Abstract: A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having an input port receiving air from the first vertical airflow path of the cabinet, an output port transmitting air to the second vertical air flow path, a heat exchanger positioned in an air flow path extending between the input and the output ports, and a fan assembly for driving air through the heat exchanger and towards the input port. The system further includes at least one air flow distribution device establishing a predetermined flow rate distribution through electronic assemblies supported by the brackets.

Abstract: A small form-factor electronic device is provided which is configured to store audio, text, and/or video content and control delivery of such content from a user interface on the electronic device. Such device may be coupled to an audio/visual playback device to receive and output the delivered content to users. The electronic device may also provide a security mechanism that inhibits unauthorized copying of the content stored in the electronic device. The electronic device may provide a convenient way for storing and/or delivering publications (e.g., books, articles, printed news, etc.) in audio and/or text form.

Abstract: A method is provided for fabricating a multilayer printed circuit board, including embedded electrically conductive elements formed as part of the fabrication of the layers of the printed circuit board. An insulating layer and a conductive layer are then pressed over the electrically conductive elements such that the electrically conductive elements protrude from the surface of the conductive layer. A mechanical process is the applied to remove these protrusions to expose the embedded electrically conductive elements. An electrically conductive undercoat may be applied over the surface of the conductive layer and a second circuit pattern is formed over the electrically conductive undercoat.

Abstract: A radio frequency identification (RFID) tag is coupled to a circuit board to track the specific operating and environmental conditions of each manufacturing stage as the circuit board passes through the manufacturing stages. An RFID reader and data collector are used at each stage to read the RFID tag and store its identifying information along with processing information, operating conditions, and results for each stage. This permits to quickly and accurately collect manufacturing information for each circuit board at various manufacturing stages as well as the operating conditions for each stage at a particular time. Such manufacturing metrics can then be retrieved on a stage-by-stage basis for a particular circuit board by an identifier printed on the circuit board.

Abstract: A method for enhancing the high frequency signal integrity performance of a printed circuit board (PCB) or backplane is provided. According to one embodiment of the present invention, the method involves the use of S-parameters as the primary cost factors associated with an iterative process to optimize the physical dimensions and shape of a single or a collection of vias within the PCB or backplane. In certain embodiments, the process involves the representation of the via components as equivalent lumped series admittances and impedances, as well as, RLGC sub-circuits upon which basic circuit analysis is performed to optimize secondary characteristics, for example, the maximization of the sub-circuit's resistance and/or the minimization of the sub-circuit's capacitance. The iterative process involves the alteration of physical dimensions and the shape of the via components such that the secondary characteristics are optimized.

Abstract: A temperature-controlled flexible optical circuit includes a length of pre-fabricated optical fiber secured to a partially flexible heater circuit for heating and maintaining the optical fiber at a substantially constant temperature. Heater circuit may also comprise temperature sensors.

Abstract: A self-tuning antenna that automatically adjusts its input impedance to compensate for externally induced impedance variations is provided. A variable impedance is adjusted by a control circuit to reconfigure the input impedance of than antenna to compensate for different environmental situations and different transponder mismatch situations. A negative-feedback signal is employed to determine or infer impedance mismatches and reconfigure the antenna input impedance (e.g., capacitance and/or resistance) until a desired equilibrium of the antenna input impedance is reached. A reference measurement (e.g., VSWR measurement) is automatically performed by an antenna tuning circuit that adjusts the antenna's impedance matching circuit to compensate for object interference. The antenna's impedance matching circuit includes a variable capacitor circuit having a plurality of individually controlled parallel plate capacitors that can be added or removed from the variable capacitor circuit, as necessary.

Abstract: On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked architecture for efficiently accessing individual memory devices in a chip-scale package stack. The use of a ball grid array chip-scale package architecture in combination with thermally compatible materials decreases the risk of thermal cracking while improving heat dissipation. Moreover, this architecture permits mounting support components, such as capacitors and resistors, on the chip-scale package.

Abstract: Systems and methods for controlling temperature in an optical amplification system are provided. An optical amplification system comprises a pump laser, a multiplexer, an optical fiber, a temperature control device, and processing circuitry. The pump laser generates an optical pump signal. The multiplexer multiplexes the optical pump signal and an input optical signal to generate a multiplexed optical signal. The optical fiber receives the multiplexed optical signal. The temperature control device controls temperature within the optical amplification system based on a control signal. The processing circuitry determines whether to adjust the temperature of the optical amplification system and generates the control signal based on this determination.

Abstract: An interconnect for attaching a module such as a PCB or a multi-chip module to a circuit substrate comprises a member elongated in a longitudinal direction. The member has at least a first elongated side and a second opposed and generally parallel elongated side. The first and second sides extend in the longitudinal direction. Each of the first and second sides have at least one portion formed by a series of depressions in the respective first and second sides. The depressions extend inwardly from a first outer surface of the first side and a second outer surface of the second side. The depressions are metallized to form leads. A circuit assembly is also provided comprising a multi-chip module having a plurality of electronic elements; a circuit substrate supporting thereon a conductive circuit pattern adapted for connection to the multi-chip module and at least one the interconnects for attaching the multi-chip module to the circuit pattern on the circuit substrate.

Abstract: A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having an input port receiving air from the first vertical airflow path of the cabinet, an output port transmitting air to the second vertical air flow path, a heat exchanger positioned in an air flow path extending between the input and the output ports, and a fan assembly for driving air through the heat exchanger and towards the input port. The system further includes at least one air flow distribution device establishing a predetermined flow rate distribution through electronic assemblies supports by the brackets.

Abstract: Fiber-optic cable is dispensed underwater into a trench from a vehicle moving along the bed of the body of water. The cable is wound on a stationary spool and dispensed over the end of the spool by a rotary arm driven by a motor controlled to maintain a desired tension in the cable. The cable has a fiber optic core, metal wires wound around the core, and a tensioned laminate of copper tape adhered to plastic tape wound around the wires.

Abstract: A system of reflectors is used to form beam-expanding and collimating electro-optic transducer devices, including radiation sources and/or detectors. Preferably, the reflector system is of the Cassegrainian or Ritchey-Chretien type. Radiation such as light signals can be conducted to or from the transducers by fiber-optic cables. Alignment of optical conductors or “cores” of the fiber-optic cables or the reflector system with a transducer is provided by coupling a magnetic member to the conductor or reflector system and applying a controllable magnetic field from outside of the device to provide alignment, and then fixing the components in place by the use of means such as light-curable epoxy resin.

Abstract: Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

Abstract: A circuit board standoff for use with SMT placement machinery is provided comprising a hollow substantially cylindrical member, a flange extending from a bottom section of the cylindrical member and an opening positioned in the top section of the substantially cylindrical member operable to receive a fastener. The circuit board standoff operates to provide physical connection between two circuit boards while maintaining a minimum distance there between for inclusion of any required electronic components.

Abstract: A printed circuit board stiffener is provided comprising a generally U-shaped elongated horizontal assembly having a substantially horizontal surface, an elongated vertical member extending downward from and rigidly coupled to one of the elongated horizontal assembly members opposite the assembly's curved edge and having a plurality of legs extending from the elongated vertical member, each such leg further comprising a flange extending substantially perpendicular to its respective plurality of legs in a direction toward the elongated horizontal assembly's curved edge. Each of said flanges are suitable for attachment to a surface of a circuit board. Further, such stiffener is capable of being moved, oriented, placed and mechanically bonded to the printed circuit board using existing SMT robotic assemblies.

Abstract: A printed circuit board stiffener is provided comprising a generally U-shaped elongated horizontal assembly having a substantially horizontal surface, an elongated vertical member extending downward from and rigidly coupled to one of the elongated horizontal assembly members opposite the assembly's curved edge and having a plurality of legs extending from the elongated vertical member, each such leg further comprising a flange extending substantially perpendicular to its respective plurality of legs in a direction toward the elongated horizontal assembly's curved edge. Each of said flanges are suitable for attachment to a surface of a circuit board. Further, such stiffener is capable of being moved, oriented, placed and mechanically bonded to the printed circuit board using existing SMT robotic assemblies.

Abstract: A temperature-controlled flexible optical circuit includes a length of pre-fabricated optical fiber secured to a partially flexible heater circuit for heating and maintaining the optical fiber at a substantially constant temperature. Heater circuit may also comprise temperature sensors.

Abstract: A circuit board threadplate for connection of a component to a circuit board is provided wherein such threadplate may be mechanically mounted to a circuit board without the use of manual labor. Specifically, the threadplate is compatible with present Surface Mount Technology robotic placement machines. Such circuit board threadplate comprises a hollow substantially cylindrical member forming an extruded neck having an elongated section and a substantially flat surface at a first end of the elongated section and a flange extending from a second end of the elongated section. The flange provides a substantially flat surface suitable for soldering onto a surface of a circuit board. Additionally, the threadplate comprises a cylindrical cavity positioned inside the substantially cylindrical member, extending in a direction aligned with the substantially cylindrical member. The cylindrical cavity may have a thread pattern suitable for receiving a screw-type fastener.

Abstract: A circuit board standoff for use with SMT placement machinery is provided comprising a hollow substantially cylindrical member, a flange extending from a bottom section of the cylindrical member and an opening positioned in the top section of the substantially cylindrical member operable to receive a fastener. The circuit board standoff operates to provide physical connection between two circuit boards while maintaining a minimum distance there between for inclusion of any required electronic components.