Patents Assigned to SEKISUI POLYMATECH CO., LTD.
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Publication number: 20240132766Abstract: The present invention provides a thermally conductive composition comprising: (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a polysiloxane compound containing at least one alkyl group having 4 or more carbon atoms. According to the present invention, it is possible to provide the thermally conductive composition capable of forming a thermally conductive member having an excellent thermally conductive property and high adhesive force to polypropylene.Type: ApplicationFiled: January 20, 2022Publication date: April 25, 2024Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Tatsuya IWAMOTO, Gaku KITADA
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Patent number: 11881643Abstract: Provided is an electrical connection member including a conductive member made of a rubber-like elastic material, through which a terminal used for supplying power is mounted to a mounted member such as a glass plate, and electrically connected with a small electric resistance to contact member provided in the mounted member, resulting in less reduction of rubber-like elasticity of the conductive member due to a temperature increase of the electrical connection member, even if large current flows. With respect to the conductive member 11 made of the rubber-like elastic material provided in the electrical connection member 10, a compression set measured after the following treatment is 50% or less, the treatment being comprise applying a load between an upper surface and a lower surface of the conductive member and conducting 25% compressive deformation at 105° C. for 22 hours; and electric resistance between the upper surface and the lower surface is 0.1? or less during application of the load.Type: GrantFiled: March 6, 2020Date of Patent: January 23, 2024Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Hideaki Konno, Yasuyoshi Watanabe, Tsubasa Kamiya
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Publication number: 20240021909Abstract: The present invention relates to a battery module comprising a case, a plurality of cells arranged in the case, and a heat absorbing member disposed at least either between the case and the cell or between the plurality of cells, wherein the heat absorbing member comprises a silicone matrix and a small particle size aluminum hydroxide having a particle size of 5 ?m or less dispersed in the silicone matrix, wherein a content of the small particle size aluminum hydroxide is 20 vol % or more. According to the present investigation, a battery module capable of absorbing a generated heat at 300° C. or less for a long period of time can be provided.Type: ApplicationFiled: December 17, 2021Publication date: January 18, 2024Applicant: SEKISUI POLYMATECH CO., LTD.Inventor: Gaku KITADA
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Patent number: 11855368Abstract: An electric connection member comprises a conductive member, a fixing member which brings the conductive member into contact with a connection target member and holds the conductive member in a state of compression in a thickness direction Z. The conductive member has a compressive stress of 1.0 N/mm2 or more and 15.0 N/mm2 or less when compressed by 25% in the thickness direction. The fixing member has an elongation of 400 ?m or less when drawn at 96 kPa for 30 minutes in a direction along the thickness direction Z.Type: GrantFiled: April 24, 2020Date of Patent: December 26, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Yasuyoshi Watanabe, Hideaki Konno, Tsubasa Kamiya, Tatsuya Kogiso
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Patent number: 11852510Abstract: A sensor includes a base member and a sensor sheet, and the sensor sheet includes a sensor main body including sensor electrodes and a tail portion that includes wiring lines electrically connected to the sensor electrodes and that projects and extends with respect to the base member. The base member includes a joint surface portion that is fixed to the sensor main body and a separation portion that is disposed at a position facing a tail support portion of the tail support portion to which the tail portion is connected and that is not fixed to the tail support portion.Type: GrantFiled: December 23, 2019Date of Patent: December 26, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Shinichi Tomooka, Yasushi Sakai
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Publication number: 20230395277Abstract: Transmission loss of electrical signals is reduced. A conductive member for conductive connection between a first connection object and a second connection object includes a polymeric matrix made of a rubber-like elastic substance and a conductive medium. The conductive medium includes conductive particles successively arranged in a conducting direction of the conductive member. The conductive particles have a surface roughness expressed by an arithmetic mean height, and the surface roughness is 5 ?m or less. The conductive particles have a surface roughness expressed by a developed interfacial area ratio (Sdr), and the surface roughness is 20 or less.Type: ApplicationFiled: November 24, 2021Publication date: December 7, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Tsubasa Kamiya, Hideaki Konno
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Publication number: 20230365766Abstract: The present invention is a thermally conductive sheet comprising: a matrix comprising an organic polymer, and a carbon fiber X, the carbon fiber X being oriented in a thickness direction of the sheet, wherein a proportion of a carbon fiber (A) having a fiber length of 100 µm or less is 40% or more and a proportion of a carbon fiber (B) having a fiber length of 200 µm or more is 3 to 13% of the carbon fiber X. According to the present invention, a thermally conductive sheet in which the thermal resistance value is effectively reduced by polishing the surface, resulting in a sheet having a low thermal resistance value can be provided.Type: ApplicationFiled: August 24, 2021Publication date: November 16, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiromichi IWAZAKI, Kentaro KIUCHI, Kenta KUROO, Hiroki KUDOH
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Publication number: 20230355152Abstract: In a bioelectrode capable of detecting biometric information of a living body in touch with the bioelectrode, the bioelectrode includes a base, a first conductive layer that is laminated on a surface side of the base, that is formed by dispersing scale-shaped conductive particles in an insulating binder, and that has extensibility, and a second conductive layer that is laminated on a surface side of the first conductive layer, that has conductivity, and that is harder than the first conductive layer. The second conductive layer is disposed to be exposed at the surface side of the base where the second conductive layer is touchable with the living body. An amount of conductive particles filled in the second conductive layer is smaller than an amount of the conductive particles filled in the first conductive layer. The second conductive layer has a larger outer contour than the first conductive layer.Type: ApplicationFiled: July 1, 2021Publication date: November 9, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Masamichi Ishikubo, Hiroshi Ogasawara
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Publication number: 20230323181Abstract: Provided is a heat-conductive sheet including: a binder component that is a mixture of a silicone matrix (A) and a hydrocarbon compound (B); and a heat-conductive filler (C) dispersed in the binder component, wherein the heat-conductive sheet has a compression ratio at 80° C. and 0.276 MPa of 15% or more and a shape retention.Type: ApplicationFiled: July 21, 2021Publication date: October 12, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Kazuhiro NAMIKI, Hiromichi IWAZAKI, Kenta KUROO, Hiroki KUDOH
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Patent number: 11781052Abstract: The present invention provides a thermally conductive composition in which the flexibility of the thermally conductive composition is not impaired, and even when cured into a thermally conductive molded body, good bendability, an excellent handling property, and excellent thermal conductivity are exhibited, and provides a molded body of the thermally conductive composition. A thermally conductive composition, in which a thermally conductive filler is contained in a polymer matrix, includes a methyl phenyl silicone, characterized in that the thermally conductive filler has an average particle size of 10 to 100 ?m, the content of the thermally conductive filler in the thermally conductive composition is 70% to 90% by volume, and 30% to 80% by volume of the thermally conductive filler has a particle size of 40 ?m or more. A thermally conductive molded body is formed of a cured body of the thermally conductive composition.Type: GrantFiled: January 16, 2019Date of Patent: October 10, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventor: Hiroshi Umetani
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Publication number: 20230256822Abstract: To provide a capacitive input device that enables the user to feel that the input operation has been done. A capacitive input device includes a surface sheet, a soft member, and a sensor sheet configured to detect a change in capacitance. The surface sheet includes an operation area on which a touching operation is to be performed. The soft member is provided between the operation area and the sensor sheet. The sensor sheet includes a sensor electrode located at a position corresponding to the operation area. When the operation area is pressed in a touching operation, the surface sheet and the soft member are displaced toward the sensor sheet and the sensor electrode detects the capacitance.Type: ApplicationFiled: September 28, 2021Publication date: August 17, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Kanae Miyanaga, Shinya Tateda, Yohei Yamamoto
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Patent number: 11702579Abstract: A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.Type: GrantFiled: May 3, 2021Date of Patent: July 18, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki Kudoh, Tomonari Yamada
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Publication number: 20230211666Abstract: A decorative panel in which a touch sensor member can be disposed with a large degree of freedom even in a relatively large electronic device is provided. The decorative panel includes a cover panel member that has an opening portion; a touch sensor member that is disposed at the opening portion; and a design film that covers the cover panel member and the touch sensor member, and that has a movable portion that supports the touch sensor member so that the touch sensor member is displaceable with respect to the cover panel member.Type: ApplicationFiled: June 11, 2021Publication date: July 6, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Yoshifumi Honmatsu, Yasushi Sakai
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Publication number: 20230173793Abstract: The method for producing a thermally conductive sheet according to the present invention comprises: a step (1) of obtaining a liquid composition comprising a curable silicone composition including an alkenyl group-containing organopolysiloxane and a hydrogen organopolysiloxane, a thermally conductive filler, and a volatile compound; a step (2) of sandwiching the liquid composition between two resin sheets at least one of which is a gas-permeable film and pressurizing these to obtain a sheet-shaped formed product; and a step (3) of heating the sheet-shaped formed product to volatilize at least a part of the volatile compound. According to the present invention, it is possible to provide a method for producing a thermally conductive sheet having a good sheet condition and a low thermal resistance value.Type: ApplicationFiled: May 27, 2021Publication date: June 8, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroshi UMETANI, Hiroki KUDOH
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Publication number: 20230144307Abstract: The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet area of 25.4 mm×25.4 mm when the thermally conductive sheet is 30% compressed from a direction perpendicular to an adhesion plane on which the plurality of unit layers are adhered to each other is 7.0 kgf or less. According to the present invention, it is possible to improve the thermal conductivity and enhance the softness of a thermally conductive sheet using a silicone resin as a matrix component and composed of a large number of unit layers laminated as compared with the conventional one.Type: ApplicationFiled: May 27, 2021Publication date: May 11, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki KUDOH, Miho ISHIHARA
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Patent number: 11634842Abstract: An object is to solve problems associated with a stretchable wire member that includes, for example, a garment with stretchable wires formed thereon, that is, to solve the problems of wrinkles and undulations that often occur after the garment is stretched. A stretchable wire member includes a fabric; a base layer disposed on a surface of the fabric; a conductive layer disposed in part of the fabric, the conductive layer being on a surface of the base layer; and a protective layer covering the conductive layer. In the stretchable wire member, an elastic modulus E?3 of a multilayer body portion including the fabric, the base layer, and the protective layer ranges from 1 MPa to 6 MPa.Type: GrantFiled: November 1, 2019Date of Patent: April 25, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventor: Takaya Kimoto
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Patent number: 11618247Abstract: Provided is a thermally conductive sheet having high thermal conductivity not only in a thickness direction of the sheet but also in one direction along a plane direction of the sheet. The thermally conductive sheet is a thermally conductive sheet containing a scaly filler 12 in a polymer matrix 11, wherein the scaly filler 12 is oriented such that a long axis direction of a scale surface is along one of a first direction that is a thickness direction of the thermally conductive sheet and a second direction that is perpendicular to the first direction, and a transverse axis direction that is perpendicular to the long axis direction in the scale surface is along the other of the first direction and the second direction.Type: GrantFiled: October 26, 2020Date of Patent: April 4, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki Kudoh, Miho Ishihara
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Patent number: 11613645Abstract: A photocurable composition is provided. A cured product formed by curing the photocurable composition has reworkability and excellent heat resistance while having flexibility. The photocurable composition includes a telechelic acrylic polymer having an acryloyl group at both ends; a polyfunctional acrylic polymer having acryloyl groups; a monofunctional acrylic monomer; and a fumed silica including at least one of a hydrophilic fumed silica or a fumed silica having a polar group. The photocurable composition has a Martens hardness of 0.07 to 0.75 N/mm2, where the Martens hardness is a hardness after the photocurable composition is cured.Type: GrantFiled: March 24, 2021Date of Patent: March 28, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventor: Yu Kekura
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Patent number: 11610829Abstract: A heat-conducting sheet comprising a first heat-conducting layer, a second heat-conducting layer, an interface, a polymer matrix, an anisotropic filler and a non-anisotropic filler, wherein: the first and second heat-conducting layers each comprise the polymer matrix, the anisotropic filler and the non-anisotropic filler, the anisotropic filler oriented in a thickness direction, the first and second heat-conducting layers are laminated via the interface, the interface comprises the polymer matrix and the non-anisotropic filler, a filling ratio of the anisotropic filler in the interface is lower than that in the first and second heat-conducting layers, and a filling ratio of the non-anisotropic filler in the interface is higher than that in the first and second heat-conducting layers; and a method of producing the heat-conducting sheet.Type: GrantFiled: February 14, 2019Date of Patent: March 21, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventor: Shigeru Koyano
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Patent number: 11599230Abstract: To provide a touch sensor including a tail having a terminal protective layer that allows smooth insertion into or removal from a circuit board without causing any problem, which is likely to occur in a typical terminal protective layer provided on a terminal at a distal end of a tail of a touch sensor used for, for example, input operations of various electronic devices. A touch sensor having a plurality of sensor electrodes and a plurality of wires on a single substrate film includes a body including a flat portion and a deformed portion, which is three-dimensionally shaped relative to the flat portion surrounding the deformed portion and has an operation surface having the sensor electrodes, and a tail projecting from the body and having a terminal to connect the wires to a circuit board. The terminal has a terminal protective layer protecting the wires.Type: GrantFiled: September 25, 2020Date of Patent: March 7, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Shinichi Tomooka, Yasushi Sakai