Abstract: An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution.

Abstract: The inventive concept provides a substrate treating method. The substrate treating apparatus includes supplying a first liquid to a rotating substrate to treat a substrate; and supplying a second liquid which is different from the first liquid to the rotating substrate to coat the substrate with the second liquid, and wherein a rotation direction of the substrate is different at the supplying the first liquid and at the supplying the second liquid.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating bath for liquid treating a plurality of substrates and having an accommodation space for accommodating a treating liquid; and a posture changing member for changing a posture of a substrate which is immersed in the treating liquid from a vertical posture to a horizontal posture.

Abstract: A method of circulating chemical liquid includes a chemical liquid circulation step of circulating chemical liquid through a chemical liquid supply line and a chemical liquid recovery line installed in a tank of a chemical liquid circulation portion; and a chemical liquid circulation preparation step of removing air bubbles in chemical liquid recovered to the chemical liquid recovery line by opening the chemical liquid recovery line before the chemical liquid supply line is opened, before the chemical liquid circulation step.

Abstract: The present disclosure provides a substrate processing apparatus capable of stabilizing the particle level when re-supplying a chemical solution. The substrate processing apparatus includes a circulation line connected to a chemical supply unit to circulate a chemical solution, a filter installed in the circulation line to filter particles in the chemical solution, a supply line connected to a first node of the circulation line and configured to supply the chemical solution to the chamber, and a drain line connected, in the circulation line, to a second node located between the filter and the first node, and configured to drain the chemical solution, the apparatus being configured to operate, during a first duration, from when a pump of the chemical supply unit is restarted after the pump had stopped, to drain the chemical solution that passes through the filter.

Abstract: Proposed is a power supply apparatus capable of suppressing heat generation, and semiconductor manufacturing equipment and a transport system including the same. The power supply apparatus, which supplies power to a transport device in semiconductor manufacturing equipment, includes a first base member made of a conductive material installed along a moving path of the transport device, a second base member provided on a surface of the first base member and made of a magnetic core material, a track member provided as an installation structure disposed on a side of the second base member, a power supply member installed in the track member and to which current is applied to supply power, and a power reception member disposed in a power reception core member provided in the transport device at a predetermined interval from the power supply member, and magnetically coupled to the power supply member to generate an induced current.

Abstract: A transfer apparatus includes a first guide rail, a second guide rail, a driving module including a main rail and a moving block that moves along the main rail, and a carriage module coupled to the moving block and supporting an article, wherein the carriage module includes first guide wheels configured to be in rolling contact with the first guide rail and second side guide wheels configured to be in rolling contact with the second guide rail.

Abstract: A method and apparatus for aligning a wafer using a laser scanner, and a semiconductor transfer device are provided. The method includes a laser irradiation operation of irradiating a laser toward the wafer using a laser scanner disposed on a rear side or a lower side of the wafer and obtaining an image, a dataset acquisition operation of obtaining location information of at least three wafer edges by using a distance corresponding to a laser irradiation direction to a wafer edge in the image, a calculation operation of calculating a center point of the wafer by using the obtained location information of the wafer edge, and a detection operation of detecting whether a calculated center point is within a preset tolerance range.

Abstract: The inventive concept provides a substrate treating control method. The substrate treating control method includes discharging a droplet to a substrate in which a relative position to the head unit changes from a nozzle of a head unit, and wherein a correction value is applied at a discharge timing of the nozzle until a preset discharge cycle among a discharge cycle of the droplet discharged by the nozzle.

Abstract: Provided is a substrate measurement method and substrate measurement control apparatus capable of greatly reducing measurement time by skipping a general identification mark recognition process, the substrate measurement method including (a) obtaining entire coordinates for an entire area of wafer by using a standard wafer, (b) aligning a measurement target wafer on a substrate stage by using at least shape features of the measurement target wafer, (c) moving a camera or the substrate stage having the measurement target wafer thereon by using the entire coordinates to position a target area of the measurement target wafer within a measurement area of the camera, and (d) measuring the target area of the measurement target wafer by using the camera.

Abstract: The substrate treating apparatus includes an analysis part configured to communicate with a measurement unit to be input with an information with respect to a boundary, to calculate a center coordinate value of a substrate and a center coordinate value of a support unit with an input information on the boundary, to set a calculated center coordinate value of the support unit as a center coordinate value of the measurement unit, to set a calculated center coordinate value of the substrate as a center coordinate value of a transfer robot, to record the center coordinate value of the transfer robot on a plane coordinate system of the measurement unit, and to convert a recorded center coordinate value of the transfer robot and a center coordinate value of the measurement unit to a plane coordinate system of the transfer robot to teach the transfer robot.

Abstract: A substrate cleaning apparatus may include a steam injector configured to clean a substrate, a steam supplier configured to supply a steam, and a gas supplier configured to supply a gas. The steam injector may include a drive unit configured to move horizontally, a plate on the drive unit, and a plurality of nozzles on the plate. The plate may include a temperature sensor, a first pressure sensor, and a second pressure sensor. Each of the plurality of nozzles may be connected to the steam supplier and the gas supplier. The plurality of nozzles may be arranged in one direction from a planar viewpoint.

Abstract: A substrate processing equipment and a method of driving the substrate processing equipment, which automatically cut off power supplied to a main circuit breaker and a branch circuit breaker when an operator inspects a process chamber or a power supply system. The substrate processing equipment for processing a substrate includes: a process processing module including loads utilized in a process for processing a substrate; a branch circuit breaker installed on a periphery to the process processing module and electrically connected to the loads; a main circuit breaker electrically connected to the branch circuit breaker and supplying power to the branch circuit breaker; and a power distribution board in which the branch circuit breaker is mounted, and including a power distribution board door, in which the main circuit breaker cuts off power when the power distribution board door is opened.

Abstract: The inventive concept provides a transfer robot system. Embodiments of the inventive concept provide a transfer robot system and a transfer robot system driving method in which a bottleneck phenomenon of mobile robots may be prevented, as a new obstacle which does not exist within a map for a mobile robot is recognized in advance during an autonomous driving of the mobile robot and the new obstacle is not passed through. The transfer robot system includes an OHT for transferring an article by autonomously driving along a rail and having a bottom side distance detection sensor installed for generating a distance information of below; and a mobile robot for transferring the article by autonomously driving on the ground and autonomously driving while avoiding an obstacle information generated through the distance information.

Abstract: A gripper gripping a plurality of types of probe cards includes a frame, a driving unit connected to the frame, and a plurality of gripper portions connected to the driving unit and including an inner gripper portion and an outer gripper portion. The gripper portions include a moving block moving in a radial direction as the driving unit is driven, and the inner gripper portion and the outer gripper portion connected to the moving block. The outer gripper portion is rotatably connected to the moving block, and is configured such that the outer gripper portion rotates downward with respect to the moving block as the moving block moves in a radial outward direction.

Abstract: The present invention provides an apparatus for treating a substrate. The apparatus for treating a substrate comprises: a first module; and a treating module configured to treat the substrate, and the first module includes: a load port on which a container having the substrate accommodated therein is placed; a transfer unit having a hand that transfers the substrate between the load port and the treating module; and an observation unit mounted in the transfer unit and configured to observe a state of the substrate accommodated in the container.

Abstract: Provided are a nozzle inspection unit configured to generate a large amount of defect data to improve detection accuracy of a defective nozzle, and a substrate treatment apparatus including the same. The nozzle inspection unit includes: a data collection module configured to collect a plurality of image data related to nozzles; a data classification module configured to classify the plurality of image data according to predefined classes; a data merging module configured to merge good image data related to a normal nozzle and defect image data related to a defective nozzle from among the plurality of image data; a data training module configured to train a plurality of merged image data obtained through the data merging module; and a defect data generation module configured to generate a plurality of final image data from the plurality of merged image data based on the training result.

Abstract: The present invention provides an apparatus for treating a substrate, the apparatus including: a processing tank having an accommodation space in which a processing liquid is accommodated; a support member for supporting at least one substrate in the receiving space in a vertical posture; and a posture changing robot for changing a posture of the substrate in a state of being immersed in the liquid state from the vertical posture to a horizontal posture, in which wherein the posture changing robot includes: a hand configured to grip the substrate; and an arm for moving the hand.

Abstract: A substrate processing apparatus includes a nozzle unit including a nozzle tip discharging liquid to a substrate; and a liquid supply line supplying the liquid to the nozzle unit, wherein the liquid supply line includes a liquid supply pipe connected to the nozzle tip; a supply valve installed in the liquid supply pipe; and a heater disposed between the nozzle tip and the supply valve in the liquid supply pipe.

Abstract: An apparatus for processing a substrate includes a mixing nozzle having a mixing space that is shaped as an inverted cone, the mixing nozzle including a first inlet, a second inlet and an outlet installed at the mixing space; a first chemical supply unit connected to the first inlet; a second chemical supply unit connected to the second inlet; and a supply tank connected to the outlet, wherein the first chemical supply unit is configured to supply a first chemical solution to the mixing space through the first inlet, the second chemical supply unit is configured to supply a second chemical solution to the mixing space through the second inlet, and the supply tank is supplied with, through the outlet, a solution mixture that is formed of the first chemical solution and the second chemical solution after being mixed in the mixing space.