Abstract: Disclosed is a substrate processing apparatus in which weight of a buffer module may be reduced compared to the apparatus in the related art.

Abstract: A method for treating a substrate, including a solvent processing step of supplying an organic solvent onto the substrate to treat the substrate, a drying step of drying the substrate to remove the organic solvent on the substrate, and a bake step of heating the substrate to thermally decompose an impurity adhering to the substrate, where the drying step and the bake step are performed in different chambers.

Abstract: A printing apparatus and an ink refill method thereof are provided. The printing apparatus may comprise a printing unit performing printing, and an ink filling unit filling ink in the printing unit in an upward manner, wherein the printing unit includes a printing ink receptor accommodating ink, a spray head spraying the ink, and a pressure controller controlling a pressure of a fluid for operation of the ink, and the ink filling unit includes a supply ink receptor filled with ink for supply to the printing unit, and an ink supply unit mounted on the spray head to supply the ink supplied from the supply ink receptor to the spray head.

Abstract: Disclosed are an apparatus and a method for treating a substrate, and more particularly, an apparatus and a method for heat treating a substrate. The apparatus includes: a heating unit provided in the inner space, and providing a treatment space in which a heating process of the substrate is performed; a transfer plate positioned within the inner space, and movable between an inner position for loading the substrate into the treatment space or for unloading the substrate from the treatment space and an outer position provided outside the heating unit; and a gas injection unit positioned within the inner space, and for injecting atmosphere gas toward the substrate at the outer position.

Abstract: Disclosed is a substrate processing apparatus and a substrate processing method that may increase the amount of substrates produced by preventing a main transfer robot that transfers a substrate between a liquid treatment chamber and a heat treatment chamber from transferring an edge-exposed substrate.

Abstract: Disclosed is a container. The container includes a housing having an interior space, and a support part that supports an expendable component in the interior space, and the support part includes an alignment pin that aligns the expendable component.

Abstract: A substrate processing method and a substrate processing apparatus for removing material on a substrate are disclosed. In order to remove the material, a processing liquid including a chemical liquid and water is supplied on the substrate so that a liquid layer maintained by surface tension is formed. The material is removed from the substrate by a reaction between the material and the processing liquid. A size distribution of by-product particles formed by the reaction between the material and the processing liquid is measured by a dynamic light scattering method. A supply of the processing liquid is controlled based on the size distribution of the by-product particles.

Abstract: A substrate treating apparatus and a substrate treating system including the same are disclosed, in which the number of heat treatment chambers such as anneal chambers may be varied. The substrate treating apparatus includes a first chamber heat-treating a substrate; and a second chamber treating the substrate in another way different from heat-treatment, wherein the number of the first chambers is varied depending on the number of the second chambers that need heat treatment for the substrate.

Abstract: Provided are a control unit that predicts the life of an inkjet head unit and maximizes its life to be used, and a substrate treating apparatus including the same. The control unit performs maintenance of an inkjet head unit for discharging a substrate treatment liquid onto a substrate and comprises a count module for counting the number of discharges for each nozzle of the inkjet head unit, a comparison module for comparing the number of discharges with a reference value to determine whether the number of discharges is equal to or greater than the reference value, and an evaluation module for evaluating whether a life of the inkjet head unit has reached a usable life based on whether the number of discharges of each nozzle is equal to or greater than the reference value.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes substrate treating apparatus comprising: a treating container having an inner space; a support unit configured to support and rotate a substrate within the inner space; an exhaust duct configured to exhaust the inner space; and at least one guide member combined with the treating container and configured to guide an airflow within the inner space, and wherein the at least one guide member is arranged such that the airflow within the inner space obliquely flows with respect to a rotation direction of the substrate supported by the support unit when seen from above.

Abstract: A substrate processing apparatus includes: a nozzle unit configured to discharge a processing liquid to a substrate; a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid; a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including at least one of a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and a control unit connected to the charge amount control unit.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber that provides a treatment space, in which a substrate is treated, in an interior thereof, a fluid supply unit that supplies a fluid into the process chamber, and an exhaust units including an exhaust line, through which the fluid in the process chamber is exhausted, the fluid supply unit includes a supply tank, in which the fluid is stored, a supply line connecting the supply tank and the process chamber, a branch line branched from the supply line at a first point of the supply line, and a controller that controls the fluid supply unit, and the controller controls the fluid supply unit such that the fluid is drained from the supply line through the branch line shortly before the fluid is supplied into the process chamber.

Abstract: A driving apparatus of semiconductor manufacturing equipment is disclosed. The driving apparatus includes a first driver for applying a signal driving a first motor and a second driver for applying a signal driving a second motor. The first driver and the second driver drive the first motor and the second motor in different schemes. The driving apparatus further includes a controller that performs integrated control of the first driver and the second driver. Each of the first driver and the second driver is connected with the controller through an I/O cable. The controller identifies the first driver or the second driver using information input through the I/O cable. The controller changes a signaling scheme depending on a driving mode of the motor corresponding to the identified driver.

Abstract: A method for processing a substrate includes providing the substrate, a film being formed on the substrate, performing pretreatment to surface-treat the film formed on the substrate using a treatment gas in a plasma state, and performing, after the pretreatment, liquid treatment to remove the film from the substrate by supplying a treatment liquid onto the substrate.

Abstract: The inventive concept provides a substrate treating apparatus.

Abstract: Proposed are a gas supplying apparatus, a gas supply control method, and a substrate processing apparatus. The device that supplies a gas to a chamber adapted to perform a processing operation on a substrate includes a gas supply line connected from a gas source to the chamber and providing a flow path for the gas, a circulation line branching off from a branch point of the gas supply line and connected to an upstream side of the branch point, an ejector having an internal space that sucks a gas provided from the circulation line using a pressure of the gas introduced from the gas source, and injecting the gas in the internal space into the gas supply line, and a flow control module configured to regulate a flow rate of the gas supplied to the chamber by controlling the pressure of the gas in the gas supply line.

Abstract: The inventive concept provides an inkjet printing method. The inkjet printing method for discharging an ink on a substrate using a head having a plurality of nozzles formed thereon includes determining a grade of nozzles by measuring a discharge performance of the nozzles, which is a grading step; selecting a use nozzle that can participate in printing the substrate among the nozzles based on the grade determined at the grading step, which is a nozzle selecting step; and discharging the ink on the substrate using at least one nozzle among use nozzles, which is a printing step.

Abstract: A substrate processing method for processing a substrate, the substrate processing method comprising: a first nozzle moving step of moving a first nozzle to a process position and a standby position in a swing motion manner; a cleaning liquid supplying step of supplying, by the first nozzle, a cleaning liquid onto a rotating substrate at the process position of the first nozzle; a second nozzle moving step of moving a second nozzle to a process position and a standby position in a swing motion manner; a drying gas supplying step of supplying, by the second nozzle, a drying gas onto the rotating substrate at the process position of the second nozzle; and a nozzle distance controlling step of controlling a distance between the first nozzle and the second nozzle on the basis of a horizontal position of at least one of the first nozzle and the second nozzle.

Abstract: A wafer inspection method includes acquiring an inspection image from an edge region of a wafer, generating a color profile of the inspection image in a radial direction of the wafer, detecting a side surface of a layer formed on the wafer based on a change in the color profile in a first direction from a side surface of the wafer toward a center of the wafer, and calculating a distance between the side surface of the layer and the side surface of the wafer.

Abstract: A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.