Abstract: An inspecting apparatus capable of performing an inspection of equipment without destroying the equipment and semiconductor manufacturing equipment including the inspecting apparatus are provided. The inspecting apparatus includes: a measurement module measuring a first impedance at a first port, and a second impedance at a second port; a comparison module comparing the first and second impedances; and a determination module determining whether the equipment part is operating properly based on a result of the comparison of the first and second impedances, wherein the first impedance includes a first resistance and a first reactance, the second impedance includes a second resistance and a second reactance, and the determination module determines whether the equipment part is operating properly based on at least one of a result of the comparison of the first and second resistances and a result of the comparison of the first and second reactances.

Abstract: An impedance matching circuit, which is provided for quick impedance matching, a power supply apparatus, and a plasma processing equipment including the same are provided. The impedance matching circuit includes a parallel capacitor array connected to a radio frequency (RF) power supply to generate a RF signal, and a series capacitor array connected to the RF power supply in series, wherein the parallel capacitor array or the series capacitor array includes a mechanical vacuum variable capacitor and an electrical switch capacitor module connected to the mechanical vacuum variable capacitor in parallel.

Abstract: Provided are a substrate treatment apparatus and method for treating a substrate while preventing the surface of the substrate from drying out. The substrate treatment method includes: moving a first nozzle to above a first point on a substrate; ejecting a first substrate treatment liquid onto the substrate from the first nozzle; moving a second nozzle to above the first point; and ejecting a second substrate treatment liquid onto the substrate from the second nozzle, wherein the second nozzle is positioned above a second point on the substrate before moving to above the first point.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an entrance for taking in and taking out a substrate at a side wall; a support unit provided inside of the chamber and supporting the substrate; an imaging unit for imaging a substrate being taken in by a transfer robot through the entrance; and a controller is configured to control a position of the transfer robot based on an image data from the imaging unit.

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a body including an irradiation end, from which laser light is irradiated, a shaft coupled to the body, and a driver that supplies power to the shaft, the heating unit is swung about an axis of the shaft, and the controller moves the irradiation end of the heating unit to a target location on a substrate by adjusting a rotation angle of the heating unit and a rotation angle of the support unit.

Abstract: The present disclosure provides a driving device including a driving member including a power source, a slider configured to linearly move according to power supply form the power source, a guide member coupled to the slider and configured to provide a movement path to the slider, and a bracket coupled to the slider, wherein the bracket is divided into a first bracket and a second bracket separated from each other by a first gap, and includes a first cooling member configured to cool the first bracket and a second cooling member configured to cool the second bracket, and the driving member includes a third cooling member configured to cool the power source.

Abstract: The method includes placing the substrate on the chuck, identifying at least one condition related to the substrate, selecting one mode among a first mode, a second mode, and a third mode, generating a plasma in the plasma space and treating the substrate mainly by species generated in the plasma space, generating plasmas in both the plasma space and the treating space and treating the substrate by species generated in the plasma space and the treating space, generating a plasma in the treating space and treating the substrate mainly by species generated in the treating space, and changing the mode between the first mode, the second mode, and the third mode according to the condition such that treatment selectivity between different materials on the substrate is controlled.

Abstract: Provided are a substrate processing apparatus and method capable of improving line edge roughness (LER). The substrate processing apparatus comprises a plasma generating space disposed between an electrode and an ion blocker, a processing space disposed under the ion blocker and for processing a substrate, a first gas supply module for providing a first gas for generating plasma to the plasma generating space, and a second gas supply module for providing an unexcited second gas to the processing space, wherein the first gas is a hydrogen-containing gas, the second gas includes a nitrogen-containing gas, and the substrate includes a photoresist pattern including carbon.

Abstract: Disclosed is a method of treating a substrate, the method including: adjusting a temperature of a treatment liquid by heating the treatment liquid with a heater unit installed in the circulation line while circulating the treatment liquid in a housing of a tank through a circulation line coupled to the housing; treating a substrate by supplying a temperature-controlled treatment liquid to the substrate in a normal mode; and discharging a treatment liquid in the circulation line to the outside of the circulation line through a drain line connected to the circulation line in an emergency mode.

Abstract: A process control method of a substrate processing apparatus includes monitoring a process status of each process chamber of a plurality of process chambers, determining a shift-to-idle process chamber to be shifted from a process state to an idle state among the plurality of process chambers, storing a first to-be-processed substrate in a storage, associated with the shift-to-idle process chamber, among a plurality of storages provided in a transfer chamber, and transferring the first to-be-processed substrate stored in the storage to the shift-to-idle process chamber in accordance with a shift to the idle state of the shift-to-idle process chamber.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a body; a fluid supply unit for supplying a treating fluid to a treating space within the body; and a fluid exhaust line for exhausting the treating fluid from the treating space, and wherein the body includes: a first body; a second body relatively moving with respect to the first body; and an anti-friction member for preventing a friction between the first body and the second body, and wherein the anti-friction member is configured continuously cover at least two surfaces among surfaces of the first body and the second body.

Abstract: The present invention relates to an apparatus and a method for storing an article, capable of storing at least two types of articles transferred in a semiconductor distribution line, in which the apparatus includes: an article storage rack including a space for storing a first article or a second article; and a variable alignment device installed on the article storage rack, in which at least one first alignment protrusion protrudes outward to align the first article when the first article is seated, and the first alignment protrusion is accommodated inward so that the first alignment protrusion does not interfere with the second article when the second article is seated.

Abstract: The inventive concept provides a substrate processing apparatus. The substrate processing apparatus may include a chamber having an interior space, a support unit that supports a substrate in the interior space, a ring unit disposed on an edge region of the support unit when viewed from above, an impedance control unit electrically connected to the ring unit to control a flow or density of plasma in an edge region of the substrate and a filter unit disposed between the ring unit and the impedance control unit.

Abstract: Proposed is a substrate processing apparatus capable of replacing consumables and, more particularly, to a technique for supporting replacement of consumables such as a shower head and a focus ring while maintaining a chamber processing environment of the substrate processing apparatus.

Abstract: A substrate processing method using a supercritical fluid is provided that can deposit a conformal film in a trench with a high aspect ratio and allows complete filling without voids.

Abstract: Provided is a heating unit including: a heating plate for heating a substrate; a heater installed in the heating plate; and a control unit for controlling the heater, in which wherein the heater includes: a first heater; and a second heater installed at a position different from a position of the first heater, and the control unit includes: a power source for transferring power to at least one of the first heater and the second heater; and a switching module for connecting the first heater and the second heater in series or connecting the first heater and the second heater in parallel.

Abstract: Proposed are a sealing member that prevents fluid leakage even in a cryogenic environment, a fluid supplying device including the sealing member, and a substrate processing apparatus including the fluid supplying device. A sealing member according to an embodiment includes a sealing jacket having a ring shape, an upper O-ring mounted on an upper surface of the sealing jacket, a lower O-ring mounted on a lower surface of the sealing jacket, and a pressure ring inserted into a receiving portion of the sealing jacket and pressing the upper surface and the lower surface.

Abstract: Provided are a head life evaluation apparatus and method capable of evaluating lifespans of nozzles by using a plurality of chambers having different environments, the head life evaluation apparatus including a head block including at least one first nozzle for ejecting a treatment liquid in an inkjet manner, and a chamber block detachably coupled to the head block and including at least one first chamber corresponding to the first nozzle to evaluate a lifespan of the first nozzle in a first environment.

Abstract: A deep learning-based analysis system includes a detection device configured to create multivariate time-series data through a plurality of sensors of an equipment process, and an analysis device including at least one processor, wherein, when receiving the multivariate time-series data created through the plurality of sensors from the detection device, the processor of the analysis device is configured to obtain a correlation degree between a plurality of sensors based on a first learning model using the received multivariate time-series data as input, and calculate an error score for each sensor based on a second learning model using time-series data for each sensor extracted from the received multivariate time-series data as input.

Abstract: A transfer device may include a transfer part including transfer rails installed on a ceiling of a manufacturing line for an integrated circuit device and a transfer vehicle running along the transfer rails, and a safety fence disposed adjacent to the transfer part. The safety fence may include a plurality of first horizontal supporting portions disposed in parallel to the transfer rails, a plurality of second horizontal supporting portions connecting the plurality of first horizontal supporting portions to the transfer rails, a plurality of vertical supporting portions extended from the plurality of horizontal supporting portions, respectively, and a plate portion connected to the plurality of vertical supporting portions. The safety fence may be partially foldable and partially unfoldable.