Abstract: A semiconductor device, having a memory cell region and a peripheral circuit region, includes an insulating film, having an upper surface, formed on a major surface of a semiconductor substrate to extend from the memory cell region to the peripheral circuit region. A capacitor lower electrode assembly is formed in the memory cell region to upwardly extend to substantially the same height as the upper surface of the insulating film on the major surface of the semiconductor substrate. Additionally, the lower electrode assembly includes first and second lower electrodes that are adjacent through the insulating film. A capacitor upper electrode is formed on the capacitor lower electrode through a dielectric film, to extend onto the upper surface of the insulating film. The capacitor lower electrode includes a capacitor lower electrode part having a top surface and a bottom surface.

Abstract: In a spread spectrum clock generator, a DLL circuit delays an oscillation clock signal from a VCO and outputs ten delay clock signals having different phases respectively. A selector selects any one of the ten delay clock signals, and outputs a selected clock signal. A control circuit controls a signal selection operation of the selector. A feedback frequency divider divides a frequency of the selected clock signal by a frequency division ratio N, and generates a comparison clock signal. In this manner, a phase of the comparison clock signal can be fine-tuned. Therefore, a spread spectrum clock generator capable of frequency modulation with high accuracy can be obtained.

Abstract: Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.

Abstract: During operation, a control signal attains H level, a conventional type first reference voltage generation circuit is activated, and the first reference voltage generation circuit generates a reference voltage. During stand-by, the control signal attains L level, and the first reference voltage generation circuit is inactivated, whereby a through current does not flow through the first reference voltage generation circuit. Then, during stand-by, an internal voltage generation circuit is supplied with the reference voltage generated by a second reference voltage generation circuit including a resistance division circuit constituted of first to third resistors each having a high resistance value of T (tera) ? order, in which a through current is extremely small.

Abstract: A conversion table converts a packed instruction (pre-conversion code) contained in the instruction code fetched from an instruction memory into a plurality of instruction codes (converted codes). An instruction decoder decodes the plurality of the instruction codes converted by a conversion table. A plurality of ALUs perform the operation in accordance with the decoding result of the instruction decoder. Therefore, the number of instructions that can be executed in parallel per cycle may be increased while at the same time the capacity of the instruction memory is reduced.

Abstract: The directions of amplitude of polarized light passing through a polarizer are concentric around a position. The polarizer is disposed on the surface of a pupil such that the position lies exactly on the center of the surface of the pupil. Rays of luminous flux of illumination light converted into polarized light by the polarizer are converged onto a wafer with concentric planes of polarization with respect to an optical axis. The illumination light is therefore incident on a photoresist as s-polarized light. Thus, the amount of light entering the photoresist is less likely to depend upon the angle of incidence. Consequently, the contrast of an optical image formed in the photoresist is improved, and hence, resolution characteristics are improved.

Abstract: A semiconductor device is manufactured by a method including forming a first interlayer insulating film. A first etching stopper film is formed on the first interlayer insulating film. A conductive layer is formed on the first etching stopper film. A second etching stopper film is formed to cover the conductive layer, an upper surface of the conductive layer and both side surfaces of the conductive layer. A second interlayer insulating film is formed on the second etching stopper film. A hole is formed penetrating the second interlayer insulating film in a direction of thickness and reaching the conductive layer. An interconnect is formed in the hole. The step of forming a hole includes etching the second interlayer insulating film under a first etching condition, and etching the second etching stopper film under a second etching condition different from the first etching condition. The second etching condition includes using an etching gas containing C, F, and H.

Abstract: An n-type buried diffusion layer is formed on the surface layer of the prescribed area of a p-type silicon substrate, and a p-type first high-concentration isolation diffusion layer is formed in the silicon substrate so as to surround the buried diffusion layer. An n-type epitaxial layer is formed on the silicon substrate, the buried diffusion layer, and the first high-concentration isolation diffusion layer. A p-type second high-concentration isolation diffusion layer is formed in the epitaxial layer on the first high-concentration isolation diffusion layer. A p-type low-concentration isolation diffusion layer for isolating the epitaxial layer into a plurality of island regions is formed in the epitaxial layer on the second high-concentration isolation diffusion layer.

Abstract: In order to improve the discharging speed of potential from a match line, a semiconductor device includes a capacitor, a memory transistor having a source/drain region connected to a storage node of the capacitor, a search transistor having a gate electrode connected to the storage node, and a stacked contact connecting a match line and the source/drain region of the search transistor. The storage node has a configuration in which a sidewall of the storage node facing the match line partially recedes away from the stacked contact such that a portion of the sidewall in front of the stacked contact in plan view along the direction of the match line is located farther away from the stacked contact than the remaining portion of the sidewall.

Abstract: A multiple carrier wireless communications system includes a channel predictor, a performance predictor, and a link adapter. The channel predictor predicts channel state information for a next packet based on channel state information for the current packet. The performance predictor includes an uncoded performance predictor to predict system performance at a decoder input based on a modulation type and the predicted channel state information for the next packet, and a decoder input-output performance mapper to predict system performance at a decoder output based on a coding rate and the predicted system performance at the decoder input. The link adapter includes a link throughput controller to generate a throughput indicator based on a requested system performance and the predicted system performance at the decoder output, and a modulation and coding scheme (MCS) updater to identify a MCS based on the throughput indicator.

Abstract: A multiple carrier wireless communications system includes a channel predictor, a performance predictor, and a link adapter. The channel predictor is configured to predict channel state information for a next packet based on channel state information for the current packet. The performance predictor includes an uncoded performance predictor configured to predict system performance at an input of a decoder based on a modulation type and the predicted channel state information for the next packet, and a decoder input-output performance mapper configured to determine a required coding rate based on a requested system performance and the predicted system performance at the input of the decoder. The link adapter includes a modulation and coding scheme (MCS) updater configured to identify a MCS based on the required coding rate.

Abstract: Conductive lines constituting word lines of memory cells and conductive lines constituting memory cell plate electrodes are formed in the same interconnecting layer in a memory device including a plurality of memory cells each including a capacitor for storing data in an electrical charge form. By forming the capacitors of the memory cells into a planar capacitor configuration, a step due to the capacitors is removed. Thus, a dynamic semiconductor memory device can be formed through CMOS process, and a dynamic semiconductor memory device suitable for merging with logic is achieved. Data of 1 bit is stored by two memory cells, and data can be reliably stored even if the capacitance value of the memory cell is reduced due to the planar type capacitor.

Abstract: After the surface of the substrate is cleaned, an interface layer or an antidiffusion film is formed. A metal oxide film is built upon the antidiffusion film. Annealing is done in an NH3 atmosphere so as to diffuse nitrogen in the metal oxide film. Building of the metal oxide film and diffusion of nitrogen are repeated several times, whereupon annealing is done in an O2 atmosphere. By annealing the film in an O2 atmosphere at a temperature higher than 650° C., the leak current in the metal oxide film is controlled.

Abstract: Source contacts of driver transistors are short-circuited through the use of an internal metal line within a memory cell. This metal line is isolated from memory cells in an adjacent column and extends in a zigzag form in a direction of the columns of memory cells. Individual lines for transmitting the source voltage of driver transistors can be provided for each column, and the source voltage of driver transistors can be adjusted also in units of memory cell columns in the structure of single port memory cell.

Abstract: A trigger producing circuit provides a trigger signal. A delay circuit receives the trigger signal, and provides a delay signal produced by delaying the trigger signal. A clock counter receives clocks, counts the received clocks for a period from reception of the trigger signal to reception of the delay signal, and provides a result of the counting. A determining circuit stores a relationship between the number of clocks and a latency, and determines the latency corresponding to the result of counting provided from the clock counter. A latency register holds the determined latency. A WAIT control circuit externally provides a WAIT signal based on the latency held in the latency register.

Abstract: In an exposure step, a combination of a first photomask and a second mask is used. The first mask has a real pattern corresponding to the pattern actually formed on the film to be processed, and a dummy pattern added for controlling pattern pitch in the first photomask within a prescribed range; and the second photomask has a pattern isolating a real-pattern-formed region from a dummy-pattern-formed region. In forming the pattern, after forming a film to be processed on a substrate, a first mask is formed on the film to be processed, by lithography, using the first photomask, and a second mask is formed on the film to be processed, by lithography, using the second photomask. Thereafter, the film to be processed is etched and removed using the first and second masks as masks to form the pattern.

Abstract: A multi-level semiconductor memory device for storing multi-level data having three or more values is implemented by utilizing a nonvolatile memory device for storing 2-valued data. Identification of successive 16-bit data externally applied is performed with external address bit AA [2], and a storage block is selected with external address bit AA [23]. Upper word data LW and lower word data UW are compressed into byte data of 8 bits, respectively, and stored in a memory cell array.

Abstract: A gate insulating film (13) and a gate electrode (14) of non-single crystalline silicon for forming an nMOS transistor are provided on a silicon substrate (10). Using the gate electrode (14) as a mask, n-type dopants having a relatively large mass number (70 or more) such as As ions or Sb ions are implanted, to form a source/drain region of the nMOS transistor, whereby the gate electrode (14) is amorphized. Subsequently, a silicon oxide film (40) is provided to cover the gate electrode (14), at a temperature which is less than the one at which recrystallization of the gate electrode (14) occurs. Thereafter, thermal processing is performed at a temperature of about 1000° C., whereby high compressive residual stress is exerted on the gate electrode (14), and high tensile stress is applied to a channel region under the gate electrode (14). As a result, carrier mobility of the nMOS transistor is enhanced.

Abstract: A nonvolatile semiconductor memory device includes a semiconductor substrate, a first floating gate formed on a main surface of the semiconductor substrate, a second floating gate formed on the main surface of the semiconductor substrate, a first control gate formed on the first floating gate, a second control gate formed on the second floating gate, an interlayer insulating film, and a gap formed in the interlayer insulating film in at least a portion located between the first and second floating gates. Accordingly, a nonvolatile semiconductor memory device for which variations in threshold voltage of a memory cell can be suppressed and an appropriate read operation can be carried out, as well as a method of manufacturing the nonvolatile semiconductor memory device are provided. Further, a capacitance formed between interconnect lines can be reduced and the drive speed can be improved.

Abstract: In a semiconductor device having element isolation made of a trench-type isolating oxide film 13, large and small dummy patterns 11 of two types, being an active region of a dummy, are located in an isolating region 10, the large dummy patterns 11b are arranged at a position apart from actual patterns 9, and the small dummy patterns 11a are regularly arranged in a gap at around a periphery of the actual patterns 9, whereby uniformity of an abrading rate is improved at a time of abrading an isolating oxide film 13a is improved, and surface flatness of the semiconductor device becomes preferable.