Abstract: Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.
Type:
Grant
Filed:
January 17, 2020
Date of Patent:
August 22, 2023
Assignees:
Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
Inventors:
Lingli Duan, Chen Chen, Tong Sun, Zukhra I. Niazimbetova, Maria Anna Rzeznik
Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.
Type:
Grant
Filed:
July 8, 2021
Date of Patent:
August 22, 2023
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Charlotte A. Cutler, Li Cui, Shintaro Yamada, Paul J. LaBeaume, Suzanne M. Coley, James F. Cameron, Daniel Greene
Abstract: A chemical mechanical polishing composition includes water, colloidal silica abrasive particles with a silica core containing a nitrogen species, a cerium compound coating including cerium oxide, cerium hydroxide or mixtures thereof, and a positive zeta potential, optionally an oxidizing agent, optionally a pH adjusting agent, optionally a biocide and optionally a surfactant. The chemical mechanical polishing composition has a pH of less than 7. Also described is a method of polishing a substrate containing silicon dioxide and a method of making the composite colloidal silica particles with the coating of cerium oxide, cerium hydroxide or mixtures thereof. The chemical mechanical polishing composition can be used to enhance the removal of silicon dioxide from a substrate in an acid environment.
Type:
Grant
Filed:
February 23, 2022
Date of Patent:
August 8, 2023
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Abstract: The invention provides a polymer-polymer composite polishing pad useful for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The polymer-polymer composite polishing pad includes a polishing layer having a polishing surface and a polymeric matrix forming the polishing layer. The polymer matrix is hydrophilic as measured with distilled water at a pH of 7 at a surface roughness of 10 ?m rms after soaking in distilled water for five minutes. Cationic fluoropolymer particles having nitrogen-containing end groups are embedded in the polymeric matrix. The cationic fluoropolymer particles can increase polishing removal rate of substrate on a patterned wafer when polishing with slurries containing anionic colloidal silica.
Type:
Grant
Filed:
June 10, 2019
Date of Patent:
August 1, 2023
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Abstract: Disclosed is a novel organometallic compound in which a main ligand (LA) has a fused ring structure including a thiophene group. The organometallic compound acts as a dopant of a phosphorescent light-emitting layer of an organic light-emitting diode. Thus, an operation voltage of the diode is lowered, and luminous efficiency and a lifespan thereof are improved.
Type:
Application
Filed:
December 23, 2022
Publication date:
June 29, 2023
Applicants:
LG DISPLAY CO., LTD., ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Inventors:
Kusun CHOUNG, Gyuhyeong KIM, Yoojeong JEONG, Hansol PARK, Kyoung-Jin PARK, Hyun KIM, Jin Ri HONG, Yeon Gun LEE
Abstract: Disclosed is a novel organometallic compound represented by following Chemical Formula 1. The organometallic compound acts as a dopant of a phosphorescent light-emitting layer of an organic light-emitting diode.
Type:
Application
Filed:
December 19, 2022
Publication date:
June 29, 2023
Applicants:
LG DISPLAY CO., LTD., ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Inventors:
Hansol PARK, Yoojeong JEONG, Kusun CHOUNG, Kyoung-Jin PARK, Hyun KIM, Jin Ri HONG, Yeon Gun LEE
Abstract: Disclosed is a novel organometallic compound in which a main ligand (LA) has a fused ring structure including a thiophene group. The organometallic compound acts as a dopant of a phosphorescent light-emitting layer of an organic light-emitting diode. Thus, an operation voltage of the diode is lowered, and luminous efficiency and a lifespan thereof are improved.
Type:
Application
Filed:
December 23, 2022
Publication date:
June 29, 2023
Applicants:
LG DISPLAY CO., LTD., ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Inventors:
Yoojeong JEONG, Hansol PARK, Kusun CHOUNG, Kyoung-Jin PARK, Hyun KIM, Jin Ri HONG, Yeon Gun LEE
Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
Type:
Grant
Filed:
April 1, 2022
Date of Patent:
June 27, 2023
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventors:
Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
Abstract: The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is prepared by extruding a compounded photopolymerizable composition followed by exposure to UV light.
Type:
Grant
Filed:
October 13, 2021
Date of Patent:
June 20, 2023
Assignees:
Rohm and Haas Electronic Materials CMP Holdings, Inc., DuPont Electronics, Inc.
Inventors:
Bainian Qian, Robert M. Blomquist, Lyla M. El-Sayed, Michael E. Mills, Kancharla-Arun Reddy, Bradley K. Taylor, Shijing Xia
Abstract: The invention provides a method of forming porous polyurethane polishing pad that includes feeding liquid polyurethane onto a web sheet with a doctor blade while back tensioning the web. Coagulating liquid polyurethane onto the web sheet forms a two-layer substrate. The two-layer substrate has a porous matrix wherein the porous matrix has large pores extending upward from a base surface and open to an upper surface. Spring-arm sections connect lower and upper sections of the large pores.
Type:
Grant
Filed:
April 18, 2020
Date of Patent:
June 6, 2023
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Abstract: The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.
Type:
Grant
Filed:
November 30, 2020
Date of Patent:
May 2, 2023
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventors:
Colin Hayes, Colin Calabrese, Michael K. Gallagher, Kevin Y. Wang, Robert K. Barr
Abstract: The invention provides a polymer-polymer composite polishing pad useful for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The polymer-polymer composite polishing pad includes a polishing layer having a polishing surface for polishing or planarizing the substrate; a polymeric matrix forming the polishing layer and including gas-filled or liquid-filled polymeric microelements; and fluoropolymer particles embedded in the polymeric matrix. The fluoropolymer particles have a tensile strength lower than the tensile strength of the polymeric matrix wherein diamond abrasive materials cut the fluoropolymer to form a reduced number of pad debris particles in the 1 ?m to 10 ?m size range.
Type:
Grant
Filed:
June 10, 2019
Date of Patent:
May 2, 2023
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Inventors:
Nan-Rong Chiou, Joseph So, Mohammad T. Islam, Matthew R. Gadinski, Youngrae Park, George C. Jacob
Abstract: A polishing pad useful in chemical mechanical polishing comprising a polishing portion having a top polishing surface and comprising a polishing material an opening through the polishing pad, and a transparent window within the opening in the polishing pad, the transparent window being secured to the polishing pad and being transparent to at least one of magnetic and optical signals, the transparent window having a thickness and a top surface having a plurality of elements separated by interconnected recesses to provide a pattern in the top surface that includes recesses for improved deflection into a cavity in the polishing pad during polishing.
Type:
Grant
Filed:
June 24, 2020
Date of Patent:
April 25, 2023
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Inventors:
Mauricio E. Guzman, Nestor A. Vasquez, Matthew R. Gadinski, Michael E. Mills
Abstract: Disclosed is an organometallic compound represented by a following Chemical Formula 1. The organometallic compound acts as a dopant of a light-emitting layer of an organic light-emitting diode. Thus, operation voltage of the diode is lowered, and luminous efficiency and lifespan thereof are improved: Ir(LA)m(LB)n??[Chemical Formula 1] where in the Chemical Formula 1, LA represents a main ligand, and is one selected from a group consisting of Chemical Formula 2-1, Chemical Formula 2-2, and Chemical Formula 2-3, LB denotes an ancillary ligand represented by a Chemical Formula 3, each of m and n denotes a number of the ligands bound to Ir (iridium), and m is 1, 2 or 3, and n is 0, 1 or 2, and a sum of m and n is 3.
Type:
Application
Filed:
July 26, 2022
Publication date:
April 20, 2023
Applicants:
LG DISPLAY CO., LTD., ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Inventors:
Kusun CHOUNG, Hansol PARK, Yoojeong JEONG, Kyoung-Jin PARK, Hyun KIM, Jin Ri HONG, Yeon Gun LEE
Abstract: Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.
Abstract: Disclosed is an organometallic compound represented by a following Chemical Formula 1. The organometallic compound acts as a dopant of a light-emitting layer of an organic light-emitting diode.
Type:
Application
Filed:
July 25, 2022
Publication date:
April 13, 2023
Applicants:
LG DISPLAY CO., LTD., ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Inventors:
Kusun CHOUNG, Hansol PARK, Yoojeong JEONG, Kyoung-Jin PARK, Hyun KIM, Jin Ri HONG, Yeon Gun LEE
Abstract: A monomer has the structure wherein R is an organic group comprising a polymerizable carbon-carbon double bond or carbon-carbon triple bond; X and Y are independently at each occurrence hydrogen or a non-hydrogen substituent; EWG1 and EWG2 are independently at each occurrence an electron-withdrawing group; p is 0, 1, 2, 3, or 4; n is 1, 2, 3, or 4; and M+ is an organic cation. A polymer prepared from monomer is useful as a component of a photoresist composition.
Type:
Grant
Filed:
April 18, 2016
Date of Patent:
March 28, 2023
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventors:
Emad Aqad, James W. Thackeray, James F. Cameron
Abstract: There is provided a polymer which is the copolymerization product from a mixture including: (a) 10-50 mol % of at least one addition polymerizable arylcyclobutene monomer; (b) 15-50 mol % of at least one addition polymerizable diene monomer; and (c) 15-60 mol % of at least one addition polymerizable aromatic vinyl monomer. The polymer can be used in electronic applications.
Type:
Grant
Filed:
November 30, 2020
Date of Patent:
March 14, 2023
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventors:
Colin Hayes, Colin Calabrese, Michael K Gallagher, Robert K Barr