Abstract: Disclosed are a substrate processing apparatus including a fluid supply unit and a fluid control method for controlling a flow rate of fluid. The fluid control method for controlling a flow rate of fluid to be supplied to a lower surface of a substrate from a fluid supply unit including a fluid source for supplying fluid and fluid supply lines connected to the fluid source includes a dimension measurement step of measuring lengths and cross-sectional areas of the fluid supply lines, a volume calculation step of calculating volumes of the fluid supply lines using the lengths and the cross-sectional areas measured in the dimension measurement step, a time measurement step of opening a valve provided in the fluid source to measure a time for which fluid is supplied to the fluid supply lines, and a control step of controlling a flow rate of fluid based on data obtained in the previous steps.

Abstract: Disclosed are a semiconductor manufacturing facility and a shower head coating method using the same. The semiconductor manufacturing facility includes an index block, a processing block including a substrate processing apparatus, and a substrate transferring block. The substrate processing apparatus includes a chamber including a processing space defined therein, a substrate support unit disposed in the processing space and including a first heating member configured to heat the substrate coated with the precursor, a gas supply unit configured to supply gas to the processing space, a plasma generation unit configured to convert the supplied gas into plasma, a shower head configured to supply the supplied gas to the processing space, and a controller. The controller controls the first heating member to heat the substrate supported by the substrate support unit so that the precursor applied to the substrate is vaporized and a coating layer is formed on the shower head.

Abstract: Disclosed are a substrate processing method and a substrate processing apparatus. The substrate processing method of etching a thin film formed on a substrate in units of atomic layers includes a modifying step of supplying a modifying gas to a processing space in a chamber accommodating the substrate to modify a surface of the thin film and form a modified film having a first thickness, a surface adsorption step of supplying a precursor to the processing space to adsorb the precursor to the modified surface of the thin film, and an etching step of supplying heat to the substrate adsorbed with the precursor to etch the modified surface of the thin film adsorbed with the precursor. The surface adsorption step and the etching step are repeatedly performed multiple times until the modified film having the first thickness is etched.

Abstract: Provided are a method of automatically setting a purge mode of a side track buffer (STB) and a system for manufacturing a semiconductor wafer, and the method, performed by a system for manufacturing a semiconductor wafer including a side track buffer (STB) including a purge device for supplying inert gas to discharge a process gas of a FOUP, and a mode determination unit for determining a purge mode in which the purge device of the STB in which the FOUP is seated is able to be driven, includes identifying specifications of the purge device corresponding to a configuration of the purge device; and determining a drivable purge mode from among predetermined purge modes depending on the identified specifications of the purge device.

Abstract: A substrate treating device includes a liquid treating chamber for liquid-treating a substrate therein, a drying chamber for dry-treating the liquid-treated substrate, a transfer device for transferring the substrate between the liquid treating chamber and the drying chamber, and a controller for controlling the liquid treating chamber and the transfer device. The transfer device includes a transfer robot having a hand for placing the substrate thereon, and a heating member for heating the substrate. The controller controls the transfer device such that the heating member of the transfer device heats a liquid on the substrate to a first temperature before the transfer device transfers the substrate taken out from the liquid treating chamber to the drying chamber.

Abstract: The present disclosure provides a method for processing a substrate that can maintain a production amount even when a production model is changed. The method for processing a substrate comprises: disposing the substrate on a levitation stage; measuring a distance between the substrate and an inkjet head module; and changing a discharging speed of ink to be discharged from the inkjet head module based on the measured distance.

Abstract: Disclosed is a method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate. The method includes a first irradiation operation for irradiating a plurality of unit pulse laser beams onto the substrate while the substrate is rotating, and a second irradiation operation for irradiating a plurality of unit pulse laser beams to regions of the substrate onto which the unit pulse laser beams are not irradiated in the first irradiation operation.

Abstract: Disclosed is a method of processing a substrate, the method including: a coating operation of supplying a coating liquid containing a volatile component to a top surface of the substrate to form a cleaning film; and a cleaning film processing operation of processing the cleaning film, in which the cleaning film processing operation includes: a crack formation operation of generating a crack in the cleaning film formed on the substrate to form film flakes; and a delamination operation of delaminating the film flakes from the top surface of the substrate by volatilizing the volatile component contained in the film flake.

Abstract: Disclosed is a substrate treating apparatus including: a chamber providing a treatment space therein; a substrate support member located inside the chamber and for supporting a substrate; a supply port for supplying a treatment fluid into the treatment space of the chamber; a filler member located between the supply port and the substrate to fill a portion of a volume of the treatment space, in which the filler member has perforations, and the perforations are provided in a collision shape such that treatment fluids passing through the perforations collide each other.

Abstract: Disclosed is a substrate processing apparatus including a substrate support unit. The substrate support unit supports a substrate, has at least one pin hole formed vertically therethrough, and accommodates a lift pin therein so as to allow the lift pin to ascend and descend through the pin hole. The substrate support unit includes a ceramic puck on which the substrate is seated, a base plate configured to support the ceramic puck, an adhesive layer for coupling between the ceramic puck and the base plate, and a bush provided around the pin hole. The bush includes a first bush having a tube shape and a second bush coupled to an outer peripheral surface of the first bush, and the first bush includes a protruding portion formed on an upper surface thereof.

Abstract: Disclosed is an apparatus for treating a substrate, the apparatus including: a spin chuck for supporting a substrate and rotatable; a nozzle unit for supplying a cleaning solution and drying gas onto the substrate supported by the spin chuck; and a controller for controlling the nozzle unit, in which the nozzle unit includes: a head; a plurality of cleaning nozzles provided on the head and for discharging the cleaning solution; a plurality of drying nozzles provided on the head and for discharging the drying gas; and a driver for moving the head from a first position to a second position, when the head is in the second position, an impact point of the cleaning solution discharged from the plurality of cleaning nozzles onto the substrate is at a location farther from a center of the substrate than an impact point of the cleaning solution when the head is in the first position, the cleaning solution is discharged simultaneously from the plurality of cleaning nozzles, the impact points of the cleaning solution a

Abstract: Disclosed are a substrate support device and a method of controlling prevention of leakage of temperature control fluid. In a substrate support device that controls temperature through supply of temperature control fluid, a sealing member configured to be actively controlled in volume expansion taking into consideration a difference in coefficient of expansion between a fluid supply block supplying the temperature control fluid and an electrostatic chuck due to the materials thereof is employed, thereby preventing leakage of the temperature control fluid.

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a chamber including a processing space defined therein, a substrate support unit configured to support a substrate in the processing space, a microwave unit configured to supply microwaves to the processing space, a window member disposed below the microwave unit and configured to transmit the microwaves supplied from the microwave unit, a heat transfer plate disposed in the processing space so as to be spaced a predetermined distance from the window member and configured to be heated by the microwaves supplied to the processing space and to transfer heat to the substrate, and a controller configured to control the microwave unit.

Abstract: A method of controlling a transport vehicle in an article transport system in a production factory includes checking tasks for transporting articles, searching for routes for the respective tasks for a plurality of transport vehicles, calculating expected power consumption for the respective tasks of the transport vehicles, and assigning the tasks to the transport vehicles based on the expected power consumption for the respective tasks and remaining power of the transport vehicles.

Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a body providing a processing space; a supply line for supplying a drying fluid that removes a treatment fluid on a substrate supported in the processing space; an exhaust line for exhausting an atmosphere of the processing space; and a fluid circulation unit connected with the exhaust line and the supply line, in which the fluid circulation unit includes: a separator for separating the treatment fluid and the drying fluid from a mixed fluid in which the treatment fluid and the drying fluid exhausted from the processing space are mixed; and a liquid reuse line connected to the separator, and for withdrawing, from the separator, the treatment fluid separated from the separator.

Abstract: Disclosed is a manufacturing method including: a substrate loading operation of loading a substrate into a liquid treating chamber; a liquid treating operation of supplying a treatment solution to the substrate rotating in the liquid treating chamber through a nozzle; a substrate unloading operation of unloading the substrate from the liquid treating chamber, and a pressure control operation of changing a pressure of a space above the substrate at least one time in a period between the substrate loading operation and the substrate unloading operation.

Abstract: The present disclosure provides a substrate treating apparatus having improved efficiency and productivity. The substrate treating apparatus of the present disclosure comprises a process chamber having a treating space therein, a transfer robot comprising a robot hand for loading and unloading a substrate into and out of the treating space and gripping the substrate, and a teaching buffer for aligning the robot hand, wherein the teaching buffer comprises a teaching plate for providing a reference point, and at least one camera looking at the teaching plate, wherein the camera captures the reference point of the teaching plate, wherein the transfer robot aligns the robot hand with the reference point using the camera.

Abstract: A method and a device for controlling an OHT vehicle are proposed. The method and device presents a solution in which it is possible to minimize a repetition of start and stop of a vehicle, due to congestion on a track, by providing a buffer distance or a buffer waiting time, when the control target vehicle starts due to moving out of range of a proximity distance to a preceding vehicle, after stopping according to reaching of the proximity distance to the preceding vehicle, during driving the OHT control target vehicle.

Abstract: A static electricity visualization system capable of visually confirming the level of the measured static electricity is provided. The static electricity visualization system comprises a first measuring unit for measuring a static electricity level detected at a first position of a measurement target and comprising a first mark, a photographing unit for generating a photographed image by photographing the measurement target, a processor for recognizing a first mark in the photographed image and calculating coordinates of the first mark on the photographed image, and an output unit for outputting a static electricity visualization image that visualizes the static electricity level measured by the first measuring unit in a first mode, wherein the static electricity visualization image comprises a color corresponding to a level of static electricity measured by the first measuring unit on the coordinates of the first mark of the photographed image.

Abstract: A substrate storing and aligning apparatus is proposed. The substrate storing and aligning apparatus is capable of efficiently using space in substrate bonding equipment. The substrate storing and aligning apparatus in the substrate bonding equipment for bonding substrates includes a front end buffer including a front end storing slot configured to temporarily store a substrate, and a front end opening configured such that a transfer robot is movable therethrough to transfer the substrate from the front end storing slot, and a front end aligner provided to be stacked on an upper portion of the front end buffer, and configured to rotate the substrate so as to align the substrate.