Abstract: A current mode coupler includes a unitary casing, a stub cable connector, a circuit board, a magnetic structure, a wire core holder, an enclosing lid and an E-core situated in a cavity in the unitary casing and an I-core affixed to the enclosing lid. When the enclosing lid is in a closed position, the E-core and the I-core contact, forming a transformer. When electrical current is present in a data bus that is situated within the E-core/I-core arrangement, the coupler magnetically couples the current mode doublets on the data bus to the circuitry enclosed in the unitary casing. The current mode doublets sensed on the data bus is then converted to voltage mode doublets and transmitted to the stub interface. The current mode coupler also receives voltage mode doublets through the stub interface, converts the voltage mode doublets to current mode doublets, and transmits the current mode doublets via the E-core/I-core arrangement.
Abstract: A method for enhancing the high frequency signal integrity performance of a printed circuit board (PCB) or backplane is provided. The method may involve the use of the S-parameters as the primary cost factors associated with an iterative process to optimize the physical dimensions and shape of a single or a collection of vias within the PCB or backplane. Such process involves the representation of the via components as equivalent lumped series admittances and impedances, as well as, RLGC sub-circuits upon which basic circuit analysis may be performed to optimize secondary characteristics, for example, the maximization of the sub-circuit's resistance and/or the minimization of the subcircuit's capacitance. The iterative process involves the alteration of physical dimensions and the shape of the via components such that the secondary characteristics are optimized.
Type:
Application
Filed:
March 6, 2003
Publication date:
September 9, 2004
Applicant:
Sanmina-SCI Corporation
Inventors:
Franz Gisin, William Panos, Mahamud Khandokar
Abstract: Device and method for controlling a towed vehicle such as a bomb damage detector towed on a tether cord behind the bomb. The towed vehicle is ejected from the bomb at a selected release point in its trajectory. A tether cord is wound on a spool and dispensed from the spool longitudinally. The payout of tether cord is braked by a brake using the wrapping of the cord around a curved guide to increase the braking force supplied by an electric brake. The vehicle can be completely released from the cord prior to the bomb explosion to increase the viewing time without increasing the length of the cord. A vehicle towed by an aircraft can be recovered by use of a winch in the aircraft and anchoring the tether at the winch. A portion of the tether cord can be covered with a fire-resistant covering to protect it from the hot exhausts of jet or rocket engines on the aircraft.
Type:
Grant
Filed:
January 31, 2002
Date of Patent:
May 25, 2004
Assignee:
Sanmina-SCI Corporation
Inventors:
David R. Porter, James J. Galipeau, George C. Chandler
Abstract: A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having an input port receiving air from the first vertical airflow path of the cabinet, an output port transmitting air to the second vertical air flow path, a heat exchanger positioned in an air flow path extending between the input and the output ports, and a fan assembly for driving air through the heat exchanger and towards the input port. The system further includes at least one air flow distribution device establishing a predetermined flow rate distribution through electronic assemblies supported by the brackets.
Type:
Grant
Filed:
May 16, 2002
Date of Patent:
November 25, 2003
Assignee:
Sanmina-SCI Corporation
Inventors:
Anthony C. Sharp, Andrew Hudz, Peter Jeffery
Abstract: A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having an input port receiving air from the first vertical airflow path of the cabinet, an output port transmitting air to the second vertical air flow path, a heat exchanger positioned in an air flow path extending between the input and the output ports, and a fan assembly for driving air through the heat exchanger and towards the input port. The system further includes at least one air flow distribution device establishing a predetermined flow rate distribution through electronic assemblies supported by the brackets.
Type:
Grant
Filed:
November 25, 2002
Date of Patent:
November 25, 2003
Assignee:
Sanmina-SCI Corporation
Inventors:
Anthony C. Sharp, Andrew Hudz, Peter Jeffery
Abstract: A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having an input port receiving air from the first vertical airflow path of the cabinet, an output port transmitting air to the second vertical air flow path, a heat exchanger positioned in an air flow path extending between the input and the output ports, and a fan assembly for driving air through the heat exchanger and towards the input port. The system further includes at least one air flow distribution device establishing a predetermined flow rate distribution through electronic assemblies supported by the brackets.
Type:
Grant
Filed:
August 10, 2001
Date of Patent:
January 14, 2003
Assignee:
Sanmina-SCI Corporation
Inventors:
Anthony C. Sharp, Andrew Hudz, Peter Jeffery
Abstract: A current mode coupler includes a unitary casing, a stub cable connector, a circuit board, a magnetic structure, a wire core holder, an enclosing lid and an E-core situated in a cavity in the unitary casing and an I-core affixed to the enclosing lid. When the enclosing lid is in a closed position, the E-core and the I-core contact, forming a transformer. When electrical current is present in a data bus that is situated within the E-core/I-core arrangement, the coupler magnetically couples the current mode doublets on the data bus to the circuitry enclosed in the unitary casing. The current mode doublets sensed on the data bus is then converted to voltage mode doublets and transmitted to the stub interface. The current mode coupler also receives voltage mode doublets through the stub interface, converts the voltage mode doublets to current mode doublets, and transmits the current mode doublets via the E-core/I-core arrangement.