Patents Assigned to Resonac Corporation
  • Publication number: 20240101759
    Abstract: The present invention provides a fluorine-containing ether compound represented by the following Formula. R1-[B]-[A]-CH2—R2—CH2-[C]-[D]-R3 (R2 is a perfluoropolyether chain; [A] is Formula (2-1); [B] is Formula (2-2); [C] is Formula (3-1); [D] is Formula (3-2); R3 is Formula (4); and R1 is a terminal group.
    Type: Application
    Filed: December 13, 2021
    Publication date: March 28, 2024
    Applicant: Resonac Corporation
    Inventors: Daisuke YAGYU, Tsuyoshi KATO, Naoya FUKUMOTO, Ayano ASANO, Masaki NANKO, Yutaka TANJI, Shoko UETAKE
  • Publication number: 20240102908
    Abstract: This optical cell for sedimentation analysis has a pair of opposing surfaces through which light is transmitted, and two polarizing plates, in which each of the two polarizing plates is disposed in a crossed Nicols state on each of the inner surfaces of the pair of opposing surfaces.
    Type: Application
    Filed: December 15, 2021
    Publication date: March 28, 2024
    Applicant: RESONAC CORPORATION
    Inventors: Yasunao MIYAMURA, Ayako NISHIOKA, Yasushi KADOWAKI, Kuniaki YAMATAKE, Masanao HARA, Shigeru YAMAKI, Hideki OHATA
  • Patent number: 11938688
    Abstract: The present invention relates to a laminate including two or more layers of a composite layer including a fiber substrate and a cured product of a thermosetting resin composition, the two or more layers of the composite layer including one or more layer of a composite layer (X) and one or more layer of a composite layer (Y), the composite layer (X) being a layer including a first fiber substrate constituted by first glass fibers, the composite layer (Y) being a layer including a second fiber substrate constituted by second glass fibers, and the second glass fibers having a higher tensile elastic modulus at 25° C. than the first glass fibers, a printed wiring board including the laminate, a semiconductor package, and a method for producing a laminate.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: March 26, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Noriaki Murakami, Ryoichi Uchimura, Masahisa Ose, Kenichi Ohhashi
  • Patent number: 11939699
    Abstract: In the SiC substrate, when resistivities at a plurality of first measurement points that are in a region inside a boundary located 5 mm inward from an outer circumferential end thereof and that include a center and a plurality of measurement points separated by 10 mm from each other in the [11-20] direction or the [?1-120] direction from the center, and at two second measurement points that are located 1 mm inward from the outer circumferential end and located in each of the [11-20] direction from the center and the [?1-120] direction from the center are measured, a difference between the maximum resistivity and the minimum resistivity among the resistivities of each of the plurality of first measurement points and the two second measurement points is 2 m?·cm or less, and a region other than a high nitrogen concentration region called a facet is included.
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: March 26, 2024
    Assignee: Resonac Corporation
    Inventors: Masato Ito, Hiromasa Suo
  • Patent number: 11940503
    Abstract: A magnetic sensor circuit includes: a first element including series-connected resistor and capacitor, or including only a capacitor; a second element including series-connected resistor and inductor, or including a magnetic sensor sensing a magnetic field by a magnetic impedance effect; a third element including series-connected resistor and capacitor, or including only a capacitor; and a fourth element including a magnetic sensor sensing a magnetic field by a magnetic impedance effect, wherein a first series circuit part including the series-connected first and second elements and a second series circuit part including the series-connected third and fourth elements are connected in parallel, and, when the magnetic field sensed by the magnetic sensor has a predetermined reference value, a product of impedance Z1 of the first element and impedance Z4 of the fourth element and a product of impedance Z2 of the second element and impedance Z3 of the third element are equal.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: March 26, 2024
    Assignee: Resonac Corporation
    Inventor: Tatsunori Shino
  • Publication number: 20240093405
    Abstract: A SiC epitaxial wafer according to the present embodiment includes: a SiC substrate; and a SiC epitaxial layer laminated on the SiC substrate, in which a carrier concentration uniformity of the SiC epitaxial layer is less than 3.8%, and the carrier concentration uniformity is a value obtained by dividing, by an average value, a difference between a maximum value and a minimum value of carrier concentrations of the SiC epitaxial layer measured along a straight line passing through a center of the SiC epitaxial layer when seen in a plan view.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 21, 2024
    Applicant: Resonac Corporation
    Inventors: Kensho TANAKA, Rimpei Kindaichi, Marie Ohuchi
  • Publication number: 20240092057
    Abstract: A resin molded product includes a main body including a design face and a opposite face opposite to the design face and having a first foamed layer formed inside the main body, and a protruding portion located at a periphery of the main body, having a second foamed layer formed inside the protruding portion, and protruding to a thickness direction of the main body and a side opposite to the design face, the protruding portion includes a tip end portion disposed so that a protruding tip portion on the design face extends to a protruding direction of the protruding portion more than a protruding tip portion on the opposite face, and a thickness of the tip end portion is 1.2 mm or less.
    Type: Application
    Filed: January 27, 2021
    Publication date: March 21, 2024
    Applicant: RESONAC CORPORATION
    Inventor: Hirofumi SHIOKAWA
  • Publication number: 20240093059
    Abstract: Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.
    Type: Application
    Filed: October 18, 2023
    Publication date: March 21, 2024
    Applicant: RESONAC CORPORATION
    Inventors: Emi MIYAZAWA, Tsuyoshi HAYASAKA, Takashi KAWAMORI, Shinichiro SUKATA, Yoshihito INABA, Keisuke NISHIDO
  • Publication number: 20240093406
    Abstract: A SiC epitaxial wafer including: a SiC substrate; and a SiC epitaxial layer stacked on one surface of the SiC substrate, wherein a diameter of the SiC substrate is 195 mm or more, and a warp is 50 ?m or less.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Applicant: Resonac Corporation
    Inventors: Hiromasa SUO, Rimpei Kindaichi, Tamotsu Yamashita
  • Patent number: 11932820
    Abstract: A method for producing a lubricating oil composition of the present embodiment includes an irradiation step of irradiating a fullerene solution in which fullerenes are dissolved in a base oil with radiation, in which the above-described radiation is ultraviolet light or ionizing radiation.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: March 19, 2024
    Assignees: Resonac Corporation, MITSUBISHI CORPORATION
    Inventors: Ryuji Monden, Kunio Kondo
  • Publication number: 20240088431
    Abstract: Provided is a novel solid electrolyte having excellent lithium ion conductivity. The lithium ion conductive solid electrolyte of the present invention includes a chalcogenide having a monoclinic crystal structure, wherein the monoclinic crystal has an a-axis length of 9.690 to 9.711 ?, a b-axis length of 11.520 to 11.531 ?, a c-axis length of 10.680 to 10.695 ?, and an axis angle ? in the range of 90.01 to 90.08°. The all-solid-state battery of the present invention includes a positive electrode having a positive electrode active material, a negative electrode having a negative electrode active material, and a solid electrolyte layer between the positive electrode and the negative electrode, wherein the solid electrolyte layer includes the lithium ion conductive solid electrolyte.
    Type: Application
    Filed: December 23, 2021
    Publication date: March 14, 2024
    Applicant: Resonac Corporation
    Inventors: Kunchan LEE, Ryosuke SEI
  • Patent number: 11926764
    Abstract: A polishing liquid containing: abrasive grains; a first nitrogen-containing compound; a second nitrogen-containing compound; and water, in which the first nitrogen-containing compound contains at least one selected from the group consisting of (I) a compound having an aromatic ring containing one nitrogen atom in the ring and a hydroxyl group, (II) a compound having an aromatic ring containing one nitrogen atom in the ring and a functional group containing a nitrogen atom, (III) a compound having a 6-membered ring containing two nitrogen atoms in the ring, (IV) a compound having a benzene ring and a ring containing a nitrogen atom in the ring, and (V) a compound having a benzene ring to which two or more functional groups containing a nitrogen atom are bonded, and an HLB value of the second nitrogen-containing compound is 7 or more.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: March 12, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Masayuki Hanano, Hisato Takahashi, Toshio Takizawa
  • Patent number: 11930594
    Abstract: The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when silica filler is highly filled. Specifically, there is provided an adhesive film for a multilayer printed-wiring board, which includes a resin composition layer that is obtained by forming a layer of a resin composition containing: (A) a novolac type phenolic resin in which a dispersity (Mw/Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) ranges from 1.05 to 1.8; (B) an epoxy resin represented by general formula (1); and (C) inorganic filler, on a support film. An average particle size of the (C) inorganic filler in the resin composition layer is 0.1 ?m or more, and a content of the (C) inorganic filler in a resin solid content ranges from 20% to 95% by mass.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: March 12, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Aya Kasahara, Yasuyuki Mizuno, Hikari Murai
  • Publication number: 20240079034
    Abstract: A recording and reproducing device of the present invention includes, a case; at least one recording medium having a disk-shape, a motor configured to rotate the at least one recording medium, a head configured to read or write information from or to the at least one recording medium, and an actuator configured to drive the head to scan in a radial direction of the at least one recording medium which are provided in the case; and a regulating portion configured to, when an external shock is applied to the at least one recording medium, contact an outer peripheral edge of the at least one recording medium to regulate displacements of the at least one recording medium due to bending of the at least one recording medium, wherein the regulating portion includes a regulating member which is rotatable about an axis parallel to a rotation axis of the at least one recording medium.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 7, 2024
    Applicant: Resonac Corporation
    Inventor: Fuminobu OOHASHI
  • Publication number: 20240079029
    Abstract: A recording and reproducing device of the present invention includes, a case; at least one recording medium having a disk-shape, a motor configured to rotate the at least one recording medium, a head configured to read or write information from or to the at least one recording medium, and an actuator configured to drive the head to scan in a radial direction of the at least one recording medium which are provided in the case; and a regulating portion configured to, when an external shock is applied to the at least one recording medium, contact an outer peripheral edge of the at least one recording medium to regulate displacements of the at least one recording medium due to bending of the at least one recording medium, wherein the regulating portion includes a regulating member which is movable in an axial direction parallel to a rotation axis of the at least one recording medium.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 7, 2024
    Applicant: Resonac Corporation
    Inventor: Fuminobu OOHASHI
  • Publication number: 20240079033
    Abstract: A recording and reproducing device includes, a case; at least one recording medium having a disk-shape, a motor configured to rotate the at least one recording medium, a head configured to read or write information from or to the at least one recording medium, and an actuator configured to drive the head to scan in a radial direction of the at least one recording medium which are provided in the case; and a regulating portion configured to, when an external shock is applied to the at least one recording medium, contact an outer peripheral edge of the at least one recording medium to regulate displacements of the at least one recording medium due to bending of the at least one recording medium, wherein the regulating portion has a regulating member displaced between a position away from the outer peripheral edge of the at least one recording medium and a contact-possible position or a contacting position.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Applicant: Resonac Corporation
    Inventor: Fuminobu OOHASHI
  • Patent number: 11919875
    Abstract: A fluorine-containing ether compound represented by the formula (1) is provided. The fluorine-containing ether compound is represented by the following formula (1). R1—R2—CH2—R3—CH2—R4 (1) (R3 is a perfluoropolyether chain; R1 is the formula (2), a in the formula (2) is an integer of 2 or 3, R5 and R6 are the same or different substituents. R5 and R6 may form a ring structure together with a nitrogen atom; R2 is the formula (3), b in the formula (3) is an integer of 1 to 3; R4 is a terminal group having two or three polar groups, in which individual polar groups bond to different carbon atoms and the carbon atoms to which the polar groups bond are bonded to each other through a linking group having a carbon atom to which the polar groups do not bond.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: March 5, 2024
    Assignee: Resonac Corporation
    Inventor: Natsumi Shibata
  • Patent number: 11919995
    Abstract: An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.
    Type: Grant
    Filed: February 18, 2019
    Date of Patent: March 5, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Naoki Maruyama, Tomoko Higashiuchi, Kazumasa Fukuda, Hideyuki Katagi, Yuki Nakamura, Yoshitaka Takezawa
  • Publication number: 20240066502
    Abstract: To provide a means removing chlorine gas, which can remove chlorine gas contained in, for example, exhaust gas with high efficiency and does not require frequent exchange. A chlorine gas decomposition catalyst including a metal oxide (X), wherein the metal oxide (X) includes an oxide (X1) of at least one element selected from the group consisting of Ce and Co.
    Type: Application
    Filed: December 23, 2021
    Publication date: February 29, 2024
    Applicant: Resonac Corporation
    Inventors: Kunchan LEE, Kazuki IWAGAKI, Toshinori MORIYA, Hitoshi ATOBE
  • Patent number: 11915799
    Abstract: A polymer physical property prediction device includes a processor, and a memory storing program instructions that cause the processor to read a structural unit from a storage unit and use the structural unit to calculate numbers each indicating how many substructures are in a polymer, the polymer being formed of repetition of the structural unit, calculate a number indicating how many atoms are in the structural unit, calculate number densities of the substructures from the numbers of substructures and the number of atoms in the structural unit, construct a regression model that predicts a physical property value by using an experimental value of a physical property of the polymer and the number densities of the substructures, input a polymer structure of which the physical property value is to be predicted, and predict the physical property value corresponding to the input polymer structure by using the regression model.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: February 27, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Takuya Minami, Yoshishige Okuno