Patents Assigned to Resonac Corporation
  • Publication number: 20230355646
    Abstract: There are provided an autophagy activator comprising methyl hesperidin as an active ingredient, and a composition for activating autophagy containing the autophagy activator and a pharmaceutically acceptable carrier.
    Type: Application
    Filed: September 17, 2021
    Publication date: November 9, 2023
    Applicant: Resonac Corporation
    Inventor: Yuko NAKAGAMI
  • Patent number: 11810834
    Abstract: A thermal conduction sheet includes graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles. When the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet, when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N·mm or higher at 25° C.
    Type: Grant
    Filed: October 4, 2022
    Date of Patent: November 7, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Mika Kobune, Michiaki Yajima
  • Patent number: 11807837
    Abstract: Provided is a composition having high affinity for the surface of an adhesive, and excellent long-term storage stability. This composition comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and an aprotic solvent, wherein the aprotic solvent includes (A) an N-substituted amide compound having 4 or more carbon atoms and not containing active hydrogen on a nitrogen atom, and (B) an ether compound.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: November 7, 2023
    Assignee: Resonac Corporation
    Inventors: Susumu Nakazaki, Kuniaki Miyahara, Tomoyuki Fukuyo
  • Publication number: 20230348346
    Abstract: Provided is an octafluorocyclobutane purification method capable of removing contained fluorocarbons to yield a highly pure octafluorocyclobutane. The octafluorocyclobutane purification method includes a decomposition step of mixing a crude octafluorocyclobutane containing octafluorocyclobutane and fluorocarbons as impurities with oxygen gas or air to give a mixed gas containing the oxygen gas or air at a concentration of 1% by volume or more and 90% by volume or less and bringing the mixed gas into contact with an impurity decomposing agent containing alumina and an alkaline earth metal compound and to decompose fluorocarbons, at a temperature of 100° C. or more and 500° C. or less to decompose the fluorocarbons and a concentration step of removing, from the mixed gas in which the fluorocarbons have been decomposed in the decomposition step, the gas containing oxygen gas or air (except octafluorocyclobutane) to increase the concentration of the octafluorocyclobutane.
    Type: Application
    Filed: July 6, 2021
    Publication date: November 2, 2023
    Applicant: Resonac Corporation
    Inventors: Jun DOU, Hideyuki KURIHARA
  • Publication number: 20230352798
    Abstract: Provided is a composition that can form a coating film having excellent surface smoothness and high heat deformation resistance in a coating liquid for a paint mainly containing a polymer, an ink, an adhesive, and an anode, a cathode, or a separator of a lithium ion battery, for example. A coating liquid composition includes a filler, a solvent, a dispersant, and a thickener. When the coating liquid composition is applied to a substrate to form a coating film having a thickness of 0.5 to 20 ?m, the coating film has a shrinkage rate of 15.0% or less after heating at 170° C. for 15 minutes.
    Type: Application
    Filed: September 14, 2021
    Publication date: November 2, 2023
    Applicant: Resonac Corporation
    Inventors: Jun KONISHI, Atsushi SUGAWARA
  • Publication number: 20230348735
    Abstract: Provided is a coating liquid composition that is less likely to deform even when heat is applied to a coating liquid for a paint mainly containing a polymer, an ink, an adhesive, and an anode, a cathode, or a separator of a lithium ion battery, for example. The coating liquid composition includes a filler, a solvent, a dispersant, and a thickener. When the coating liquid composition is applied to a substrate to form a coating film having a thickness of 0.5 to 20 ?m, the coating film has a shrinkage rate of 20.0% or less when heating at 200° C. for 15 minutes.
    Type: Application
    Filed: September 14, 2021
    Publication date: November 2, 2023
    Applicant: Resonac Corporation
    Inventors: Jun KONISHI, Atsushi SUGAWARA
  • Patent number: 11804631
    Abstract: As an adhesive for the lamination of metal foil and a resin film, an adhesive that can stably exhibit good adhesiveness and moreover can provide a laminate having better electrolytic solution resistance and heat resistance is provided. An adhesive comprising a polyolefin resin (A) having a carboxyl group; and polyisocyanate compounds (B), wherein the polyisocyanate compounds (B) comprise a polymer of a saturated aliphatic polyisocyanate (B1), a polymer of a saturated alicyclic polyisocyanate (B2), and a polymer of an aromatic polyisocyanate (B3).
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: October 31, 2023
    Assignee: Resonac Corporation
    Inventors: Hiroto Kouka, Yasuhiro Nakagawa
  • Patent number: 11795293
    Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: October 24, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Kazuya Kiguchi, Tomoo Nishiyama, Daisuke Fujimoto, Norihiko Sakamoto
  • Patent number: 11797551
    Abstract: A document retrieval apparatus includes a processor which receives an input of a keyword, acquires an author's name and a document file from a digital document database which stores document files of text data obtained by performing a character recognition process with respect to document image data of handwritten documents, and names of authors who wrote the handwritten documents, references an associating keyword database which stores information associating the authors' names, keywords, and associating keywords, to acquire an associating keyword of the input keyword, from the received input keyword and the acquired author's name, searches the acquired document file, using the input keyword and the acquired associating keyword, and outputs a search result of the searching.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: October 24, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Takuya Minami, Yu Kawahara, Shimpei Takemoto, Eriko Takeda, Yoshishige Okuno
  • Patent number: 11795577
    Abstract: A SiC epitaxial wafer includes a SiC substrate and an epitaxial layer laminated on the SiC substrate, wherein the epitaxial layer contains an impurity element which determines the conductivity type of the epitaxial layer and boron which has a conductivity type different from the conductivity type of the impurity element, and the concentration of boron is less than 1.0×1014 cm?3 at any position in the plane of the epitaxial layer.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: October 24, 2023
    Assignee: Resonac Corporation
    Inventors: Kensho Tanaka, Yoshikazu Umeta
  • Patent number: 11795411
    Abstract: A lubricating oil composition is provided, including a fullerene and a base oil, in which the fullerene is a fullerene sublimate, and the base oil is a multiply alkylated cyclopentane oil or an ionic liquid.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: October 24, 2023
    Assignee: Resonac Corporation
    Inventors: Ryuji Monden, Kunio Kondo
  • Publication number: 20230330968
    Abstract: A laminated structure includes a first member, a second member that faces the first member, and a filling member that is disposed between the first member and the second member, and a difference between a value of a relative permittivity of a member with a largest relative permittivity and a value of a relative permittivity of a member with a lowest relative permittivity among the first member, the second member and the filling member is 1.0 or less.
    Type: Application
    Filed: June 16, 2021
    Publication date: October 19, 2023
    Applicant: RESONAC CORPORATION
    Inventors: Naoko MITSUISHI, Takao SHIMOJYO, Hiroaki FUJINO, Shingo NAKANO, Hirofumi SHIOKAWA, Kouji YAMADA, Masumi MORIHARA, Masahiro IWANAGA
  • Publication number: 20230330636
    Abstract: Provided is a method for producing an ethyl acetate production catalyst that has high producibility and exceptional catalytic performance, the catalyst being such that a heteropolyacid and/or a salt thereof is carried near the surface of a carrier. A method for producing an ethyl acetate production catalyst, the method including, in the stated order: (1) an impregnation step in which a silica carrier is impregnated with an aqueous solution of a heteropolyacid or a salt thereof, constituting 80-105 vol % of the saturation absorption capacity of the carrier, to form an impregnated body; and (2) a drying step in which the impregnated body is dried at a fixed-rate drying speed of 5-300 gH2O/kgsupcat·min.
    Type: Application
    Filed: August 23, 2021
    Publication date: October 19, 2023
    Applicant: Resonac Corporation
    Inventors: Takuro SASAKI, Shintaro ITAGAKI, Yasuhiro HOSAGI, Yasuhiro IWAMA
  • Patent number: 11787957
    Abstract: The present invention relates to a coating liquid comprising an aerogel particle, a binder resin, a fibrous substance having a fiber length of 1.5 mm or more, and a liquid medium.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: October 17, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Hiroyuki Izumi, Tatsuya Makino, Tomohiko Kotake, Satoshi Takayasu, Kaito Kogure
  • Patent number: 11787882
    Abstract: Provided is a propylene homopolymer or a copolymer of propylene and a 30 wt % or less ?-olefin having 2 or 4 to 8 carbon atoms, having a intrinsic viscosity of more than 20 dl/g, as measured in a tetralin solvent at 135° C.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: October 17, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Akihiro Otsubo, Akihiro Kamimura
  • Patent number: 11779877
    Abstract: A method for removing a halogen fluoride in a mixed gas by reacting the mixed gas containing a halogen fluoride including bromine or iodine with a removing agent, wherein the removing agent is a chloride, bromide or iodide of potassium, sodium, magnesium, calcium and barium. Also disclosed is a quantitative analysis method as well as a quantitative analyzer for a gas component contained in a hydrogen fluoride mixed gas, the method characterized by reacting a mixed gas containing a halogen fluoride and another gas component with a removing agent, thereby removing the halogen fluoride in the mixed gas, further removing produced by-products, and quantitatively analyzing a residual gas by a gas chromatograph.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: October 10, 2023
    Assignee: Resonac Corporation
    Inventors: Atsushi Suzuki, Kazuma Matsui
  • Patent number: 11780735
    Abstract: A method for producing an aerogel composite includes drying a wet gel generated from a sol comprising a silica particles, and at least one selected from the group consisting of a silicon compound having a hydrolyzable functional group in a molecule, and a hydrolysis product of the silicon compound.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: October 10, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Tomohiko Kotake, Masato Miyatake, Hikari Murai
  • Patent number: 11781244
    Abstract: A seed crystal for single crystal 4H-SiC growth of the present invention is a disk-shaped seed crystal for single crystal 4H-SiC growth having a diameter of more than 150 mm and having a thickness within a range of more than or equal to 1 mm and less than or equal to 0.03 times of the diameter, in which one surface on which the single crystal 4H-SiC is grown is a mirror surface and an Ra of the other surface is more than 10 nm, and an absolute value of magnitude of waviness in a state where the seed crystal is freely deformed so that an internal stress distribution is reduced is less than or equal to 12 ?m.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 10, 2023
    Assignees: RESONAC CORPORATION, DENSO CORPORATION
    Inventors: Takanori Kido, Masatake Nagaya, Hidetaka Takaba
  • Patent number: 11781092
    Abstract: Provided is a composition which has an excellent affinity with the surface of an adhesive agent and can achieve a high etching rate. The composition according to one embodiment comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and, as an aprotic solvent, (A) an N-substituted amide compound having no active hydrogen on a nitrogen atom, and (B) a dipropylene glycol dimethyl ether, wherein (B) the dipropylene glycol dimethyl ether has the percentage of a structural isomer represented by formula (1) of at least 50 mass % with respect to the total amount of (B) the dipropylene glycol dimethyl ether.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: October 10, 2023
    Assignee: Resonac Corporation
    Inventor: Kotaro Hayashi
  • Publication number: 20230313017
    Abstract: A thermally conductive composition contains a resin composition and a thermally conductive filler, wherein the resin composition contains a liquid silicone resin having a viscosity ranging from 20 mPa·s to 200,000,000 mPa·s at 25° C. as measured according to JIS Z8803:2011 and a polysiloxane compound having at least one hydroxy group not directly bound to a silicon atom at an end, and having no vinyl group; the mass ratio of the liquid silicone resin to the polysiloxane compound [the liquid silicone resin/the polysiloxane compound] is 50/50 or more and less than 90/10, the content of the thermally conductive filler ranges from 300 parts by mass to 5,000 parts by mass with respect to 100 parts by mass of the resin composition, and a cured product of the thermally conductive composition has a thermal conductivity of 1.0 W/mk or more as measured according to ISO22007-2.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 5, 2023
    Applicant: Resonac Corporation
    Inventors: Hajime FUNAHASHI, Hikaru Satoh, Hajime Yukutake, Ikue Kobayashi, Takeshi Iemura