Abstract: The present disclosure provides semiconductor packages including a heat dissipation structure. In some embodiments, the semiconductor package includes a package substrate, a stacked chip disposed on the package substrate and including a lower chip and an upper chip, a memory chip disposed on the package substrate adjacent to the stacked chip, and an encapsulant encapsulating at least a portion of the stacked chip and the memory chip on the package substrate. An upper surface of the upper chip is exposed from the encapsulant. A dummy silicon chip is in contact with the upper chip on the lower chip.

Abstract: An electrostatic discharge clamp circuit includes a resistor connected between a first node and a second node, a first capacitor connected between the second node and a third node, a second capacitor connected between a fourth node and the third node, a third capacitor connected between a fifth node and the third node, a first inverter providing a power supply voltage or a voltage of the fourth node based on a voltage of the second node, a second inverter providing an output voltage of the first inverter or a voltage of the fifth node based on the voltage of the fourth node, a third inverter configured to provide an output voltage of the second inverter or the ground voltage based on the voltage of the fifth node.

Abstract: Provided are a method and an electronic device for generating a point cloud. The method includes obtaining, from at least one sensor of the electronic device, first sensing data corresponding to an object, obtaining a first point cloud corresponding to the object, based on the first sensing data, identifying, by using at least one artificial intelligence model, at least one outlier point indicating violation of at least one predefined rule in the first point cloud, and providing a re-photographing location guide for re-photographing the object, based on the at least one outlier point.

Abstract: A circuit includes: an overcurrent limiting (OCL) detector configured to detect whether a level of an inductor current reaches an OCL level and to generate an OCL detection voltage; a control loop circuit configured to generate a reset voltage by comparing a ramp voltage reflecting the level of the inductor current with an error voltage generated based on an operating condition that is out of a preset operating condition; an adaptive OCL controller configured to generate an OCL control current by counting a number of pulses of the OCL detection voltage and a number of pulses of the reset voltage; an oscillator configured to generate an oscillation voltage wherein a frequency of the oscillation voltage varies based on a magnitude of the overcurrent limit control current; and a switching transistor for switching the inductor current based on the oscillation voltage.

Abstract: A semiconductor package includes a semiconductor chip including a semiconductor substrate having a first surface and a second surface opposite to the first surface, a chip pad located on the first surface and including a conductive layer, a support pad positioned on the first surface, spaced apart from the chip pad and including an insulating layer, a support bump connected to the support pad, a wiring substrate disposed to face the semiconductor substrate, a support bonding on trace (BOT) pad disposed on the wiring substrate and bonded to the support bump, and a dummy area disposed on the wiring substrate and spaced apart from the support BOT pad.

Abstract: A clock gating cell is provided. The clock gating cell includes: an inverter circuit configured to generate an inverted clock signal by inverting a clock signal; a first control circuit configured to receive the inverted clock signal, an enable signal, and a scan enable signal, and output a first internal signal at a first node; a second control circuit configured to receive the first internal signal, the clock signal, the enable signal, and the scan enable signal, and output a second internal signal at a second node; and an output driver configured to receive the second internal signal, and output an output clock signal to an output node and a third internal signal to a third node. The first control circuit and the second control circuit are configured to receive the third internal signal at the third node.

Abstract: Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.

Abstract: A receiver includes a first equalizer that receives an input data signal through a communication channel and equalizes the input data signal based on a first control code to generate a first equalization signal, a second equalizer that equalizes the first equalization signal based on a clock signal and a second control code to generate a second equalization signal, a clock data recovery circuit that restores the clock signal based on the second equalization signal, deserializes the second equalization signal, and outputs a deserialized second equalization signal, and a controller that adjusts the first control code and the second control code based on the deserialized second equalization signal.

Abstract: Provided is an electronic device including processing circuitry configured to generate at least one signal according to a first communication protocol by referencing a lookup table, the lookup table including simulation waveform information, and the simulation waveform information simulating a second communication protocol different from the first communication protocol, and transmit the at least one signal, the at least one signal including a data packet.

Abstract: A semiconductor package includes a first redistribution structure including a first redistribution layer and a first redistribution bonding pad, the first redistribution bonding pad electrically connected to the first redistribution layer, a first semiconductor chip on the first redistribution structure, and a second redistribution structure on the first semiconductor chip, the second redistribution structure including a second redistribution layer and a second redistribution bonding pad, the second redistribution layer electrically connected to the second redistribution layer. The semiconductor package includes a bonding wire electrically connecting the second redistribution bonding pad and the first redistribution bonding pad to each other, and a molding layer covering at least a portion the first semiconductor chip, the second redistribution structure, and the bonding wire on the first redistribution structure.

Abstract: An electronic device includes: a communication interface; and at least one processor configured to: maintain an inactivated state of a Peer-to-Peer (P2P) engine, and control a Neighbor Awareness Networking (NAN) engine in an activated state, generate sync complex data for a terminal device to search for the electronic device, by adding P2P Information Element (IE) data to sync beacon data, and control the communication interface to output the sync complex data using a predetermined cycle in a predetermined discovery window section through a discovery window channel.

Abstract: A semiconductor package includes: a first redistribution substrate; a semiconductor chip provided on the first redistribution substrate; a molding material molding the semiconductor chip and the first redistribution substrate; and a second redistribution substrate provided on the molding material, wherein the second redistribution substrate includes: at least one redistribution line; a metal pad; and a dielectric layer molding the at least one redistribution line and the metal pad, wherein the dielectric layer includes a marking region on the metal pad, and the metal pad includes a plurality of concave portions.

Abstract: A lighting apparatus including a lighting module configured to emit light; and at least one processor configured to determine a color and a brightness of a current scene of content displayed on a display apparatus, and to control the lighting module to emit, in a space in which the display apparatus is located, light with a color and brightness corresponding to the determined color and brightness of the current scene of the content.

Abstract: An electronic device includes processing circuitry configured to calculate an intra metric based on cross correlation of first reference signal symbols (RSs) included in a first precoding resource block group (PRG) to which a target resource element (RE) belongs, calculate an inter metric based on cross correlation of one or more second RSs and one or more among the first RSs, the one or more second RSs being included in a second PRG adjacent to the first PRG along a frequency axis of a physical channel, the one or more second RSs being in proximity to the target RE, and the physical channel being received from a base station, compare a first ratio between the intra metric and the inter metric with a threshold ratio to obtain a comparison result, and determine a channel estimation mode with respect to the target RE based on the comparison result.

Abstract: A semiconductor package may include a circuit board, an interposer structure on the circuit board, a mold layer, and a first semiconductor chip and a second semiconductor chip spaced apart from each other in a first direction on a center region of the interposer structure and electrically connected to the interposer structure. The interposer structure may include a plurality of trenches in an edge region of the interposer structure and extending through the interposer structure. The mold layer may be in the plurality of trenches and may wrap the first and second semiconductor chips. The mold layer may include a penetrating portion in the plurality of trenches and a stack portion on the interposer structure. A bottom surface of the penetrating portion of the mold layer may be on a same plane as a bottom surface of the interposer structure.

Abstract: An operating method of a terminal to communicate with a base station, includes: detecting at least one overlapped third control channel element (CCE) in a plurality of first CCEs included in first search spaces corresponding to a first physical downlink control channel (PDCCH) received from a first transmission and reception point (TRP) of the base station, and in a plurality of second CCEs included in second search spaces corresponding to a second PDCCH received from the first TRP and a second TRP of the base station; determining, based on the at least one overlapped third CCE, object CCEs from the plurality of first CCEs and the plurality of second CCEs; and performing channel estimation of the object CCEs by using a first memory.

Abstract: A method of operating an IoT device comprising receiving a device change request from an IoT server. The method includes releasing a connection between an Internet-of-things (IoT) device and a first device based on receiving the device change request, switching an operation of the IoT device to a pairing mode to establish a wireless communication link, based on the releasing of the connection between the IoT device and the first device. The method includes establishing a wireless communication link between the IoT device and a second device while the IoT device is in the pairing mode. The method includes identifying whether the second device is associated with the device change request, and receiving information about an access point (AP) connecting the second device and the IoT server from the second device based on the second device being identified as being associated with the device change request.

Abstract: A ring-type wearable device is disclosed. The disclosed ring-type wearable device comprises: an outer ring member; an inner ring member separably inserted into the outer ring member; a sensor unit disposed in the outer ring member; and a control unit disposed in the outer ring member so as to be electrically connected to the sensor unit, wherein the sensor unit can maintain constant sensitivity in correspondence to the thickness of the inner ring member.