Patents Assigned to SEKISUI POLYMATECH CO., LTD.
  • Publication number: 20210371660
    Abstract: There is provided a heat-conducting composition capable of forming thick films in good productivity. The heat-conducting composition contains a binder and a heat-conducting filler, wherein a first viscosity thereof is 50 to 300 Pa·s as measured at a rotating speed of 10 rpm at 25° C. by using a rotational viscometer; and the ratio [second viscosity/first viscosity] of a second viscosity to the first viscosity is 3 to 8 where the second viscosity is a viscosity measured at a rotating speed of 1 rpm at 25° C. by using the rotational viscometer.
    Type: Application
    Filed: November 5, 2019
    Publication date: December 2, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Keita ISHIDA, Gaku KITADA
  • Publication number: 20210324255
    Abstract: The present invention is a thermally conductive sheet comprising a heat-conducting layer comprising a polymer matrix and an anisotropic material, the anisotropic material oriented in a thickness direction and exposed on a surface, and a heat-softening layer provided on at least one surface of the heat-conducting layer, wherein the heat-softening layer covers the anisotropic material exposed on the surface of the heat-conducting layer. According to the present invention, a thermally conductive sheet capable of preventing falling of the anisotropic material can be provided.
    Type: Application
    Filed: September 4, 2019
    Publication date: October 21, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroki KUDOH, Chien-chiao LI
  • Publication number: 20210269695
    Abstract: A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.
    Type: Application
    Filed: May 3, 2021
    Publication date: September 2, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroki Kudoh, Tomonari Yamada
  • Publication number: 20210261737
    Abstract: A thermally conductive sheet 10 of the present invention comprises a polymer matrix 12 and an anisotropic filler 13, and the anisotropic filler 13 is oriented in a thickness direction. The anisotropic filler 13 is disposed in such a way as to fall down in a proportion of 1 to 45% in the vicinity of surfaces 10A, 10B of the thermally conductive sheet 10. According to the present invention, a thermally conductive sheet capable of sufficiently improving the thermal conductive properties in the thickness direction can be provided.
    Type: Application
    Filed: June 18, 2019
    Publication date: August 26, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroki KUDOH, Taku SASAKI, Kana HATTORI, Kazuyuki YAHARA, Yasunari KUSAKA
  • Publication number: 20210246982
    Abstract: Provided is a waterproof member that can prevent the waterproof member from being damaged during affixation and that can inhibit water from entering without causing air bubbles or the like to enter. A waterproof member sandwiched between a first member and a second member so as to seal between the first member and the second member includes a rigid base, a flexible contact member provided on a front surface of the rigid base, and an adhesive layer provided on a back surface of the rigid base. The front surface of the rigid base has a first region f which is a partial region of the front surface and in which the flexible contact member protrudes from a periphery thereof and a second region s that is a remaining region of the rigid base excluding the partial region and that is separated from the first region.
    Type: Application
    Filed: August 6, 2019
    Publication date: August 12, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventor: Tetsuya Togo
  • Patent number: 11084965
    Abstract: To provide a thermally conductive sheet that has high thermal conductivity. A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: August 10, 2021
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroki Kudoh, Tomonari Yamada
  • Patent number: 11085712
    Abstract: To provide a heat-dissipating sheet having good close-contact properties with an adherend such as a heat-generating body and being easy to handle. A heat-dissipating sheet includes a heat-dissipating member including a graphite sheet, a first thermally conductive layer, and a second thermally conductive layer stacked in this order. The first thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix and has an outer shape larger than the graphite sheet when viewed in plan. The second thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix, is more flexible than the first thermally conductive layer, and has an outer shape identical to or smaller than the first thermally conductive layer when viewed in plan.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: August 10, 2021
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventors: Shigeru Koyano, Yoshifumi Iimuro, Yoshiya Sakaguchi
  • Patent number: 11073912
    Abstract: A magnetic deformable member includes a magnetic portion formed of a magnetic elastic body, and a base portion formed of a non-magnetic elastic body to cover at least a side surface of the magnetic portion. At least the magnetic portion has a magnetic deformable portion in which shape deformation is caused by application of a magnetic field. The magnetic deformable portion is provided at a boundary-side end portion on the boundary with the base portion. A display portion in which the shape deformation is displayed is provided on a front surface s1 of the magnetic deformable member. With the magnetic deformable member, a tactile feel or viewability of the display portion can be varied by deforming the boundary between the magnetic portion and the base portion.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: July 27, 2021
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventor: Hiromi Suda
  • Publication number: 20210227689
    Abstract: In a stretchable wiring member having a relatively hard portion, such as a contact point, there is provided a solution to malfunction of the stretchable wiring member caused by stress generated at a boundary between the hard portion and a flexible portion. A stretchable wiring member includes a flexible substrate having stretchability, a stretchable wiring line disposed along the flexible substrate and configured to be stretched in association with stretching deformation of the flexible substrate, and a hard member that is harder than the flexible substrate. The flexible substrate has an extension layer portion interposed between the hard member and the stretchable wiring line.
    Type: Application
    Filed: June 28, 2019
    Publication date: July 22, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventor: Takaya Kimoto
  • Publication number: 20210202190
    Abstract: A metal contact member 10 includes a metal sheet 15, which has a plurality of streaky projecting portions extend along each other on a front surface 15A of the metal sheet 15. A rubber switch member 12 includes the metal contact member 10 and a rubber switch body 11 joined to the metal contact member 10.
    Type: Application
    Filed: May 28, 2019
    Publication date: July 1, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Manabu FUJITA, Takashi NAKAGAWA, Ryousuke SASAKI, Yohei YAMAMOTO
  • Patent number: 11044810
    Abstract: A stretchable wire member includes a base body in which a fixed wire is formed on a hard base material, and a stretching body in which a flexible wire is formed at a flexible base material. In the stretchable wire member in which the base body and the stretching body are fixed and connected to each other, the hard base material includes a projecting part that reduces concentration of stress that is generated at a boundary between the base body and the stretching body, and an upper surface and a lower surface of the projecting part and an upper surface and a lower surface of a recessed part surrounded by the projecting part are covered by a base-body-side flexible base material extending from the stretching body.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 22, 2021
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventors: Takaya Kimoto, Tohru Kimura, Masamichi Ishikubo
  • Publication number: 20210152911
    Abstract: An earpiece is provided. The earpiece can deform flexibly so as to follow the earhole when in use, and the earpiece can be manufactured easily. An earpiece includes an earpiece body and a filler filled in the earpiece body. The earpiece body has a container-like base member formed of a rubber-like elastic diaphragm that is shaped like a container and has an opening portion. The earpiece body also has a lid member that seals the opening portion liquid-tightly. The filler is flowable at room temperature.
    Type: Application
    Filed: April 15, 2019
    Publication date: May 20, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventor: Shinya Mizoe
  • Patent number: 11008462
    Abstract: A thermally conductive sheet contains a matrix composed of an organopolysiloxane having a crosslinked structure, a thermally conductive filler dispersed in the matrix, and a silicon compound. The silicon compound is at least one selected from the group consisting of alkoxysilane compounds and alkoxysiloxane compounds.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: May 18, 2021
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventor: Hiroki Kudoh
  • Publication number: 20210130570
    Abstract: A thermally conductive sheet 10 comprises a polymer matrix 12 and an anisotropic filler 13, and the anisotropic filler 13 is oriented in a thickness direction. The anisotropic filler 13 is exposed on the surfaces 10A, 10B of the thermally conductive sheet 10, and the anisotropic filler 13 which is exposed is disposed in such a way as to fall down in a proportion of 3.5 to 45%.
    Type: Application
    Filed: June 18, 2019
    Publication date: May 6, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroki KUDOH, Taku SASAKI, Kana HATTORI, Kazuyuki YAHARA, Yasunari KUSAKA
  • Patent number: 10964620
    Abstract: To provide a thermally conductive sheet that has high thermal conductivity. A thermally conductive sheet contains carbon fibers and a flake graphite powder that are dispersed in a polymer matrix. The flake graphite powder is disposed between the carbon fibers, the fiber axis directions of the carbon fibers are oriented in a sheet thickness direction Z, long axis directions of flake surfaces of the flake graphite powder are oriented in the sheet thickness direction Z, and normal directions to the flake surfaces are randomly oriented in a surface direction of the sheet. A mass ratio of the carbon fibers to the flake graphite powder is in a range of 120:10 to 60:70. According to this thermally conductive sheet, the thermal conductivity can be increased compared to when carbon fibers are used alone or a flake graphite powder is used alone.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: March 30, 2021
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventor: Hiroki Kudoh
  • Publication number: 20210060825
    Abstract: Provided is an improved rubber band for mounting an electronic device body on a body. In a rubber band and in a method for manufacturing a rubber band, a resin plate having a plurality of resin holes is inserted between an outer-surface mold and a back mold to form a first outer sheath 6a on a surface of the resin plate. Subsequently, the resin plate on which the first outer sheath 6a is formed is inserted between the outer-surface mold 8a and an inner-surface mold to form a second outer sheath on a back surface of the resin plate.
    Type: Application
    Filed: May 15, 2019
    Publication date: March 4, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventor: Asei William Kawaguchi
  • Publication number: 20210057304
    Abstract: A heat-conducting sheet 1 comprising a first heat-conducting layer 1a and a second heat-conducting layer 1b, which each comprise a polymer matrix 2 and an anisotropic filler 3, and wherein the anisotropic filler is oriented in a thickness direction. The first and second heat-conducting layers 1a and 1b are laminated via an interface 5 in which a filling ratio of the anisotropic filler 3 is lower than that of the first and second heat-conducting layers 1a and 1b.
    Type: Application
    Filed: February 14, 2019
    Publication date: February 25, 2021
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventor: Shigeru KOYANO
  • Publication number: 20200385577
    Abstract: A thermally conductive sheet contains a matrix composed of an organopolysiloxane having a crosslinked structure, a thermally conductive filler dispersed in the matrix, and a silicon compound. The silicon compound is at least one selected from the group consisting of alkoxysilane compounds and alkoxysiloxane compounds.
    Type: Application
    Filed: June 25, 2018
    Publication date: December 10, 2020
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventor: Hiroki KUDOH
  • Patent number: 10860157
    Abstract: A touch panel includes a insulator, X electrodes arranged on one insulator surface and each including X lines, Y electrodes arranged on another insulator and each including Y lines, X auxiliary lines each connecting adjacent X lines, and Y auxiliary lines each connecting adjacent Y lines. The auxiliary lines are located on diagonals of cells L, defined by the X lines and the Y lines and arranged in rows and columns. The X and Y auxiliary lines are arranged without overlapping or being superposed on each other. Each of the rows and columns includes at least one cell having either the X or Y auxiliary lines and at least one cell having neither the X or Y auxiliary lines. The rows include no row that has neither the X or Y auxiliary lines, and the columns include no column that has neither the X nor the Y auxiliary lines.
    Type: Grant
    Filed: July 4, 2018
    Date of Patent: December 8, 2020
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventor: Shinichi Tomooka
  • Publication number: 20200336143
    Abstract: To provide an input operation device capable of detecting, using a simple configuration, a first operation of touching an operation surface with an operation body and a second operation of pressing the operation surface with the operation body. An input operation device 11 includes a detection value changing part 31, which changes a detection value of a capacitive sensor 12, and a supporting part 41, which supports a touch sensor part 21 in a state in which the detection value changing part 31 and the touch sensor part 21 are separated from each other. The detection value changing part 31 is arranged on a back surface 24 side opposite to the operation surface 22 of the touch sensor part 21, and changes the detection value depending on contact with the detection part 23.
    Type: Application
    Filed: October 22, 2018
    Publication date: October 22, 2020
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Yoshifumi HONMATSU, Kouta YAMAZAKI