Abstract: Organic coating compositions, particularly antireflective coating compositions for use with an overcoated photoresist, are provided that comprise that comprise a thermal acid generator that comprises: i) a pyridinium component having one or more ring substituents selected from optionally substituted alkyl and optionally substituted heteroalkyl; and ii) a sulfonic acid component.
Type:
Grant
Filed:
May 23, 2016
Date of Patent:
September 20, 2022
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Inventors:
Jung-June Lee, Jae-Bong Lim, Jun-Han Yun, Ji-Hoon Kang
Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.
Type:
Grant
Filed:
September 1, 2020
Date of Patent:
September 6, 2022
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventors:
Miguel A. Rodriguez, Youngmin Yoon, Michael Lipschutz, Jamie Y. C. Chen
Abstract: A chemical mechanical polishing pad is provided containing a polishing layer having a polishing surface, wherein the polishing layer comprises a reaction product of ingredients, including: an isocyanate terminated urethane prepolymer; and, a curative system, containing a high molecular weight polyol curative; and, a difunctional curative.
Type:
Grant
Filed:
May 17, 2019
Date of Patent:
July 26, 2022
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Abstract: A chemical mechanical polishing composition includes water, colloidal silica abrasive particles with a silica core containing a nitrogen species, a cerium compound coating including cerium oxide, cerium hydroxide or mixtures thereof, and a positive zeta potential, optionally an oxidizing agent, optionally a pH adjusting agent, optionally a biocide and optionally a surfactant. The chemical mechanical polishing composition has a pH of less than 7. Also described is a method of polishing a substrate containing silicon dioxide and a method of making the composite colloidal silica particles with the coating of cerium oxide, cerium hydroxide or mixtures thereof. The chemical mechanical polishing composition can be used to enhance the removal of silicon dioxide from a substrate in an acid environment.
Type:
Grant
Filed:
April 15, 2020
Date of Patent:
July 12, 2022
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Abstract: The present disclosure relates to an organic metal compound having the following structure of Formula 1, an organic light emitting diode (OLED) and an organic light emitting device that includes the organic metal compound. The OLED and the organic light emitting device including the organic metal compound can improve their luminous efficiency, luminous color purity and lifespan.
Type:
Application
Filed:
November 22, 2021
Publication date:
June 30, 2022
Applicants:
LG DISPLAY CO., LTD., ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Inventors:
Hee-Jun PARK, Ku-Sun CHOUNG, Yoo-Jeong JEONG, Sung-Jin PARK, Jae-Min MOON, Hee-Ryong KANG, Kyoung-Jin PARK, Hyun KIM, Ga-Won LEE, Seung-Hyun YOON
Abstract: An organic light emitting diode and an organic light emitting device including the same are discussed. The organic light emitting diode can include a first electrode, a second electrode facing the first electrode, and a first emitting part including a green emitting material layer and positioned between the first and second electrodes. The green emitting material layer can include a first host, a second host and a dopant, wherein at least one of the first host and the second host is deuterated.
Type:
Application
Filed:
November 30, 2021
Publication date:
June 30, 2022
Applicants:
LG DISPLAY CO., LTD., ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Inventors:
Young-Jun YU, Sang-Beom KIM, Do-Han KIM, Jeong-Dae SEO, Chi-Sik KIM, Kyoung-Jin PARK, Soo-Yong LEE, Seung-Hoon YOO
Abstract: Curable silicone compositions, encapsulants including the same, and optical semiconductor devices including the encapsulants are provided herein. In an embodiment, a curable silicone composition includes: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I): (R13SiO1/2)f(R22SiO2/2)g(R1SiO3/2)h(SiO4/2)i(XO1/2)j wherein R1 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, at least two R1 are alkenyl groups; R2 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one R2 is an epoxy group-containing organic group; X is a hydrogen atom or an alkyl group; 0?f<1; 0<g<1; 0?h<0.9; 0?i<0.5; and 0<j<0.5; f+g+h+i+j=1.
Type:
Application
Filed:
December 16, 2021
Publication date:
June 30, 2022
Applicants:
Dupont Toray Specialty Materials Kabushiki Kaisha, Rohm and Haas Electronic Materials Korea Ltd.
Abstract: The present disclosure relates to an organic metal compound, an organic light emitting diode and an organic light emitting device having the compound, in particular, to an organic metal compound having the following structure of Formula 1, an organic light emitting diode (OLED) and an organic light emitting device that includes the organic metal compound. The OLED and the organic light emitting device including the organic metal compound can improve their luminous efficiency, luminous color purity and lifespan.
Type:
Application
Filed:
October 6, 2021
Publication date:
June 30, 2022
Applicants:
LG Display Co., Ltd, Rohm and Haas Electronic Materials Korea Ltd.
Inventors:
Hee-Jun PARK, Ku-Sun CHOUNG, Yoo-Jeong JEONG, Sung-Jin PARK, Jae-Min MOON, Hee-Ryong KANG, Kyoung-Jin PARK, Hyun KIM, Ga-Won LEE, Seung-hyun YOON
Abstract: A polymer composite comprising: (a) quantum dots; (b) polymerized units of a compound of formula (I) wherein R1 is hydrogen or methyl and R2 is a C6-C20 aliphatic polycyclic substituent; and (c) a light stabilizer compound comprising two 1-alkyloxy-2,2,6,6-tetramethyl-4-piperidinyl substituents.
Type:
Grant
Filed:
June 22, 2017
Date of Patent:
June 28, 2022
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventors:
Jaebum Joo, James C. Taylor, Tanya Singh-Rachford
Abstract: The present disclosure relates to an organic metal compound having the following structure of Formula 1, an organic light emitting diode (OLED) and an organic light emitting device that includes the organic metal compound. The OLED and the organic light emitting device including the organic metal compound can improve their luminous efficiency, luminous color purity and lifespan.
Type:
Application
Filed:
October 12, 2021
Publication date:
June 23, 2022
Applicants:
LG Display Co., Ltd., Rohm and Haas Electronic Materials Korea Ltd.
Inventors:
Ku-Sun Choung, Hee-Jun Park, Hee-Ryong Kang, Kyoung-Jin Park, Hyun Kim, Ga-Won Lee, Seung-hyun Yoon
Abstract: The present disclosure relates to an organometallic compound in Formula below and an organic light emitting diode and an organic light emitting device including the organometallic compound. The organometallic compound provides high emitting efficiency and longer lifespan, and the organic light emitting diode and the organic light emitting device have advantages in the emitting efficiency and the lifespan.
Type:
Application
Filed:
December 7, 2021
Publication date:
June 23, 2022
Applicants:
LG Display Co., Ltd., Rohm and Haas Electronic Materials Korea Ltd.
Inventors:
Ku-Sun Choung, Hee-Jun Park, Sung-Jin Park, Jae-Min Moon, Yoo-Jeong Jeong, Hee-Ryong Kang, Kyoung-Jin Park, Hyun Kim, Ga-Won Lee, Seung-Hyun Yoon
Abstract: The present invention provides a quantum dot light emitting diode comprising i) an emitting layer of at least one semiconductor nanoparticle made from semiconductor materials selected from the group consisting of Group II-VI compounds, Group II-V compounds, Group III-VI compounds, Group III-V compounds, Group IV-VI compounds, Group I-III-VI compounds, Group II-IV-VI compounds, Group II-IV-V compounds, or any combination thereof; and ii) a polymer for hole injection or hole transport layer, comprising one or more triaryl aminium radical cations having the structure (S1).
Type:
Grant
Filed:
June 26, 2017
Date of Patent:
June 21, 2022
Assignees:
Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
Inventors:
Anatoliy N. Sokolov, Brian Goodfellow, Robert David Grigg, Liam P. Spencer, John W. Kramer, David D. Devore, Sukrit Mukhopadhyay, Peter Trefonas, III
Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising one or more condensed polymers having an organic polymer chain having pendently-bound moieties having an acidic proton and a pKa in water from ?5 to 13 and having pendently-bound siloxane moieties are provided.
Type:
Grant
Filed:
June 29, 2018
Date of Patent:
June 14, 2022
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Li Cui, Paul J. LaBeaume, James F. Cameron, Charlotte A. Cutler, Shintaro Yamada, Suzanne M. Coley, Iou-Sheng Ke
Abstract: A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a chitosan; a dicarboxylic acid, wherein the dicarboxylic acid is selected from the group consisting of propanedioic acid and 2-hydroxypropanedioic acid; a source of iron ions; a colloidal silica abrasive with a positive surface charge; and, optionally pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) and some of the titanium (Ti) is polished away from the substrate with a removal selectivity for the tungsten (W) relative to the titanium (Ti).
Type:
Grant
Filed:
March 1, 2016
Date of Patent:
May 24, 2022
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Inventors:
Wei-Wen Tsai, Lin-Chen Ho, Cheng-Ping Lee, Jiun-Fang Wang
Abstract: Disclosed herein is a method of forming vias in electrical laminates comprising laminating a sheet having a layer comprising a crosslinkable polymer composition to a substrate wherein the crosslinkable polymer composition has a viscosity at lamination temperatures in the range of 200 Pa-s to 100,000 Pa-s, forming at least one via in the crosslinkable polymer layer by laser ablation; and after the forming of the at least one via, thermally curing the crosslinkable polymer layer. According to certain embodiments the cross linkable polymer composition has a viscosity at lamination temperature of at least 5000 Pa-s. This method yields good lamination results, good via profiles, and good desmear results when such compositions are used and the via is laser ablated before cure.
Type:
Grant
Filed:
March 10, 2020
Date of Patent:
May 17, 2022
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventors:
Tina Aoude, David Fleming, Michelle Bowerman Riener, Colin O'Mara Hayes, Herong Lei, Robert K. Barr, David Louis Danza
Abstract: Compositions for forming polymer layers useful in the manufacture of display devices, particularly flexible display, and methods of forming such devices are provided.
Type:
Grant
Filed:
June 23, 2020
Date of Patent:
May 17, 2022
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventors:
Yixuan Song, Lujia Bu, Neelima Chandrayan, Deyan Wang, Anton Li, Jieqian Zhang
Abstract: The invention provides a polishing pad suitable for polishing integrated circuit wafers. It includes an upper polishing layer that having a polishing surface and at least one groove in the upper polishing layer. At least one transparent window is located within the upper layer. The at least one transparent window has a thickness greater than a desired wear depth of the at least one groove. The at least one transparent window includes a non-fluorescent transparent polymer; and a fluorescent transparent polymer. The transparent window allows measuring groove depth by activating the fluorescent transparent polymer with an activation source at a wavelength sufficient to excite the fluorescent transparent polymer and allow endpoint detection by sending light through the fluorescent transparent polymer and the non-fluorescent transparent polymer.
Type:
Grant
Filed:
November 9, 2018
Date of Patent:
May 10, 2022
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Inventors:
Matthew R. Gadinski, Mauricio E. Guzman, Nestor A. Vasquez, Guanhua Hou
Abstract: A press-fit terminal for insertion into a conductive through-hole of a substrate includes an elastic deformation part with an outer and inner surface, the press-fit terminal includes, in sequence, a copper or copper alloy base, nickel or a nickel alloy barrier layer, a tin or tin alloy layer and an indium top layer. The press-fit terminal shows reduced whisker formation.