In a pixel array within an integrated-circuit image sensor, each of a plurality of pixels is evaluated to determine whether charge integrated within the pixel in response to incident light exceeds a first threshold. N-bit digital samples corresponding to the charge integrated within at least a subset of the plurality of pixels are generated, and then applied to a lookup table to retrieve respective M-bit digital values (M being less than N), wherein a stepwise range of charge integration levels represented by possible states of the M-bit digital values extends upward from a starting charge integration level that is determined based on the first threshold.

Abstract: N out of every M number of refresh commands are ignored (filtered out) by a buffer chip on a memory module. N and M are programmable. The buffer receives refresh commands (e.g., auto-refresh commands) from the command-address channel, but does not issue a proportion of these commands to the DRAMs on the module. This reduces the power consumed by refresh operations. The buffer may replace some auto-refresh (REF) commands with activate (ACT) and precharge (PRE) commands directed to specific rows. These rows may have known ‘weak’ cells that require refreshing more often than a majority of the other rows on the module (or component). By ignoring some auto-refresh commands, and directing some others to specific rows that have ‘weak’ cells, the power consumed by refresh operations can be reduced.

Abstract: An integrated circuit supports multiple communication modes using different input/output (IO) voltages. The IC includes a low-voltage communication circuit operating at a low IO voltage in a low-voltage mode, and a high-voltage communication circuit operating at a high IO voltage in a high-voltage mode. The low-voltage communication circuit includes low-voltage transistors in a critical path that exhibits sensitivity to a destructive voltage less than the high IO voltage. The low-voltage communication circuit is therefore provided with protection circuitry to protect the low-voltage transistors from the high 10 voltage.

Abstract: A lighting assembly includes a light guide having opposed major surfaces between which light propagates by total internal reflection, a light input edge, and two light output regions of different optical characteristics and at least one of which is associated with a corresponding one of the major surfaces. The lighting assembly also includes a light source located adjacent the light input edge. The light source and the light guide variably positionable relative to one another to vary a location on the light input edge at which the light is input to the light guide such that the light is emitted from the light guide selectively apportioned between the light output regions so that a characteristic of the light output from the lighting assembly is modified based on the optical characteristics associated with the light output regions and the relative positioning of the light source and the light guide.

Abstract: A camouflage circuit instantiated on a semiconductor substrate includes a transient-comparison circuit that briefly expresses a value representative of either a one or a zero in dependence upon reference elements that are visibly indistinct from a perspective normal to the planar surface substrate surface, but that nevertheless exhibit distinct electrical responses. Transient comparisons that define logic states only briefly vastly complicate the use of reverse-engineering tools and techniques that rely on optical stimulation to sense when transistors are on or off.

Abstract: A multi-phase partial response equalizer circuit includes sampler circuits that sample an input signal to generate sampled signals in response to sampling clock signals having different phases. A first multiplexer circuit selects one of the sampled signals as a first sampled bit to represent the input signal. A first storage circuit coupled to an output of the first multiplexer circuit stores the first sampled bit in response to a first clock signal. A second multiplexer circuit selects one of the sampled signals as a second sampled bit to represent the input signal based on the first sampled bit. A second storage circuit stores a sampled bit selected from the sampled signals in response to a second clock signal. A time period between the second storage circuit storing a sampled bit and the first storage circuit storing the first sampled bit is substantially greater than a unit interval in the input signal.

Abstract: A controller includes a link interface that is to couple to a first link to communicate bi-directional data and a second link to transmit unidirectional error-detection information. An encoder is to dynamically add first error-detection information to at least a portion of write data. A transmitter, coupled to the link interface, is to transmit the write data. A delay element is coupled to an output from the encoder. A receiver, coupled to the link interface, is to receive second error-detection information corresponding to at least the portion of the write data. Error-detection logic is coupled to an output from the delay element and an output from the receiver. The error-detection logic is to determine errors in at least the portion of the write data by comparing the first error-detection information and the second error-detection information, and, if an error is detected, is to assert an error condition.

Abstract: A sensing device with an odd-symmetry grating projects near-field spatial modulations onto a closely spaced photodetector array. Due to physical properties of the grating, the spatial modulations are in focus for a range of wavelengths and spacings. The spatial modulations are captured by the array, and photographs and other image information can be extracted from the resultant data. Used in conjunction with a converging optical element, versions of these gratings provide depth information about objects in an imaged scene. This depth information can be computationally extracted to obtain a depth map of the scene.

Abstract: A multi-modal memory interface that supports each of current-mode and voltage-mode signaling by a memory controller with a memory which includes one or more memory devices. In a first type of system, the memory interface is configured to provide differential current-mode signaling from the memory controller to a first type of memory, and differential voltage-mode signaling from the memory to the memory controller. In contrast, in a second type of system, the memory interface is configured to provide single-ended voltage-mode signaling from the memory controller to the memory, and single-ended voltage-mode signaling from a second type of memory to the memory controller. To support these different types of systems, the memory controller couples different types of drivers to each I/O pad. The resulting capacitance is reduced by sharing components between these drivers. Moreover, in some embodiments, the memory interface is implemented using “near-ground” current-mode and voltage-mode signaling techniques.

Abstract: A memory controller component includes transmit circuitry and adjusting circuitry. The transmit circuitry transmits a clock signal and write data to a DRAM, the write data to be sampled by the DRAM using a timing signal. The adjusting circuitry adjusts transmit timing of the write data and of the timing signal such that an edge transition of the timing signal is aligned with an edge transition of the clock signal at the DRAM.

Abstract: A packaged semiconductor device is disclosed. The device comprises a substrate having multiple layers between first and second oppositely disposed faces, and a cavity with an opening at the first face to nest at least one integrated circuit memory device. Logic circuitry is disposed on the second face and includes contacts for electrically coupling to the stacked integrated circuit memory devices. The logic circuitry is coupled to electrical contacts formed on the first face through first electrical paths formed in the multiple layers of the substrate, the first electrical paths including conductive traces and vias.