Abstract: An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution.

Abstract: The inventive concept provides a substrate treating apparatus.

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a liquid to a substrate; and heating the substrate after the supplying the liquid, and wherein the supplying the liquid includes: supplying a first liquid to the substrate; and supplying a second liquid which is different from the first liquid to a substrate to which the first liquid is supplied, and wherein the second liquid is supplied as a test to the substrate and a contact angle between the second liquid which is supplied and the substrate is measured to determine a degree of hydrophilization of the substrate, and a supply mechanism of the second liquid supplied to the substrate is determined based on the degree of hydrophilization of the substrate which is determined, before the supplying the second liquid is performed.

Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for allowing a position of a substrate to be known with only an analysis of an image with respect to a light source irradiated to a surrounding of the substrate. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to seat a substrate; a first light irradiation unit configured to irradiate a first light source to the substrate; an image acquisition unit configured to acquire an image information with respect to the first light source irradiated to the substrate; and an image analysis unit configured to detect a position of the substrate by inputting the image information and analyzing the first light source irradiated to the substrate within the image information which is input.

Abstract: Provided is a liquid chemical supply module and a substrate processing apparatus including the same, the liquid chemical supply module including a main supplier for supplying a liquid chemical from a liquid chemical tank to at least one substrate processing apparatus, and at least one distribution supplier for connecting between the main supplier and any one substrate processing apparatus to distribute the liquid chemical supplied through the main supplier to the any one substrate processing apparatus, wherein the distribution supplier includes a distribution line branched from a main line of the main supplier, a first circulation line branched from the distribution line and connecting between the distribution line and the main line, and a second circulation line branched from the distribution line connecting between the distribution line and the main line.

Abstract: The inventive concept provides a substrate treating method for etching a specific region on a substrate. The substrate treating method includes supplying a treating liquid to the substrate; and irradiating a laser to the specific region to locally heat the specific region; and wherein at the irradiating the laser, the laser is irradiated a plurality of times within the specific region, and the laser is irradiated to a region which does not overlap on the substrate, but which overlaps within the specific region.

Abstract: Provided is an apparatus for cleaning a part of a substrate processing apparatus, the apparatus including a chemical solution storage tank for storing a chemical solution, a filter configured to filter the chemical solution supplied from the chemical solution storage tank, a heater configured to heat the filtered chemical solution, and a vibrator arranged adjacent to the filter and configured to provide vibration to the filter.

Abstract: Provided is an autonomous mobile robot (AMR) and semiconductor manufacturing equipment including the same, the AMR including an autonomous mobile module capable of autonomously moving along a certain autonomous motion path between a plurality of semiconductor manufacturing apparatuses disposed in semiconductor manufacturing equipment for manufacturing semiconductor devices, to supply materials to or perform maintenance on any one of the plurality of semiconductor manufacturing apparatuses in the semiconductor manufacturing equipment, and a loading module provided as a transferable structure including a manipulator for supplying materials to or performing maintenance on any one of the plurality of semiconductor manufacturing apparatuses, and docked to and transferred by the autonomous mobile module, wherein, in the autonomous mobile module, a male coupler rotatably protruding from a docking surface of the autonomous mobile module so as to be inserted into a female coupler of the loading module is flexibly supp

Abstract: Disclosed herein are an apparatus and method for measuring a railroad of a transfer vehicle to check the installation status of the railroad to ensure that the railroad of the transfer vehicle is installed in accordance with specifications. The apparatus may include a body formed in correspondence with a railroad of the transfer vehicle, a detector provided to the body and arranged in contact with the railroad, and a displacement measurer configured to measure a displacement of the detector in contact with the railroad.

Abstract: An apparatus for supplying chemical liquid may include a chemical liquid supply member for supplying a chemical liquid onto a substrate, a chemical liquid storing member for storing the chemical liquid, a chemical liquid receiving assembly for receiving the chemical liquid provided from the chemical liquid storing member and for providing the chemical liquid into the chemical liquid supply member, a first chemical liquid supply line for supplying the chemical liquid from the chemical liquid storing member to the chemical liquid receiving assembly, and a second chemical liquid supply line for supplying the chemical liquid from the chemical liquid receiving assembly to the chemical liquid supply member.

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced, and a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid.

Abstract: The present invention relates to a substrate processing apparatus capable of shortening a process time, and the substrate processing apparatus according to the present invention comprises an index chamber having a transfer robot loading/unloading a substrate; a process chamber having a heating means heating the substrate and processing the substrate; a loadlock chamber disposed between the index chamber and the process chamber; and a conveying chamber having a conveying robot conveying the substrate between the process chamber and the loadlock chamber, wherein a pre-heating means is provided in the conveying robot to pre-heat the substrate in a state before processing.

Abstract: The inventive concept provides a teaching method for teaching a transfer position of a transfer robot. The teaching method includes: searching for an object on which a target object to be transferred by the transfer robot is placed, based on a 3D position information acquired by a first sensor; and acquiring coordinates of a second direction and coordinates of a third direction of the object based on a data acquired from a second sensor which is a different type from the first sensor.

Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.

Abstract: The present invention relates to a substrate transfer system and method enabling a direction of a substrate or the order of substrates to be maintained even when the substrate is swing-moved and transferred by a robot transportation device, in particularly, the substrate transfer system may include: a robot transportation device that transfers at least one substrate using at least one swing-movable transport arm; and a compensatory rotation device that is mounted on the transport arm of the robot transportation device and selectively supports the substrate to thus enable compensatory rotation thereof so that, even when the transport arm has a swing motion while the substrate is transferred by the robot transportation device, a direction of the substrate or the order of the substrates can be maintained.

Abstract: An apparatus for processing a substrate may include a drying chamber configured to dry at least two divided substrates from an original substrate, the drying chamber may have a drying space where the at least two divided substrates disposed therein. The apparatus for processing a substrate may include a dryness compensation part configured to compensate a difference of drynesses of chemical liquids coated on the at least two divided substrates such that the chemical liquids coated on the at least two divided substrates has a substantially same dryness.

Abstract: Embodiments of the inventive concept provide a wireless power apparatus for a substrate treating apparatus and a manufacturing method for the wireless power apparatus for the substrate treating apparatus for preventing a heat generation by preventing a generation of an eddy current in a coupling element, if the coupling element is used around an outer housing at which an induced magnetic field is formed. The inventive concept provides a wireless power apparatus for a substrate treating apparatus.

Abstract: Proposed are a process fluid treatment apparatus capable of decomposing ozone in a process fluid more effectively, and a wafer cleaning apparatus and semiconductor manufacturing equipment including the same. The process fluid treatment apparatus treats the process fluid used for cleaning a wafer in the semiconductor manufacturing equipment, and includes a housing having an inner space configured to contain the process fluid, a spray nozzle configured to spray the process fluid containing ozone into the inner space in the form of mist, and a nozzle heater configured to heat the process fluid passing through the spray nozzle.

Abstract: The inventive concept provides a method for treating a substrate. The method includes removing a film on the substrate by applying a pulsed laser to the rotating substrate, in which thickness of the film to be removed is measured and pulse energy of the pulsed laser is selected based on the measured thickness of the film.

Abstract: Provided is a chemical storage apparatus including a reservoir including a chemical tank configured to store a chemical, a first fixing member disposed on an upper surface of the chemical tank, and a second fixing member disposed on a lower surface of the chemical tank, a sensor configured to measure a specific parameter of the chemical stored in the reservoir, a receptacle having a space in which the sensor is accommodated, and coupling members for attaching or detaching the receptacle to or from the first fixing member and the second fixing member, respectively.