Patents Assigned to Rudolph Technologies, Inc.
  • Patent number: 10412311
    Abstract: A method and apparatus for optimizing inspection high-speed optical inspection of parts using intelligent image analysis to determine optimal focus using high numerical aperture (NA) optics, achieve a superior signal-to-noise ratio, resolution, and inspection speed performance with very limited depth of field lenses.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: September 10, 2019
    Assignee: Rudolph Technologies, Inc.
    Inventors: Robert Bishop, Timothy Pinkney
  • Patent number: 10209300
    Abstract: Methods and systems for manufacturing and analyzing interconnect structures in integrated circuit (IC) devices. The methods include forming an interconnect structure, such as a pillar, in an IC device. The pillar is analyzed using an opto-acoustic sensor to quantify physical characteristics used to determine whether the pillar satisfies predetermined quality criterion. The analysis includes capturing an opto-acoustic signal from the pillar and estimating optical parameters for a number of local maxima of the signal. A mode may then be fitted for each of the identified local maxima based on the optical characteristics. The modes and estimated optical parameters may then be iteratively corrected in an order from strongest to weakest local maximum. The corrected values may then be compared to a predicted physical model to identify the physical characteristics of the pillar. If the physical characteristics fall outside of the quality criterion, manufacturing processes may be altered.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: February 19, 2019
    Assignee: Rudolph Technologies, Inc.
    Inventors: Michael Kotelyanskii, Roman Basistyy
  • Publication number: 20190019728
    Abstract: A method for monitoring and controlling a substrate singulation process is described. Device edges are imaged and identified for analysis. Discrepancies in device edges are noted and used to modify a singulation process and to monitor the operation of singulation processes for anomalous behavior.
    Type: Application
    Filed: December 23, 2016
    Publication date: January 17, 2019
    Applicant: Rudolph Technologies, Inc.
    Inventor: Wayne Fitzgerald
  • Patent number: 10173249
    Abstract: A method of cleaning calibration and other substrates that improves the correlation of measurements from calibration and product substrates and increases the useful life of the calibration substrates is herein disclosed. By exposing a calibration substrate to ultraviolet light, a reaction is triggered that results in the cleaning of the contaminants from the calibration substrate. For instance, monatomic oxygen is introduced to contaminants on the surface of a calibration substrate to remove the contaminants without inducing modifications in the substrate itself. Through the cleaning process, the temperature of the calibration substrate may be controlled to limit adverse effects caused by the overheating of the calibration substrate.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: January 8, 2019
    Assignee: Rudolph Technologies, Inc.
    Inventors: Jian Ding, Priya Mukundhan, James Kane, Steven Peterson, Fei Shen
  • Patent number: 10024804
    Abstract: A system for assessing a structure and the tools and processes used to form the structure is described. 2D images of the structure are captured and processed to obtain 3D information concerning the structure. Both 2D and 3D information is then used to identify and analyze selected characteristics of the structure. This analysis allows for a quality assessment of the structure. The selected characteristics are correlated with information relating to the operation of the tool that carried out the process that at least in part created the structure. The correlation of tool/process information to structure characteristics allows for the generation of feedback that may be used to modify the tool or processed used to form the structure.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: July 17, 2018
    Assignee: Rudolph Technologies, Inc.
    Inventors: John Thornell, Steven Knauber, Jatinder Dhaliwal, Justin Miller, Michael Grant, Kenneth Durden
  • Patent number: 10014228
    Abstract: A method and apparatus for detecting and handling deformed substrates, thus allowing them to be processed, and for increasing device yield on the substrate is herein disclosed. A sensor detects deformity, then the substrate is flattened, allowing a support to hold it securely.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: July 3, 2018
    Assignee: Rudolph Technologies, Inc.
    Inventors: James H. Greer, Troy Palm
  • Publication number: 20180173984
    Abstract: A structure and method for employing the structure to reliably read indicia formed on a substrate such as a panel or wafer is disclosed. A gripping member pulls the substrate into at least partial compliance with a locating structure to facilitate the proper function of a code reader. Where the indicia are not read, the substrate is moved relative to the code reader, starting from a position that may be determined based on the material properties of the substrate.
    Type: Application
    Filed: December 21, 2017
    Publication date: June 21, 2018
    Applicant: Rudolph Technologies, Inc.
    Inventor: Kevin Barr
  • Patent number: 9991176
    Abstract: Advanced interconnect technologies such as Through Silicon Vias (TSVs) have become an integral part of 3-D integration. Methods and systems and provided for laser-based acoustic techniques in which a short laser pulse generates broadband acoustic waves that propagate in the TSV structure. An optical interferometer detects the surface displacement caused by the acoustic waves reflecting within the structure as well as other acoustic waves traveling near the surface that has information about the structure dimensions and irregularities, such as voids. Features of voids, such as their location, are also identified based on the characteristics of the acoustic wave as it propagates through the via. Measurements typically take few seconds per site and can be easily adopted for in-line process monitoring.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: June 5, 2018
    Assignees: Rudolph Technologies, Inc., The Regents of the University of Colorado
    Inventors: Manjusha Mehendale, Michael Kotelyanskii, Todd W. Murray, Robin Mair, Priya Mukundhan, Jacob D. Dove, Xueping Ru, Jonathan Cohen, Timothy Kryman
  • Patent number: 9952041
    Abstract: A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: April 24, 2018
    Assignee: Rudolph Technologies, Inc.
    Inventors: Rajiv Roy, David Grant, David S. Marx, Hanh Chu
  • Publication number: 20170276758
    Abstract: A method of assessing functionality of a probe card includes providing a probe card analyzer without a probe card interface, removably coupling a probe card having probes to a support plate of the probe card analyzer, aligning a sensor head of the probe card analyzer with the probe card, and measuring a component of the probes with the sensor head.
    Type: Application
    Filed: June 14, 2017
    Publication date: September 28, 2017
    Applicant: Rudolph Technologies, Inc.
    Inventor: Greg Olmstead
  • Patent number: 9772183
    Abstract: The present disclosure provides a system and method of optical inspection of substrates that have relative large variations in topography. The present disclosure provides a system wherein optical components of the optical inspection system can be automatically moved vertically towards or away from the substrate during optical inspection of the substrate. The system moves the optics in a controlled and precise manner, thereby enabling accurate on-the-fly inspection of substrates having a large variation in topography.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: September 26, 2017
    Assignee: RUDOLPH TECHNOLOGIES INC.
    Inventors: Wojciech Stefanczyk, James Francis Kane, Michael Colgan, James Abondolo
  • Publication number: 20170254757
    Abstract: A system for assessing a structure and the tools and processes used to form the structure is described. 2D images of the structure are captured and processed to obtain 3D information concerning the structure. Both 2D and 3D information is then used to identify and analyze selected characteristics of the structure. This analysis allows for a quality assessment of the structure. The selected characteristics are correlated with information relating to the operation of the tool that carried out the process that at least in part created the structure. The correlation of tool/process information to structure characteristics allows for the generation of feedback that may be used to modify the tool or processed used to form the structure.
    Type: Application
    Filed: May 22, 2017
    Publication date: September 7, 2017
    Applicant: Rudolph Technologies, Inc.
    Inventors: John Thornell, Steven Knauber, Jatinder Dhaliwal, Justin Miller, Michael Grant, Kenneth Durden
  • Patent number: 9714825
    Abstract: A device (10) and methods for simultaneously measuring the thickness of individual wafer layers, the depth of etched features on a wafer, and the three-dimensional profile of a wafer. The structure of the device (10) is comprised of a source/receiver section (12) having a broadband source (14), a receiver (16) and a signal processing section (20). An interferometer (28) separates or combines measurement and reference light and has a measurement leg (30) and a reference leg (34), and a reference mirror (36). The device (10) analyzes a received spectrum which is comprised of a measurement of intensity versus wavelength. There are two measurement methods disclosed: the first method is utilized for taking a single measurement and the second method is utilized for multiple measurements.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: July 25, 2017
    Assignee: Rudolph Technologies, Inc.
    Inventors: David S. Marx, David L. Grant
  • Patent number: 9684052
    Abstract: A method of assessing functionality of a probe card includes providing a probe card analyzer without a probe card interface, removably coupling a probe card having probes to a support plate of the probe card analyzer, aligning a sensor head of the probe card analyzer with the probe card, and measuring a component of the probes with the sensor head.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: June 20, 2017
    Assignee: Rudolph Technologies, Inc.
    Inventor: Greg Olmstead
  • Patent number: 9664625
    Abstract: An inspection system is disclosed. An optical assembly establishes an optical path between a light source and a detector. The optical assembly has a relatively large amount of longitudinal chromatic aberration, so that light at a first wavelength focuses on one region of a substrate in the optical path, while light at a second wavelength simultaneously focuses on another region of the substrate. The system can operate in a calibration mode to determine one or more wavelengths of light corresponding to regions of interest in the substrate and in an imaging mode to image regions of interest in the substrate.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: May 30, 2017
    Assignee: Rudolph Technologies, Inc.
    Inventor: Wei Zhou
  • Patent number: 9658169
    Abstract: A system for assessing a structure and the tools and processes used to form the structure is described. 2D images of the structure are captured and processed to obtain 3D information concerning the structure. Both 2D and 3D information is then used to identify and analyze selected characteristics of the structure. This analysis allows for a quality assessment of the structure. The selected characteristics are correlated with information relating to the operation of the tool that carried out the process that at least in part created the structure. The correlation of tool/process information to structure characteristics allows for the generation of feedback that may be used to modify the tool or processed used to form the structure.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: May 23, 2017
    Assignee: Rudolph Technologies, Inc.
    Inventors: John Thornell, Steven Knauber, Jatinder Dhaliwal, Justin Miller, Michael Grant, Kenneth Durden
  • Publication number: 20170141004
    Abstract: Methods and systems for manufacturing and analyzing interconnect structures in integrated circuit (IC) devices. The methods include forming an interconnect structure, such as a pillar, in an IC device. The pillar is analyzed using an opto-acoustic sensor to quantify physical characteristics used to determine whether the pillar satisfies predetermined quality criterion. The analysis includes capturing an opto-acoustic signal from the pillar and estimating optical parameters for a number of local maxima of the signal. A mode may then be fitted for each of the identified local maxima based on the optical characteristics. The modes and estimated optical parameters may then be iteratively corrected in an order from strongest to weakest local maximum. The corrected values may then be compared to a predicted physical model to identify the physical characteristics of the pillar. If the physical characteristics fall outside of the quality criterion, manufacturing processes may be altered.
    Type: Application
    Filed: November 8, 2016
    Publication date: May 18, 2017
    Applicant: Rudolph Technologies, Inc.
    Inventors: Michael Kotelyanskii, Roman Basistyy
  • Patent number: 9638782
    Abstract: A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell components such as, a head plate, a test head, a signal delivery system, and a manipulator to emulate wafer test cell dynamics during the probe card inspection and analysis process.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: May 2, 2017
    Assignee: Rudolph Technologies, Inc.
    Inventors: Eric Endres, John T. Strom, Christian Kuwasaki, Christopher McLaughlin
  • Patent number: 9625832
    Abstract: A planar motor system comprises a platen with a first planar motor component and a stage with a second planar motor component. The stage can move along a first cardinal axis or a second cardinal axis. The planar motor system further comprises a drive system. When the drive system is energized in a first drive configuration, it applies a first force and a second force. The first force and the second force are not parallel to any cardinal axis. A vector sum of the first force and the second force is parallel to the first cardinal axis. When the drive system is energized in a second drive configuration, it applies a third force and a fourth force. The third force and the fourth force are not parallel to any cardinal axis. A vector sum of the third force and the fourth force is parallel to the second cardinal axis.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: April 18, 2017
    Assignee: Rudolph Technologies, Inc.
    Inventors: J. Casey Donaher, Craig Simpson, Peter John Gerard Dufault
  • Patent number: 9594230
    Abstract: A focus height sensor in an optical system for inspection of semiconductor devices includes a sensor beam source that emits a beam of electromagnetic radiation. A reflector receives the beam of electromagnetic radiation from the sensor beam source and directs the beam toward a surface of a semiconductor device positioned within a field of view of the optical system. The reflector is positioned to receive at least a portion of the beam back from the surface of the semiconductor device to direct the returned beam to a sensor. The sensor receives the returned beam and outputs a signal correlating to a position of the surface within the field of view along an optical axis of the optical system.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: March 14, 2017
    Assignee: Rudolph Technologies, Inc.
    Inventors: Dennis L. Ohren, Christopher J. Voges, Andrew E. Rotering