Abstract: Disclosed are a microwave heat treatment apparatus and an impedance matching method between a microwave power supply and a chamber in the microwave heat treatment apparatus. The impedance matching method includes the steps of initially adjusting the impedance of a tuner circuit between the microwave power supply and the chamber based on pre-matching data for a heat treatment process, applying microwave power to the chamber from the microwave power supply through the tuner circuit having the initially adjusted impedance, measuring process data related to the impedance of the chamber to which the microwave power has been applied, determining an impedance tuning value of the tuner circuit by comparing the process data and the pre-matching data, and adjusting the impedance of the tuner circuit based on the impedance tuning value.

Abstract: Provided is an apparatus for supplying gas in a facility for processing a substrate, the apparatus for supplying gas in a facility for processing a substrate including: a gas supply line connecting a gas storage unit and a process chamber for processing a substrate; and a flow control unit installed in the gas supply line, and controlling a gas flow rate of drying gas supplied through the gas supply line with a metering valve and a mass flow controller (MFC) disposed in parallel.

Abstract: Provided is a substrate processing apparatus and substrate processing method capable of increasing utilization of equipment and minimizing a footprint of the equipment, the substrate processing apparatus including a load port module loaded with a first carrier in which first substrates are stored, a transfer robot for transferring the first substrates from the first carrier, a first adaptor region for temporarily storing the first substrates transferred by the transfer robot, a second adaptor region for temporarily storing second substrates transferred by the transfer robot from a second carrier loaded onto the load port module, after the first carrier is unloaded from the load port module, and a controller for applying a first substrate transfer control signal to the transfer robot to store the first substrates, which were temporarily stored in the first adaptor region and on which a process is completed, in the empty second carrier.

Abstract: Provided is a transport system that controls a plurality of transport vehicles in a cooperative transport mode to transport a heavy load.

Abstract: Disclosed is a method of treating a substrate by using a substrate treating apparatus generating plasma in a treatment space by applying microwaves, the method including: a plasma treatment operation of treating a substrate with the plasma; a replacement operation in which the plasma treatment operation is performed a preset number of times and a component included in the substrate treating apparatus is replaced; and a backup operation of backing up the substrate treating apparatus after the replacement operation, in which the backup operation includes a bake purge operation for removing byproducts present in the component.

Abstract: A transport vehicle is provided. The transport vehicle includes a front driving device including front wheels, a front drive shaft transmitting a driving force to the front wheels, and a front vibration reduction device, and a rear driving device including rear wheels, a rear drive shaft transmitting a driving force to the rear wheels, and a rear vibration reduction device, wherein, when the transport vehicle moves in a straight section, the front vibration reduction device and the rear vibration reduction device are coupled to each other, and when the transport vehicle moves in a corner section, the front vibration reduction device and the rear vibration reduction device are separated from each other.

Abstract: Proposed is a substrate processing apparatus including a showerhead assembly. A showerhead assembly according to an embodiment includes an upper plate, a gas distribution plate disposed under the upper plate and having a plurality of through-holes, a shower plate disposed under the gas distribution plate and having a plurality of gas spray holes connected to the through-holes, and a fastening unit fastening the gas distribution plate and the shower plate to each other. The fastening unit includes a cam received in the shower plate, and a pinion received in the gas distribution plate. The pinion is coupled to the cam by a rack inserted through a passage formed in the gas distribution plate.

Abstract: A substrate treating apparatus includes a process chamber having a processing space in which a substrate is plasma-treated and a laser irradiation unit irradiating the substrate with a plurality of lasers having different pulse widths to heat the substrate to reach a temperature at which the substrate is plasma-treated.

Abstract: A semiconductor device includes bit lines each extending in a first direction on a substrate and spaced apart from each other in a second direction, semiconductor patterns disposed on each of the bit lines and including a first semiconductor pattern disposed on a first bit line, and a second semiconductor pattern arranged to be offset in the second direction from the first semiconductor pattern on the first bit line, word lines each extending in the second direction and surrounding a sidewall of each of the semiconductor patterns, the word lines including a first word line extending in the second direction and surrounding the first semiconductor pattern, and a second word line spaced apart in the first direction from the first word line and extending in the second direction while surrounding the second semiconductor pattern, and storage nodes respectively disposed on the semiconductor patterns.

Abstract: An article transport device is provided. The article transport device comprises a housing including an internal space, a driving unit disposed on an upper portion of the housing and traveling along a driving rail installed on a ceiling, a hoist unit disposed in the internal space and gripping a first transport article, and an anti-drop unit installed in the housing and preventing the transport article from falling, wherein the anti-drop unit includes a stroke configured to move toward the internal space, and a contact portion installed at one end of the stroke and contacting the first transport article, wherein the contact portion has a step shape that descends in a direction toward the internal space.

Abstract: In a teaching method, a vehicle, which travels along a traveling rail, is allowed to arrive at a reference loading/unloading position adjacent to a reference seating surface having a reference QR code displayed thereon. A first image corresponding to the reference seating surface is acquired at the reference loading/unloading position. The vehicle, which further travels along the traveling rail, is allowed to arrive at a target loading/unloading position adjacent to the target seating surface having a target QR code displayed thereon. A second image corresponding to the target seating surface is acquired at the target loading/unloading position. The first image and the second image are compared with each other to acquire n X-axial directional teaching relative value and a Y-axis directional teaching relative value.

Abstract: Disclosed is a substrate treating apparatus including: a treating chamber for treating a substrate; a transfer unit for loading and unloading the substrate into and from a treatment space in which the substrate is treated in the treating chamber; and a heating unit provided to be loaded into and unloaded from the treatment space, and for cleaning the treatment space by heating, in which the treating chamber includes: a chamber body providing the treatment space; and a support unit for supporting the substrate within the treatment space; and a fluid supply unit for supplying a fluid, which treats the substrate, into the treatment space, and the heating unit includes: a base; and a heater installed on the base.

Abstract: The present invention provides a substrate treating apparatus, including: a housing including a first body and a second body which are combined with each other to provide a treatment space in which a substrate is treated; an actuator which moves the second body in a vertical direction with respect to the first body to seal or open the treatment space; and a pipe which is coupled with the second body and in which a fluid flows, in which the pipe is a stretchable pipe that is stretchable and contractible according to the vertical movement of the second body.

Abstract: The present invention provides a substrate processing device. An aspect of the present disclosure is to a substrate processing device and a control method for substrate processing device which can improve a resolution of a printer by determining a discharge time of an ink discharge controller with a higher resolution than a pulse wave generated by an encoder.

Abstract: Provided is a method of manufacturing a semiconductor device, the method including steps of providing a semiconductor substrate having one or more trenches, forming a gate insulating layer on the semiconductor substrate inside the trenches, and forming a buried gate electrode layer on the gate insulating layer to at least partially fill the trenches, wherein the step of forming the buried gate electrode layer includes a step of repeating a unit cycle a plurality of times, the unit cycle including an atomic layer deposition (ALD) process for forming a conductive layer on the gate insulating layer to serve as the buried gate electrode layer, and an atomic layer etching (ALE) process for preferentially etching portions of the conductive layer formed near the trenches and portions of the conductive layer formed on upper ends of the trenches over other portions of the conductive layer inside the trenches.

Abstract: A dry-type cleaning apparatus for wafers for dry cleaning of organic residues on a wafer surface includes a laser emitting laser light, an optical collimator receiving the laser light emitted from the laser and generating a first collimated laser light, an energy spreader uniformizing an energy distribution of the first collimated light received from the optical collimator, and a beam expander adjusting a diameter of the first collimated laser light passing through the energy spreader according to a diameter of a wafer to generate second laser light.

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.

Abstract: The substrate processing device includes a chamber in which a processing space for processing a substrate is formed, a substrate support unit supporting the substrate in the processing space, a gas supply portion supplying process gas to the processing space, a gas supply unit supplying gas to the gas supply portion, and a controller connected to the gas supply unit, wherein the gas supply unit includes a flow control valve controlling a flow rate of the process gas supplied through a gas supply line, and the controller controls, during a first time, the flow control valve to alternately provide supply of a flow rate greater than an average flow rate for the first time and supply of a flow rate less than the average flow rate.

Abstract: Provided is a substrate processing module including a plurality of substrate processing apparatuses each including a process chamber having a processing space therein, a support unit for supporting a substrate in the processing space, a gas supply unit for supplying a process gas into the processing space, a plasma source for forming plasma from the process gas supplied into the processing space, and a laser unit for heating the substrate by irradiating a laser beam onto the substrate, wherein the substrate processing module further includes a laser beam generator for generating a laser beam, and a laser beam distribution unit for receiving the laser beam from the laser beam generator and distributing the laser beam to the laser units of the plurality of substrate processing apparatuses at time intervals.

Abstract: A focus ring capable of evaluating a plurality of focus ring shapes is provided. A focus ring unit, as a focus ring used in a substrate processing device includes a plurality of parts with different conditions of an exposed surface facing a plasma space in a circumferential direction.