Abstract: Provided is a transport control device for integrating and controlling different types of transport means and a logistics transport system including the same. The logistics transport system comprises a plurality of first transport devices disposed in a semiconductor manufacturing plant and for transporting a transported object; a plurality of second transport devices different in type from the plurality of first transport devices; and a transport control device for controlling the plurality of first transport devices and the plurality of second transport devices, wherein the transport control device integrates and operates different types of transport devices to transport the transported object.

Abstract: An apparatus for mounting a component includes an articulated robot mounting a component on a replacement target where the component is provided at a mounting position, a first sensor unit provided in the articulated robot and sensing the mounting position or whether or not the component is provided, a second sensor unit provided in the articulated robot and sensing spaced distances between the articulated robot and the mounting position at a plurality of points, and a control unit controlling the articulated robot to mount the component on the replacement target and controlling a position of the articulated robot so that a difference between spaced distance values between the articulated robot and the plurality of points sensed by the second sensor unit converges to zero, when the component is not sensed or a surface of the mounting position is sensed by the first sensor unit.

Abstract: The present invention relates to an apparatus and a method for storing an article, capable of storing at least two types of articles transferred in a semiconductor distribution line, in which the apparatus includes: an article storage rack including a space for storing a first article or a second article; and a variable alignment device installed on the article storage rack, in which at least one first alignment protrusion protrudes outward to align the first article when the first article is seated, and the first alignment protrusion is accommodated inward so that the first alignment protrusion does not interfere with the second article when the second article is seated.

Abstract: A lift pin assembly is provided. The lift pin assembly includes a level bolt mounted on a first frame lifted by a lifting device, a lift pin having a weight provided at a lower end of the lift pin, and supported by the level bolt, and a pressing bracket to forcibly move down the lift pin, when the lift pin is locked into a pin hole. The pressing bracket is adjusted in height to be set while maintaining a specific gap to a top surface of the weight.

Abstract: An apparatus for treating a substrate, the apparatus comprising: a treating container having an inner space; a support unit supporting and rotating the substrate in the inner space; and an exhaust unit exhausting an air flow in the inner space, wherein the treating container includes an outer cup providing the inner space; and an inner cup disposed at the inner space and spaced apart from the outer cup, and wherein the outer cup has a protrusion at a side wall thereof.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a support plate configured to support a substrate, a base plate under the support plate, a thermal insulation layer between the support plate and the base plate, a bonder bonding the base plate and the thermal insulation layer to each other, and a sealing member disposed around a side surface of the bonder to prevent damage to the bonder.

Abstract: Disclosed is a method of forming a semiconductor device, the method including: forming at least one metal catalyst layer on a rear surface of a semiconductor substrate, on which at least one buried power rail for power transfer is formed, to be at least partially aligned with the buried power rail; and forming at least one rear surface via hole by supplying an etchant to the semiconductor substrate so that the semiconductor substrate between the metal catalyst layer and the buried power rail is anisotropically etched while the metal catalyst layer descends to an inside of the semiconductor substrate using metal-assisted chemical etching (MACE).

Abstract: An apparatus for performing heat treatment with respect to a substrate is provided. The apparatus for treating the substrate includes a substrate support member to seat a substrate on the substrate support member, a treating bowl to surround the substrate support member, a base plate provided to face a bottom surface of the substrate seated on the substrate support member, and an edge nozzle member mounted on the base plate to spray a treating liquid to a bottom edge part of the substrate seated on the substrate support member. The edge nozzle member includes a main body mounted on the base plate, a nozzle arm to mount an edge nozzle on the nozzle arm to slidably move on the main body, and a fixing member to maintain the nozzle arm at a setting position on the main body.

Abstract: Provided is an apparatus for processing a substrate including a spin head on which a substrate is placed, a container provided to surround the spin head, an upper nozzle member supplying a processing solution downwards, a bottom cleaning member located to be a certain distance from the bottom of the spin head, wherein the bottom cleaning member sprays a cleaning solution to the bottom of the spin head.

Abstract: Disclosed is a substrate treating apparatus, which includes a chamber having a space for treating a substrate in an interior thereof, a substrate support assembly including a support plate situated in the chamber and which supports the substrate, a gas supply unit which supplies a gas into the interior of the chamber, a plasma generating unit which excites the gas in in the interior of the chamber into a plasma state, and a substrate temperature control unit which controls a temperature of the substrate, and the substrate temperature control unit includes a plurality of heaters installed in different areas of the support plate, a power supply part which supplies electric power to the plurality of heaters, a ferrite core which interrupts a low-frequency signal introduced to the power supply part, and a plurality of air cores which interrupts a high-frequency signal introduced into the power supply part.

Abstract: A substrate processing device is provided. The substrate processing device includes: a substrate supporter configured to support a substrate; a heating ring horizontally surrounding the substrate supporter; and an edge ring horizontally surrounding the heating ring and configured to cover a top surface of the heating ring.

Abstract: There is provided a substrate processing apparatus including a chamber having a processing space therein, a dielectric window arranged at an upper portion of the chamber and configured to cover an upper surface of the chamber, and an RF source disposed on the dielectric window and configured to supply RF power to generate plasma from gas in the processing space, wherein the RF source includes an RF electrode disposed on the dielectric window and an RF plate disposed on the RF electrode, the dielectric window includes a groove extending vertically downward from an uppermost surface of the dielectric window, and the RF plate has a ring shape.

Abstract: A maintenance assembly for an inkjet head may include a housing having an upper face facing a nozzle face on which nozzles for discharging a chemical liquid on a substrate are arranged, and an atmosphere generating part for providing an atmosphere including humidity around the nozzles and the nozzle face such that a humidity of the nozzles and a humidity of the nozzle face are adjusted to a set humidity if the humidity of the nozzles and the humidity of the nozzle face are different from the set humidity.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes discharging a treating liquid including a polymer and a solvent onto a substrate; and solidifying a liquid film of the treating liquid by volatilizing the solvent from the treating liquid on the substrate, and wherein the solidifying a liquid film comprises a first period of stopping the rotation of the substrate or rotating the substrate at a first speed for a first time period.

Abstract: A maintenance assembly for an inkjet head may include a housing having an upper face facing a nozzle face on which nozzles for discharging a chemical liquid on a substrate are arranged, and a fluid supplying part for providing a humidity control fluid onto the nozzles and the nozzle face such that a humidity of the nozzles and a humidity of the nozzle face are adjusted to a set humidity if the humidity of the nozzles and the humidity of the nozzle face are different from the set humidity.

Abstract: Provided is a plasma processing apparatus. The plasma processing apparatus includes a chamber configured to isolate a plasma region where plasma is formed from an outside, a core located on the chamber and configured to form a magnetic field in the chamber, and a plurality of coils located adjacent to the core, wherein the core includes a first core having a donut shape, and the plurality of coils include first and second upper outer coils located on a top surface of the first core.

Abstract: An apparatus for transporting a substrate includes an actuator, a robot arm, operation of which is controlled by the actuator, a robot hand including at least one intake vent having a predetermined separation distance from the supported substrate, a fixing unit that fixes the substrate supported on the robot hand, and an intake unit connected with the intake vent.

Abstract: A substrate treating apparatus includes a process module including a plurality of process units that perform a plurality of steps included in a substrate treating process and that perform the substrate treating process on substrates sequentially placed in the process units based on process recipes for the substrates, a scheduler that controls operations of the process module and the process units included in the process module, a storage that stores transfer paths information of the substrates, and a selection module that selects a process unit to proceed, by a result of feeding back the transfer paths information stored in the storage to the scheduler. The substrate treating apparatus may further include a measuring instrument that measures defect values of the transfer paths information along which the substrates are transferred. The storage may store the defect values measured by the measuring instrument according to the transfer paths information of the substrates.

Abstract: A substrate processing apparatus includes a spraying unit installed in an inner space of a chamber member in which a substrate is processed, spraying a cleaning liquid into the inner space of the chamber member so as to clean devices for discharging a chemical liquid to the substrate and then collecting the chemical liquid, and spraying a drying gas for drying the remaining cleaning liquid into the inner space of the chamber member, a management unit removing a residue remaining on the spraying unit after the spraying unit sprays the cleaning liquid, and a controller controlling the spraying unit and the management unit.

Abstract: A tube includes an outer layer including a first material having flexibility, an inner layer including a second material having flexibility and chemical resistance, and an intermediate layer arranged between the outer layer and the inner layer and including an electrically conductive material.