Abstract: Systems and methods disclosed herein provide for reduced power composition during data read operations from memory devices through gating of clock signals based on a bit pattern of data to be read from the memory device. Example devices and methods disclosed herein comprise receiving a command to read data from a memory structure of the memory device and latching a bit pattern of the data from the memory structure to a data register based on the received command. The disclose systems and methods use the bit pattern to generate a clock mask according to similarities between bit values within the bit pattern. When a read enable signal is detected on a read enable interface of the embodiments disclosed herein, the clock mask is gated based on the clock mask, and bit values are latched to an input/output interface of the memory device in accordance with the gated read enable signal.

Abstract: Systems and methods are provided for generating a stable reference current that has low sensitivity to operating temperature and supply voltage variations and is stable across process corners. In an example implementation, an improved reference current generator circuit is provided that includes a first circuit generating a first current that is proportional to absolute temperature and a second circuit generating a second current that is complementary to absolute temperature based on first transistors operating in respective triode regions. The second current compensates for process, voltage, and temperature variations in the first current at a node. According to some examples, the second current is also generated based on second transistors operating in respective saturation regions. The first current may be generated using a forward biased PN junction diode.

Abstract: Systems and methods are provided for sensing a data state of a memory cell. In an example implementation, systems and methods disclosed herein perform a method that includes connecting a first sensing node and a second sensing node to a bitline of a sensing amplifier to simultaneously discharge first and second capacitors connected to the first and second sensing nodes, respectively, through the memory cell. After a first sensing period, the second sensing node is disconnected from the bitline, which includes a first voltage level based on discharging the second capacitor. After a second sensing period, the first sensing node is disconnected from the bitline, which includes a second voltage level based on discharging the first capacitor. First and second sensing results are latched based on the first and second voltage levels, respectively, and a data state of the memory cell is based on the first and second voltage levels.

Abstract: A storage device performs a format operation for host devices using different format times and commands configurations. When a controller on the storage device receives an erase command from a host device, the controller determines the format time and a chunk size associated with data in the erase command. The controller executes a first format operation scheme, a second format operation scheme, or a third format operation scheme to perform an erase operation on the data in the erase command within the format time. The controller halts execution of the erase operation and returns operation to the host device when the format time expires.

Abstract: Systems and methods for bit line modulation to compensate for cell source variation are disclosed. For example, a method for reading data from non-volatile storage comprising determining a first bit line level based on a first programmed data state that is being sensed and determining a second bit line level based on a second programmed data state that is being sensed. As another example, a storage device comprising a first bit line driver configured to generate a first bit line level for a first set of bit lines corresponding to a first set of memory strings based on a first cell source level associated with the first set of memory strings a second bit line driver configured to generate a second bit line level for a second set of bit lines corresponding to a second set of memory strings based on a second cell source level associated with the second set of memory strings.

Abstract: In NAND memory, data sanitization allows a relatively small unit of data (e.g., less than a block) to be effectively destroyed by increasing threshold voltages of memory cells from their programmed threshold voltage to the highest threshold state. To reduce the amount of disturb on memory cells not selected for data sanitization, prior to applying a program voltage to a target word line, a hole based pre-charge operation is performed. More specifically, for NAND strings having a memory cell selected for data sanitation, prior to applying a programming pulse to the corresponding word line, a soft erase operation is performed. After biasing the memory cells and select gates of the NAND strings to a low voltage, a soft erase voltage pulse is applied to the source lines and bit line to pre-charge the NAND string channels with holes.

Abstract: A multi-stage method for programming an n-bit memory cell array using a fixed number of data latches is disclosed. The fixed number of data latches may be a reduced number of data latches in sense amplifier and data latch (SADL) peripheral circuitry than is required by existing programming techniques. As such, the die area taken up by the SADL circuitry can be reduced, which in turn, reduces overall chip area. The multi-stage programming method may include utilizing a first data latch to receive and store program page data and utilizing a second data latch to store bit information indicating which cells are to be targeted for the multi-stage programming. At each program stage, a respective program loop may be performed with respect to each threshold voltage distribution generated during a prior program stage to create two new threshold voltage distributions from the prior distribution.

Abstract: A vertically alternating sequence of continuous insulating layers and continuous sacrificial material layers is formed over a substrate, and memory opening fill structures including vertical stacks of memory elements are formed through the vertically alternating sequence. Backside trenches are formed to divide the vertically alternating sequence into a plurality of alternating stacks of insulating layers and sacrificial material layers. Bridge structures are formed within each of the backside trenches. The sacrificial material layers are replaced with electrically conductive layers while the bridge structure are present within the backside trenches.

Abstract: A method of depositing a metal includes providing a structure a process chamber, and providing a metal fluoride gas and a growth-suppressant gas into the process chamber to deposit the metal over the structure. The metal may comprise a word line or another conductor of a three-dimensional memory device.

Abstract: A semiconductor structure includes an active region including a source region, a drain region, and a channel region extending between the source region and the drain region, a gate stack, and a gate dielectric layer located between the gate stack and the active region. The gate stack includes an electrically conductive gate electrode and a single crystalline III-nitride ferroelectric plate located between the electrically conductive gate electrode and the gate dielectric layer, and an entirety of the single crystalline III-nitride ferroelectric plate is single crystalline.

Abstract: Systems and methods disclosed herein provide for an improved termination leg unit design and method of trimming impedance thereof, which provides for improved impedance matching for process variations, along with variations in temperature and voltage. Example implementation provide for a leg unit circuit design that includes a first circuit compensating for temperature and voltage variations and a second circuit, connected in series with the first circuit, compensating for process variations. Furthermore, disclosed herein is ZQ calibration method that provides for calibrating of the impedance of each of an on-die termination, a pull-up driver, and a pull-down driver using a single calibration circuit.

Abstract: A memory device includes at least one instance of a unit layer stack including a source layer, a channel-containing layer that contains a semiconductor channel, and a drain layer that are stacked along a vertical direction over a substrate; a memory opening vertically extending through the at least one instance of the unit layer stack; and a memory opening fill structure located in the memory opening and including a control gate electrode and a memory film in contact with each instance of the semiconductor channel. The memory film includes a resonant tunneling barrier stack, a barrier layer, and a memory material layer located between the resonant tunneling barrier stack and the barrier layer.

Abstract: A magnetoresistive memory cell includes a magnetoresistive layer stack containing a reference layer, a nonmagnetic spacer layer, and a free layer. A ferroelectric material layer having two stable ferroelectric states is coupled to a strain-modulated ferromagnetic layer to alter a sign of magnetic exchange coupling between the strain-modulated ferromagnetic layer and the free layer. The strain-modulated ferromagnetic layer may be the reference layer or a perpendicular magnetic anisotropy layer that is located proximate to the ferroelectric material layer. The magnetoresistive memory cell may be configured as a three-terminal device or as a two-terminal device, and may be configured as a tunneling magnetoresistance (TMR) device or as a giant magnetoresistance (GMR) device.

Abstract: An optical alignment method includes providing an emitted radiation beam which includes a first peak wavelength and a second peak wavelength to a chromatic aberration enhancement component which increases a chromatic aberration of the emitted radiation beam, providing a first incident radiation beam having the first peak wavelength and a second incident radiation beam having the second peak wavelength which is shorter than the first peak wavelength to respective first and second alignment marks located at different vertical levels in a device under test, detecting reflected radiation from the first and second alignment marks, and using the detected reflected radiation for optical alignment of layers in the device under test.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, memory openings vertically extending through a first region of the alternating stack, memory opening fill structures located in the memory openings, and support pillar structures vertically extending through a second region of the alternating stack. Each of the support pillar structures includes a central columnar structure and a set of fins laterally protruding from the central columnar structure at levels of a subset of the electrically conductive layers.

Abstract: Technology is disclosed herein for smart verify in a memory system that has a four bit per cell program mode (or X4 mode) and also a three bit per cell program mode (or X3 mode). The X3 mode uses a three-bit gray code that is based on a four-bit gray code of the X4 mode. The memory system skips verify of states in the X3 mode, while using a considerable portion of the programming logic from the X4 mode. In one X3 mode the memory system skips B-state verify while the number of memory cells having a Vt above an A-state verify voltage is below a threshold. In one X3 mode the memory system determines whether to skip verify for a first set of data states based on a first test and determines whether to skip verify for a second set of data states based on a second test.

Abstract: A bonded assembly includes a backside peripheral circuit, a memory die and a first logic die. The memory die includes a doped semiconductor material layer, a three-dimensional memory array, and memory-side metal interconnect structures and first memory-side bonding pads embedded in memory-side dielectric material layers. The first logic die includes a logic-side peripheral circuit including a first subset of logic devices configured to control operation of the three-dimensional memory array, logic-side dielectric material layers, and logic-side metal interconnect structures and first logic-side bonding pads that are bonded to a respective one of the first memory-side bonding pads. The backside peripheral circuit includes a second subset of the logic devices located on a second side of the doped semiconductor material layer.

Abstract: Memory devices, or memory systems, described herein may include a controller (e.g., SSD controller) and a NAND memory device for storing inflight data. When the power loss event occurs, a memory system maintains (i.e., not un-select) the existing memory block being programmed at the time of power loss. The existing program operation at the event of power loss can be suspended by controller. The inflight data can be re-sent by controller directly to NAND latches, when power loss event was detected. The memory system can select a next, immediate available erased page and begin one-pulse programming to store the inflight data, without ramping down the program pump and program pulse, which was in use before the power loss event. The existing programming voltage is used to store/program the inflight data via single pulse programming. When power is restored, the inflight data is moved/programmed to another block for good data reliability.

Abstract: Concurrent access of multiple memory cells in a cross-point memory array is disclosed. In one aspect, a forced current approach is used in which, while a select voltage is applied to a selected bit line, an access current is driven separately through each selected word line to concurrently drive the access current separately through each selected memory cell. Hence, multiple memory cells are concurrently accessed. In some aspects, the memory cells are accessed using a self-referenced read (SRR), which improves read margin. Concurrently accessing more than one memory cell in a cross-point memory array improves bandwidth. Moreover, such concurrent accessing allows the memory system to be constructed with fewer, but larger cross-point arrays, which increases array efficiency. Moreover, concurrent access as disclosed herein is compatible with memory cells such as MRAM which require bipolar operation.

Abstract: The memory device includes a plurality of memory cells which are arranged in an array. The memory device further includes a plurality of bit lines that are coupled with the memory cells and a controller. The controller is configured to program the memory cells from an erased data state to three programmed data states in a programming operation that includes three programming pulses and zero verify operations using different patterns to dictate the application of inhibit voltages to the bit lines during each of the three programming pulses. The patterns include two pre-established patterns and additional patterns that are derived from the pre-established patterns using logic operations.