Patents Assigned to SEKISUI POLYMATECH CO., LTD.
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Patent number: 12122916Abstract: A silicone composition having an electromagnetic wave absorbing property and thermal conductivity includes liquid silicone; a high-specific-gravity soft magnetic filler having a specific gravity of 4.5 or greater; an intermediate-specific-gravity thermally conductive filler having a specific gravity of 4.0 or less; and a non-liquid anti-thickening and anti-settling agent. Furthermore, a curable grease is a two-component curable grease including a combination of a base compound and a curing agent that are used by being mixed together when used, the curable grease being to be cured by mixing of the base compound with the curing agent. The base compound is a silicone composition of the present invention, in which the liquid silicone is an organopolysiloxane having a vinyl group at an end thereof. The curing agent is a silicone composition of the present invention, in which the liquid silicone is an organohydrogenpolysiloxane.Type: GrantFiled: March 25, 2020Date of Patent: October 22, 2024Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Takaaki Mizuno, Shigeru Koyano
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Publication number: 20240279471Abstract: A thermally conductive composition of the present invention comprises a silicone base material, a viscosity reducing agent, and a thermally conductive filler, wherein a ratio between a weight-average molecular weight Mw1 of the silicone base material and a weight-average molecular weight Mw2 of the viscosity reducing agent (Mw1/Mw2) is 0.5 or more and 8.5 or less. The present invention can provide a thermally conductive composition comprising a silicone base material, a viscosity reducing agent, and a thermally conductive filler, which has a high effect of reducing viscosity.Type: ApplicationFiled: July 28, 2022Publication date: August 22, 2024Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Tatsuya IWAMOTO, Toshiki KANEKO, Hiroshi UMETANI
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Patent number: 12051879Abstract: A connection component can be firmly secured to an adherend member, in a state where a conductive member is compressed, to prevent a bubble from remaining in a securing member. The connection component includes a metal terminal, the conductive member provided on one surface of the metal terminal and deformable by compression, the securing member bonded to one surface of the metal terminal, and an exhaust path provided in at least one of the metal terminal and the securing member. The exhaust path is connected to or provided in at least one of a first securing surface of the securing member that is bonded to the metal terminal, and a second securing surface that is opposite to the first securing surface. The exhaust path exhausts a bubble generated in at least one of the first securing surface and the second securing surface.Type: GrantFiled: August 5, 2020Date of Patent: July 30, 2024Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Tsubasa Kamiya, Hideaki Konno, Yasuyoshi Watanabe
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Publication number: 20240250333Abstract: The present invention provides a thermally conductive composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a reaction rate controlling agent, wherein in measurement using a viscoelasticity measuring apparatus under conditions of 35° C., a shear mode, a frequency of 1 Hz, and a strain of 10%, a storage modulus G?1 after 3,600 seconds from the start of the measurement is 2,000 Pa or less, and a storage modulus G?2 after 7,200 seconds from the start of the measurement is 4,350 Pa or more, and wherein viscosity measured at 25° C. and a shear rate of 10 rpm is 220 Pa·s or less. According to the present invention, it is possible to provide the thermally conductive composition that has good workability and maintains reliability as a product, over a relatively wide temperature range.Type: ApplicationFiled: March 25, 2022Publication date: July 25, 2024Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Tatsuya IWAMOTO, Gaku KITADA, Toshiki KANEKO, Daichi SATO
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Patent number: 12024018Abstract: A decorative panel in which a touch sensor member can be disposed with a large degree of freedom even in a relatively large electronic device is provided. The decorative panel includes a cover panel member that has an opening portion; a touch sensor member that is disposed at the opening portion; and a design film that covers the cover panel member and the touch sensor member, and that has a movable portion that supports the touch sensor member so that the touch sensor member is displaceable with respect to the cover panel member.Type: GrantFiled: June 11, 2021Date of Patent: July 2, 2024Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Yoshifumi Honmatsu, Yasushi Sakai
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Patent number: 12021322Abstract: An electrical connection sheet includes a conduction part including a conductive rubbery elastomer, an adhesion member, and a sheet-shaped connection member fitted with the conduction part and the adhesion member. Both surfaces of the electrical connection sheet are adhesible.Type: GrantFiled: October 10, 2019Date of Patent: June 25, 2024Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Yasuyoshi Watanabe, Hideaki Konno, Tsubasa Kamiya
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Publication number: 20240182743Abstract: To provide a coating film-forming composition used for forming a coating film that is a protective film having a high capability to protect a circuit wire or sensor electrode and a small thickness and a circuit sheet or sensor sheet that includes a circuit wire or sensor electrode protected with the coating film. Provided is a circuit sheet or sensor sheet that includes a thermoplastic resin including at least one selected from an epoxy resin, a phenoxy resin, polyvinyl alcohol, polyvinyl acetal, polyvinyl butyral, and an ethylene-vinyl alcohol copolymer and having a hydrogen-bonding functional group and a glass transition temperature Tg of 70° C. or more and 150° C. or less.Type: ApplicationFiled: August 22, 2022Publication date: June 6, 2024Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Shinichi Tomooka, Kanae Miyanaga
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Patent number: 11993679Abstract: A thermally conductive sheet 10 of the present invention comprises a polymer matrix 12 and an anisotropic filler 13, and the anisotropic filler 13 is oriented in a thickness direction. The anisotropic filler 13 is disposed in such a way as to fall down in a proportion of 1 to 45% in the vicinity of surfaces 10A, 10B of the thermally conductive sheet 10. According to the present invention, a thermally conductive sheet capable of sufficiently improving the thermal conductive properties in the thickness direction can be provided.Type: GrantFiled: June 18, 2019Date of Patent: May 28, 2024Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki Kudoh, Taku Sasaki, Kana Hattori, Kazuyuki Yahara, Yasunari Kusaka
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Patent number: 11987687Abstract: A thermally conductive sheet comprising an anisotropic filler 12 in a polymer matrix 14, wherein the anisotropic filler 12 appears on at least one surface and the at least one surface has an arithmetic mean peak curvature (Spc) of 18000 (1/mm) or less.Type: GrantFiled: September 25, 2019Date of Patent: May 21, 2024Assignee: SEKISUI POLYMATECH CO., LTD.Inventor: Hiromichi Iwazaki
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Patent number: 11987124Abstract: To provide a capacitive input device that enables the user to feel that the input operation has been done. A capacitive input device includes a surface sheet, a soft member, and a sensor sheet configured to detect a change in capacitance. The surface sheet includes an operation area on which a touching operation is to be performed. The soft member is provided between the operation area and the sensor sheet. The sensor sheet includes a sensor electrode located at a position corresponding to the operation area. When the operation area is pressed in a touching operation, the surface sheet and the soft member are displaced toward the sensor sheet and the sensor electrode detects the capacitance.Type: GrantFiled: September 28, 2021Date of Patent: May 21, 2024Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Kanae Miyanaga, Shinya Tateda, Yohei Yamamoto
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Patent number: 11987686Abstract: A thermally conductive sheet 10 comprises a polymer matrix 12 and an anisotropic filler 13, and the anisotropic filler 13 is oriented in a thickness direction. The anisotropic filler 13 is exposed on the surfaces 10A, 10B of the thermally conductive sheet 10, and the anisotropic filler 13 which is exposed is disposed in such a way as to fall down in a proportion of 3.5 to 45%.Type: GrantFiled: June 18, 2019Date of Patent: May 21, 2024Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki Kudoh, Taku Sasaki, Kana Hattori, Kazuyuki Yahara, Yasunari Kusaka
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Publication number: 20240132766Abstract: The present invention provides a thermally conductive composition comprising: (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a polysiloxane compound containing at least one alkyl group having 4 or more carbon atoms. According to the present invention, it is possible to provide the thermally conductive composition capable of forming a thermally conductive member having an excellent thermally conductive property and high adhesive force to polypropylene.Type: ApplicationFiled: January 20, 2022Publication date: April 25, 2024Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Tatsuya IWAMOTO, Gaku KITADA
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Patent number: 11881643Abstract: Provided is an electrical connection member including a conductive member made of a rubber-like elastic material, through which a terminal used for supplying power is mounted to a mounted member such as a glass plate, and electrically connected with a small electric resistance to contact member provided in the mounted member, resulting in less reduction of rubber-like elasticity of the conductive member due to a temperature increase of the electrical connection member, even if large current flows. With respect to the conductive member 11 made of the rubber-like elastic material provided in the electrical connection member 10, a compression set measured after the following treatment is 50% or less, the treatment being comprise applying a load between an upper surface and a lower surface of the conductive member and conducting 25% compressive deformation at 105° C. for 22 hours; and electric resistance between the upper surface and the lower surface is 0.1? or less during application of the load.Type: GrantFiled: March 6, 2020Date of Patent: January 23, 2024Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Hideaki Konno, Yasuyoshi Watanabe, Tsubasa Kamiya
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Publication number: 20240021909Abstract: The present invention relates to a battery module comprising a case, a plurality of cells arranged in the case, and a heat absorbing member disposed at least either between the case and the cell or between the plurality of cells, wherein the heat absorbing member comprises a silicone matrix and a small particle size aluminum hydroxide having a particle size of 5 ?m or less dispersed in the silicone matrix, wherein a content of the small particle size aluminum hydroxide is 20 vol % or more. According to the present investigation, a battery module capable of absorbing a generated heat at 300° C. or less for a long period of time can be provided.Type: ApplicationFiled: December 17, 2021Publication date: January 18, 2024Applicant: SEKISUI POLYMATECH CO., LTD.Inventor: Gaku KITADA
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Patent number: 11852510Abstract: A sensor includes a base member and a sensor sheet, and the sensor sheet includes a sensor main body including sensor electrodes and a tail portion that includes wiring lines electrically connected to the sensor electrodes and that projects and extends with respect to the base member. The base member includes a joint surface portion that is fixed to the sensor main body and a separation portion that is disposed at a position facing a tail support portion of the tail support portion to which the tail portion is connected and that is not fixed to the tail support portion.Type: GrantFiled: December 23, 2019Date of Patent: December 26, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Shinichi Tomooka, Yasushi Sakai
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Patent number: 11855368Abstract: An electric connection member comprises a conductive member, a fixing member which brings the conductive member into contact with a connection target member and holds the conductive member in a state of compression in a thickness direction Z. The conductive member has a compressive stress of 1.0 N/mm2 or more and 15.0 N/mm2 or less when compressed by 25% in the thickness direction. The fixing member has an elongation of 400 ?m or less when drawn at 96 kPa for 30 minutes in a direction along the thickness direction Z.Type: GrantFiled: April 24, 2020Date of Patent: December 26, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Yasuyoshi Watanabe, Hideaki Konno, Tsubasa Kamiya, Tatsuya Kogiso
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Publication number: 20230395277Abstract: Transmission loss of electrical signals is reduced. A conductive member for conductive connection between a first connection object and a second connection object includes a polymeric matrix made of a rubber-like elastic substance and a conductive medium. The conductive medium includes conductive particles successively arranged in a conducting direction of the conductive member. The conductive particles have a surface roughness expressed by an arithmetic mean height, and the surface roughness is 5 ?m or less. The conductive particles have a surface roughness expressed by a developed interfacial area ratio (Sdr), and the surface roughness is 20 or less.Type: ApplicationFiled: November 24, 2021Publication date: December 7, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Tsubasa Kamiya, Hideaki Konno
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Publication number: 20230365766Abstract: The present invention is a thermally conductive sheet comprising: a matrix comprising an organic polymer, and a carbon fiber X, the carbon fiber X being oriented in a thickness direction of the sheet, wherein a proportion of a carbon fiber (A) having a fiber length of 100 µm or less is 40% or more and a proportion of a carbon fiber (B) having a fiber length of 200 µm or more is 3 to 13% of the carbon fiber X. According to the present invention, a thermally conductive sheet in which the thermal resistance value is effectively reduced by polishing the surface, resulting in a sheet having a low thermal resistance value can be provided.Type: ApplicationFiled: August 24, 2021Publication date: November 16, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiromichi IWAZAKI, Kentaro KIUCHI, Kenta KUROO, Hiroki KUDOH
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Publication number: 20230355152Abstract: In a bioelectrode capable of detecting biometric information of a living body in touch with the bioelectrode, the bioelectrode includes a base, a first conductive layer that is laminated on a surface side of the base, that is formed by dispersing scale-shaped conductive particles in an insulating binder, and that has extensibility, and a second conductive layer that is laminated on a surface side of the first conductive layer, that has conductivity, and that is harder than the first conductive layer. The second conductive layer is disposed to be exposed at the surface side of the base where the second conductive layer is touchable with the living body. An amount of conductive particles filled in the second conductive layer is smaller than an amount of the conductive particles filled in the first conductive layer. The second conductive layer has a larger outer contour than the first conductive layer.Type: ApplicationFiled: July 1, 2021Publication date: November 9, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Masamichi Ishikubo, Hiroshi Ogasawara
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Publication number: 20230323181Abstract: Provided is a heat-conductive sheet including: a binder component that is a mixture of a silicone matrix (A) and a hydrocarbon compound (B); and a heat-conductive filler (C) dispersed in the binder component, wherein the heat-conductive sheet has a compression ratio at 80° C. and 0.276 MPa of 15% or more and a shape retention.Type: ApplicationFiled: July 21, 2021Publication date: October 12, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Kazuhiro NAMIKI, Hiromichi IWAZAKI, Kenta KUROO, Hiroki KUDOH