Patents Assigned to Resonac Corporation
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Publication number: 20240101759Abstract: The present invention provides a fluorine-containing ether compound represented by the following Formula. R1-[B]-[A]-CH2—R2—CH2-[C]-[D]-R3 (R2 is a perfluoropolyether chain; [A] is Formula (2-1); [B] is Formula (2-2); [C] is Formula (3-1); [D] is Formula (3-2); R3 is Formula (4); and R1 is a terminal group.Type: ApplicationFiled: December 13, 2021Publication date: March 28, 2024Applicant: Resonac CorporationInventors: Daisuke YAGYU, Tsuyoshi KATO, Naoya FUKUMOTO, Ayano ASANO, Masaki NANKO, Yutaka TANJI, Shoko UETAKE
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Publication number: 20240102908Abstract: This optical cell for sedimentation analysis has a pair of opposing surfaces through which light is transmitted, and two polarizing plates, in which each of the two polarizing plates is disposed in a crossed Nicols state on each of the inner surfaces of the pair of opposing surfaces.Type: ApplicationFiled: December 15, 2021Publication date: March 28, 2024Applicant: RESONAC CORPORATIONInventors: Yasunao MIYAMURA, Ayako NISHIOKA, Yasushi KADOWAKI, Kuniaki YAMATAKE, Masanao HARA, Shigeru YAMAKI, Hideki OHATA
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Patent number: 11938688Abstract: The present invention relates to a laminate including two or more layers of a composite layer including a fiber substrate and a cured product of a thermosetting resin composition, the two or more layers of the composite layer including one or more layer of a composite layer (X) and one or more layer of a composite layer (Y), the composite layer (X) being a layer including a first fiber substrate constituted by first glass fibers, the composite layer (Y) being a layer including a second fiber substrate constituted by second glass fibers, and the second glass fibers having a higher tensile elastic modulus at 25° C. than the first glass fibers, a printed wiring board including the laminate, a semiconductor package, and a method for producing a laminate.Type: GrantFiled: December 18, 2019Date of Patent: March 26, 2024Assignee: RESONAC CORPORATIONInventors: Noriaki Murakami, Ryoichi Uchimura, Masahisa Ose, Kenichi Ohhashi
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Patent number: 11939699Abstract: In the SiC substrate, when resistivities at a plurality of first measurement points that are in a region inside a boundary located 5 mm inward from an outer circumferential end thereof and that include a center and a plurality of measurement points separated by 10 mm from each other in the [11-20] direction or the [?1-120] direction from the center, and at two second measurement points that are located 1 mm inward from the outer circumferential end and located in each of the [11-20] direction from the center and the [?1-120] direction from the center are measured, a difference between the maximum resistivity and the minimum resistivity among the resistivities of each of the plurality of first measurement points and the two second measurement points is 2 m?·cm or less, and a region other than a high nitrogen concentration region called a facet is included.Type: GrantFiled: February 28, 2023Date of Patent: March 26, 2024Assignee: Resonac CorporationInventors: Masato Ito, Hiromasa Suo
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Patent number: 11940503Abstract: A magnetic sensor circuit includes: a first element including series-connected resistor and capacitor, or including only a capacitor; a second element including series-connected resistor and inductor, or including a magnetic sensor sensing a magnetic field by a magnetic impedance effect; a third element including series-connected resistor and capacitor, or including only a capacitor; and a fourth element including a magnetic sensor sensing a magnetic field by a magnetic impedance effect, wherein a first series circuit part including the series-connected first and second elements and a second series circuit part including the series-connected third and fourth elements are connected in parallel, and, when the magnetic field sensed by the magnetic sensor has a predetermined reference value, a product of impedance Z1 of the first element and impedance Z4 of the fourth element and a product of impedance Z2 of the second element and impedance Z3 of the third element are equal.Type: GrantFiled: July 14, 2021Date of Patent: March 26, 2024Assignee: Resonac CorporationInventor: Tatsunori Shino
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Publication number: 20240093405Abstract: A SiC epitaxial wafer according to the present embodiment includes: a SiC substrate; and a SiC epitaxial layer laminated on the SiC substrate, in which a carrier concentration uniformity of the SiC epitaxial layer is less than 3.8%, and the carrier concentration uniformity is a value obtained by dividing, by an average value, a difference between a maximum value and a minimum value of carrier concentrations of the SiC epitaxial layer measured along a straight line passing through a center of the SiC epitaxial layer when seen in a plan view.Type: ApplicationFiled: September 13, 2023Publication date: March 21, 2024Applicant: Resonac CorporationInventors: Kensho TANAKA, Rimpei Kindaichi, Marie Ohuchi
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Publication number: 20240092057Abstract: A resin molded product includes a main body including a design face and a opposite face opposite to the design face and having a first foamed layer formed inside the main body, and a protruding portion located at a periphery of the main body, having a second foamed layer formed inside the protruding portion, and protruding to a thickness direction of the main body and a side opposite to the design face, the protruding portion includes a tip end portion disposed so that a protruding tip portion on the design face extends to a protruding direction of the protruding portion more than a protruding tip portion on the opposite face, and a thickness of the tip end portion is 1.2 mm or less.Type: ApplicationFiled: January 27, 2021Publication date: March 21, 2024Applicant: RESONAC CORPORATIONInventor: Hirofumi SHIOKAWA
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Publication number: 20240093059Abstract: Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.Type: ApplicationFiled: October 18, 2023Publication date: March 21, 2024Applicant: RESONAC CORPORATIONInventors: Emi MIYAZAWA, Tsuyoshi HAYASAKA, Takashi KAWAMORI, Shinichiro SUKATA, Yoshihito INABA, Keisuke NISHIDO
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Publication number: 20240093406Abstract: A SiC epitaxial wafer including: a SiC substrate; and a SiC epitaxial layer stacked on one surface of the SiC substrate, wherein a diameter of the SiC substrate is 195 mm or more, and a warp is 50 ?m or less.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Applicant: Resonac CorporationInventors: Hiromasa SUO, Rimpei Kindaichi, Tamotsu Yamashita
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Patent number: 11932820Abstract: A method for producing a lubricating oil composition of the present embodiment includes an irradiation step of irradiating a fullerene solution in which fullerenes are dissolved in a base oil with radiation, in which the above-described radiation is ultraviolet light or ionizing radiation.Type: GrantFiled: April 23, 2020Date of Patent: March 19, 2024Assignees: Resonac Corporation, MITSUBISHI CORPORATIONInventors: Ryuji Monden, Kunio Kondo
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Publication number: 20240088431Abstract: Provided is a novel solid electrolyte having excellent lithium ion conductivity. The lithium ion conductive solid electrolyte of the present invention includes a chalcogenide having a monoclinic crystal structure, wherein the monoclinic crystal has an a-axis length of 9.690 to 9.711 ?, a b-axis length of 11.520 to 11.531 ?, a c-axis length of 10.680 to 10.695 ?, and an axis angle ? in the range of 90.01 to 90.08°. The all-solid-state battery of the present invention includes a positive electrode having a positive electrode active material, a negative electrode having a negative electrode active material, and a solid electrolyte layer between the positive electrode and the negative electrode, wherein the solid electrolyte layer includes the lithium ion conductive solid electrolyte.Type: ApplicationFiled: December 23, 2021Publication date: March 14, 2024Applicant: Resonac CorporationInventors: Kunchan LEE, Ryosuke SEI
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Patent number: 11926764Abstract: A polishing liquid containing: abrasive grains; a first nitrogen-containing compound; a second nitrogen-containing compound; and water, in which the first nitrogen-containing compound contains at least one selected from the group consisting of (I) a compound having an aromatic ring containing one nitrogen atom in the ring and a hydroxyl group, (II) a compound having an aromatic ring containing one nitrogen atom in the ring and a functional group containing a nitrogen atom, (III) a compound having a 6-membered ring containing two nitrogen atoms in the ring, (IV) a compound having a benzene ring and a ring containing a nitrogen atom in the ring, and (V) a compound having a benzene ring to which two or more functional groups containing a nitrogen atom are bonded, and an HLB value of the second nitrogen-containing compound is 7 or more.Type: GrantFiled: April 2, 2019Date of Patent: March 12, 2024Assignee: RESONAC CORPORATIONInventors: Masayuki Hanano, Hisato Takahashi, Toshio Takizawa
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Patent number: 11930594Abstract: The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when silica filler is highly filled. Specifically, there is provided an adhesive film for a multilayer printed-wiring board, which includes a resin composition layer that is obtained by forming a layer of a resin composition containing: (A) a novolac type phenolic resin in which a dispersity (Mw/Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) ranges from 1.05 to 1.8; (B) an epoxy resin represented by general formula (1); and (C) inorganic filler, on a support film. An average particle size of the (C) inorganic filler in the resin composition layer is 0.1 ?m or more, and a content of the (C) inorganic filler in a resin solid content ranges from 20% to 95% by mass.Type: GrantFiled: August 15, 2016Date of Patent: March 12, 2024Assignee: RESONAC CORPORATIONInventors: Aya Kasahara, Yasuyuki Mizuno, Hikari Murai
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Publication number: 20240079034Abstract: A recording and reproducing device of the present invention includes, a case; at least one recording medium having a disk-shape, a motor configured to rotate the at least one recording medium, a head configured to read or write information from or to the at least one recording medium, and an actuator configured to drive the head to scan in a radial direction of the at least one recording medium which are provided in the case; and a regulating portion configured to, when an external shock is applied to the at least one recording medium, contact an outer peripheral edge of the at least one recording medium to regulate displacements of the at least one recording medium due to bending of the at least one recording medium, wherein the regulating portion includes a regulating member which is rotatable about an axis parallel to a rotation axis of the at least one recording medium.Type: ApplicationFiled: September 5, 2023Publication date: March 7, 2024Applicant: Resonac CorporationInventor: Fuminobu OOHASHI
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Publication number: 20240079029Abstract: A recording and reproducing device of the present invention includes, a case; at least one recording medium having a disk-shape, a motor configured to rotate the at least one recording medium, a head configured to read or write information from or to the at least one recording medium, and an actuator configured to drive the head to scan in a radial direction of the at least one recording medium which are provided in the case; and a regulating portion configured to, when an external shock is applied to the at least one recording medium, contact an outer peripheral edge of the at least one recording medium to regulate displacements of the at least one recording medium due to bending of the at least one recording medium, wherein the regulating portion includes a regulating member which is movable in an axial direction parallel to a rotation axis of the at least one recording medium.Type: ApplicationFiled: September 5, 2023Publication date: March 7, 2024Applicant: Resonac CorporationInventor: Fuminobu OOHASHI
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Publication number: 20240079033Abstract: A recording and reproducing device includes, a case; at least one recording medium having a disk-shape, a motor configured to rotate the at least one recording medium, a head configured to read or write information from or to the at least one recording medium, and an actuator configured to drive the head to scan in a radial direction of the at least one recording medium which are provided in the case; and a regulating portion configured to, when an external shock is applied to the at least one recording medium, contact an outer peripheral edge of the at least one recording medium to regulate displacements of the at least one recording medium due to bending of the at least one recording medium, wherein the regulating portion has a regulating member displaced between a position away from the outer peripheral edge of the at least one recording medium and a contact-possible position or a contacting position.Type: ApplicationFiled: September 1, 2023Publication date: March 7, 2024Applicant: Resonac CorporationInventor: Fuminobu OOHASHI
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Patent number: 11919875Abstract: A fluorine-containing ether compound represented by the formula (1) is provided. The fluorine-containing ether compound is represented by the following formula (1). R1—R2—CH2—R3—CH2—R4 (1) (R3 is a perfluoropolyether chain; R1 is the formula (2), a in the formula (2) is an integer of 2 or 3, R5 and R6 are the same or different substituents. R5 and R6 may form a ring structure together with a nitrogen atom; R2 is the formula (3), b in the formula (3) is an integer of 1 to 3; R4 is a terminal group having two or three polar groups, in which individual polar groups bond to different carbon atoms and the carbon atoms to which the polar groups bond are bonded to each other through a linking group having a carbon atom to which the polar groups do not bond.Type: GrantFiled: September 8, 2020Date of Patent: March 5, 2024Assignee: Resonac CorporationInventor: Natsumi Shibata
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Patent number: 11919995Abstract: An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.Type: GrantFiled: February 18, 2019Date of Patent: March 5, 2024Assignee: RESONAC CORPORATIONInventors: Naoki Maruyama, Tomoko Higashiuchi, Kazumasa Fukuda, Hideyuki Katagi, Yuki Nakamura, Yoshitaka Takezawa
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Publication number: 20240066502Abstract: To provide a means removing chlorine gas, which can remove chlorine gas contained in, for example, exhaust gas with high efficiency and does not require frequent exchange. A chlorine gas decomposition catalyst including a metal oxide (X), wherein the metal oxide (X) includes an oxide (X1) of at least one element selected from the group consisting of Ce and Co.Type: ApplicationFiled: December 23, 2021Publication date: February 29, 2024Applicant: Resonac CorporationInventors: Kunchan LEE, Kazuki IWAGAKI, Toshinori MORIYA, Hitoshi ATOBE
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Patent number: 11915799Abstract: A polymer physical property prediction device includes a processor, and a memory storing program instructions that cause the processor to read a structural unit from a storage unit and use the structural unit to calculate numbers each indicating how many substructures are in a polymer, the polymer being formed of repetition of the structural unit, calculate a number indicating how many atoms are in the structural unit, calculate number densities of the substructures from the numbers of substructures and the number of atoms in the structural unit, construct a regression model that predicts a physical property value by using an experimental value of a physical property of the polymer and the number densities of the substructures, input a polymer structure of which the physical property value is to be predicted, and predict the physical property value corresponding to the input polymer structure by using the regression model.Type: GrantFiled: September 1, 2020Date of Patent: February 27, 2024Assignee: RESONAC CORPORATIONInventors: Takuya Minami, Yoshishige Okuno