Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support and rotate a substrate at a treating space; a liquid supply unit configured to supply a liquid to the substrate supported at the support unit; a housing having an installation space; a laser unit configured to include a laser irradiation unit positioned in the installation space which irradiates a laser light, and an irradiation end having an end positioned to protrude from the housing and which irradiates the laser light irradiated from the laser irradiation unit to a substrate supported on the support unit; and a cover having an inner space and positioned so an end of the irradiation end protruding from the housing is positioned in the inner space, and wherein an opening is formed at a bottom end of the cover to overlap the laser light irradiated from the irradiation end when seen from above.

Abstract: A substrate support unit includes a substrate support member that supports a substrate, the substrate support member being provided with one or more pin holes vertically penetrating the substrate support member, and a lift pin assembly provided to be lifted along a corresponding pin hole. The lift pin assembly includes lift pins, each lift pin having an upper end contacting the substrate and supporting the substrate, and a pin drive unit that is coupled to the lift pins and lifts the lift pins. The pin drive unit includes piezoelectric motors below the lift pins, respectively.

Abstract: Provided are a substrate inspecting unit capable of monitoring line defects or a bunch of spots formed on a substrate, and a substrate processing apparatus including the same. The substrate processing apparatus comprises a process processing unit for supporting a substrate; an inkjet head unit for discharging a droplet on the substrate while moving in a first direction and a second direction; a gantry unit for moving the inkjet head unit; and a substrate inspecting unit for inspecting the substrate in real time based on a plurality of droplets belonging to at least one row or column when the droplet is discharged onto the substrate and formed in the at least one row or column, wherein the substrate inspecting unit inspects a first defect related to a line caused by the plurality of droplets and/or a second defect related to an area caused by the plurality of droplets.

Abstract: The inventive concept provides a sensor station. The sensor station includes a body providing an inner space for storing a substrate-type sensor; a power source unit installed at the body and configured to transmit a power to the substrate-type sensor; a processing unit installed at the body and configured to process a data measured by the substrate-type sensor; and a communication unit installed at the body and configured to exchange a data with the substrate-type sensor and a server of a substrate treating system.

Abstract: A substrate bonding apparatus of the present disclosure includes a first chuck having a diameter larger than that of a first substrate; a deformation plate configured to support the first substrate, and is configured to have a variable shape on the first chuck; and a deformation unit between the first chuck and the deformation plate, wherein the deformation unit includes a main supporter that is deformable to press the deformation plate, the main supporter having a closed curve shape with a penetrating center.

Abstract: An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution.

Abstract: There is provided a substrate processing apparatus including a chamber having a processing space therein, a dielectric window arranged at an upper portion of the chamber and configured to cover an upper surface of the chamber, and an RF source disposed on the dielectric window and configured to supply RF power to generate plasma from gas in the processing space, wherein the RF source includes an RF electrode disposed on the dielectric window and an RF plate disposed on the RF electrode, the dielectric window includes a groove extending vertically downward from an uppermost surface of the dielectric window, and the RF plate has a ring shape.

Abstract: The present invention relates to a substrate transfer system and method enabling a direction of a substrate or the order of substrates to be maintained even when the substrate is swing-moved and transferred by a robot transportation device, in particularly, the substrate transfer system may include: a robot transportation device that transfers at least one substrate using at least one swing-movable transport arm; and a compensatory rotation device that is mounted on the transport arm of the robot transportation device and selectively supports the substrate to thus enable compensatory rotation thereof so that, even when the transport arm has a swing motion while the substrate is transferred by the robot transportation device, a direction of the substrate or the order of the substrates can be maintained.

Abstract: An article transport apparatus includes a traveling portion configured to travel along a rail portion and a mounting portion configured to have a structure suspended under a traveling portion to mount articles thereon, in particular, the rail portion includes a plurality of first straight rails extending in a first direction while being arranged parallel to each other at first intervals, a plurality of second straight rails extending in a second direction perpendicular to the first direction while being arranged parallel to each other at second intervals, and a connecting rail configured to connect between the first straight rails and the second straight rails, which perpendicularly face each other, so that the traveling portion travels between the first straight rails and the second straight rails perpendicularly facing each other.

Abstract: The present disclosure may provide an auto-teaching method and apparatus using a distance measuring sensor a semiconductor manufacturing facility having a transfer robot including the same, and a substrate processing apparatus including a test substrate according to an embodiment of the present disclosure, may include: a test substrate connected to a robot arm and entering a processing apparatus in a first predetermined direction; a distance measuring sensor connected to the test substrate, and measuring a distance from the processing apparatus in the first direction while scanning the processing apparatus in a predetermined second direction; and a position control unit determining a region in which a substrate may enter the processing apparatus in the second direction, based on predetermined processing apparatus-related information and a measured result of the distance measuring sensor.

Abstract: Provided is an apparatus for checking a point of impact. The apparatus for checking a point of impact includes: a first supply unit configured to supply an object through rolling; a second supply unit configured to receive the object from the first supply unit through rolling and supply the object to a demand place; a variable unit configured to apply a tension force by pressurizing the object or release the tension force by releasing the pressurization based on a change in a position; a detection unit configured to detect the change in the position of the variable unit to generate position information of the object; a guide unit provided between the first supply unit and the second supply unit to guide the object; and a control unit configured to control a handling process including the supply of the object based on the position information of the detection unit.

Abstract: A crane device comprises: a first crane robot; and a second crane robot. The first crane robot comprises: a first column configured to be movable in a first direction and extend in a second direction; a first arm unit configured to be movable along the first column; and a first drive unit installed in an upper part of the first column and configured to move the first column in the first direction, and the second crane robot comprises: a second column configured to be movable in the first direction and extend in the second direction and spaced apart from the first column; a second arm unit configured to be movable along the second column; and a second drive unit installed in a lower part of the second column and configured to move the second column in the first direction.

Abstract: In a method of processing a substrate, a test film having a first area and a second area adjacent to the first area is provided. A first jet value is obtained from a first test pattern formed by jetting a chemical solution through a plurality of nozzles onto the first area of the test film. The chemical solution is jetted onto a first substrate based on the first jet value. A second jet value is obtained from a second test pattern formed by jetting the chemical solution through the plurality of nozzles onto the second area of the test film. The chemical solution is jetted onto a second substrate based on the second jet value.

Abstract: An apparatus for processing a substrate may include a heating plate configured to heat a substrate placed thereon, a cooling conveyor including a conveyor configured to transfer a heated substrate, and a first cooling part configured to cool the heated substrate while transferring the heated substrate on the conveyor and configured to provide a cooling atmosphere relative to the heated substrate over the conveyor, and a transfer part configured to transfer the heated substrate from the heating plate onto the conveyor.

Abstract: Proposed are a substrate processing system and a process gas supply control verification method and, more particularly, to a technology to verify the operation of a mass flow controller (MFC) that supplies a process gas for semiconductor processing at an appropriate flow rate according to a recipe.

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a load lock chamber, of which a pressure of an interior space is changed between a first pressure and a second pressure that is lower than the first pressure, an index chamber connected to the load lock chamber, and a measurement unit that measures a level of particles in the interior space, and the measurement unit is located outside the load lock chamber.

Abstract: A substrate processing apparatus includes a first supply pipe supplying a first chemical liquid to a substrate, a second supply pipe, spaced apart from the first supply pipe, and supplying a second chemical liquid to the substrate, and a recovery pipe connected to the first supply pipe to collect the first chemical liquid, and disposed between the first supply pipe and the second supply pipe.

Abstract: The inventive concept provides a ceiling stocker. The ceiling stocker includes a shelf assembly, at which shelves on which an article is placed are positioned along a first direction on a same plane, is placed in multiple layers; and a transfer module provided at a top part of the shelf assembly and which loads and unloads the article on the shelf, and wherein the transfer module includes: a vehicle moving along a driving rail installed on a ceiling; and a hoist provided at the vehicle, and wherein the shelf assembly includes a shelf driving unit configured to move the shelves along the first direction so a moving path for the hoist to approach the shelf may be provided.

Abstract: An apparatus for processing a substrate may include a substrate holding part configured to maintain and support a substrate, a substrate transfer part configured to load the substrate onto the substrate holding part and to unload the substrate from the substrate holding part, and a substrate processing part configured to heat the substrate or to cool the substrate. The substrate holding part may include a plate configured to maintain and support the substrate, guide parts configured to move the substrate into a central region of the plate, and an alignment part configured to move the guide parts toward the central region of the plate utilizing a vacuum suction mechanism.

Abstract: Proposed are an OHT vehicle and a method of controlling the operation of the same. More particularly, proposed is a technology in which when a steering change is not performed properly as a steering wheel is adhered to a damper during the operation of a steering unit of an OHT vehicle, a dithering motion function is applied to the steering wheel to enable an efficient steering change of the OHT vehicle.