Patents Assigned to SEKISUI POLYMATECH CO., LTD.
  • Publication number: 20190185657
    Abstract: Provided are a sealant that is affixed to an electronic device provided on an electronic substrate or the like or to an exposed metal portion to protect the electronic device or other adherend from moisture and the like and a sealant composition before being cured to become the sealant. The sealant and the sealant composition have form stability, flexibility, and adhesiveness. The sealant composition contains, as essential components, a cured epoxy resin having a flexible backbone, a monofunctional (meth)acrylic ester monomer, a photo-radical polymerization initiator, and a styrene-based elastomer. The monofunctional (meth)acrylic ester monomer is curable by irradiation with light. The sealant composition has form stability and also has a flexibility such that a load measured when the sealant composition having a thickness of 1 mm is compressed by 25% with a cylindrical probe having a bottom end with a diameter of 10 mm is 0.19 to 3.2 N. The sealant is obtained by photocuring the sealant composition.
    Type: Application
    Filed: May 12, 2017
    Publication date: June 20, 2019
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventor: Hitomi AIZAWA
  • Publication number: 20190092995
    Abstract: To provide a thermally conductive sheet that has high thermal conductivity. A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.
    Type: Application
    Filed: April 7, 2017
    Publication date: March 28, 2019
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroki Kudoh, Tomonari Yamada
  • Publication number: 20190045627
    Abstract: To provide an elastic wiring member that is to be used in connection with an electronic component or an external electronic device and that is less likely to undergo a change in resistance when the member is stretched. An elastic wiring member includes a stretchable wiring line having stretchability and connected to a contact of an electronic device main body A and a contact of an electronic component, and a base sheet, formed of a rubber-like elastic body, holding the stretchable wiring line. The elastic wiring member 11 further includes reinforcing members arranged in or on the base sheet. The reinforcing members are located adjacent to connection parts of the stretchable wiring line connected to the contacts and when the base sheet is viewed from above. The reinforcing members inhibit the base sheet from stretching and prevent deformation of the connection parts of the stretchable wiring line.
    Type: Application
    Filed: September 9, 2016
    Publication date: February 7, 2019
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventor: Kozue Kikuchi
  • Publication number: 20190019934
    Abstract: A thermoelectric conversion element has a flexible base sheet provided with a thermoelectric conversion layer, a first electrode and a second electrode provided at longitudinal ends of the thermoelectric conversion layer, and a heat insulation layer provided on a back surface of the base sheet at a position overlapping the first electrode. Therefore, when the thermoelectric conversion element is attached to a heat-generating component, the first electrode is raised in height by the heat insulation layer so as to be disposed farther away from the heat-generating component than the second electrode, and moreover, thermal conduction from the heat-generating component is suppressed by the heat insulation layer.
    Type: Application
    Filed: January 13, 2017
    Publication date: January 17, 2019
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventor: Yasuyoshi Watanabe