Abstract: Provided are a substrate processing apparatus and a substrate processing method that are capable of maintaining an etch rate of a substrate within a predetermined range by preventing the amount of dissolved oxygen from being concentrated in a specific region of the substrate when a chemical is supplied to a center of the substrate.

Abstract: Proposed is a temperature relation equation derivation method which includes irradiating a same point of a target substance with heating light for heating the target substance and measurement light for detecting a change of a reflectivity of the target substance caused by the heating light, detecting light of detecting intensity of each of incident light and reflected light of the measurement light, and calculating of deriving a temperature relation equation based on the reflectivity of the target substance by using a value detected in the detecting of light.

Abstract: A cleaning unit includes a gas spray part arranged above a substrate to be cleaned, and sprays a gas toward the substrate in order to separate a contaminant on the substrate from the substrate, and a suction part provided on a side of the gas spray part, and including an inlet suctioning and removing the contaminant that is separated from the substrate.

Abstract: Disclosed are a substrate treating apparatus and a fluid supply unit that reduce the outer diameter while preventing condensation from occurring even without wrapping a pipe supplying a refrigerant with a heat insulating material. The substrate treating apparatus includes: a process chamber having a treatment space for treating a substrate; an inner pipe connected to the process chamber and for supplying a heat exchange fluid to an interior of the process chamber; a cooler connected to the inner pipe, and for cooling the heat exchange fluid and supplying the cooled heat exchange fluid to the inner pipe; an outer pipe disposed on an outer side of the inner pipe while surrounding the inner pipe to form a suction space between the inner pipe and the outer pipe; an intake part connected to the suction space, and for sucking the suction space; and a spacing maintaining part disposed in the suction space, and for maintaining a spacing distance between the inner pipe and the outer pipe.

Abstract: Provided is a substrate processing apparatus and a substrate processing method that are capable of increasing exhaust volume without increasing exhaust facilities. An apparatus for processing a substrate includes: a processing chamber having a processing space for processing a substrate; a support unit for supporting the substrate in the processing space; a liquid supply unit for supplying a liquid to a substrate supported by the support unit; and an exhaust unit for exhausting the processing space, in which the exhaust unit includes: an exhaust pipe connected to the processing space; and an exhaust amplifier installed in the exhaust pipe and for supplying acceleration gas to a passage of the exhaust pipe to amplify an exhaust flow rate of exhaust gas flowing in the exhaust pipe.

Abstract: A substrate treating method including removing particles formed on a substrate by continuously performing a process of supplying a treatment liquid including a polymer and a solvent onto the substrate, forming a solidified liquid film by volatilizing the solvent in the treatment liquid, removing the solidified liquid film from the substrate by supplying a stripping liquid onto the substrate, and supplying a rinse liquid onto the substrate may be provided.

Abstract: Disclosed is a substrate processing apparatus in which weight of a buffer module may be reduced compared to the apparatus in the related art.

Abstract: A method for treating a substrate, including a solvent processing step of supplying an organic solvent onto the substrate to treat the substrate, a drying step of drying the substrate to remove the organic solvent on the substrate, and a bake step of heating the substrate to thermally decompose an impurity adhering to the substrate, where the drying step and the bake step are performed in different chambers.

Abstract: A printing apparatus and an ink refill method thereof are provided. The printing apparatus may comprise a printing unit performing printing, and an ink filling unit filling ink in the printing unit in an upward manner, wherein the printing unit includes a printing ink receptor accommodating ink, a spray head spraying the ink, and a pressure controller controlling a pressure of a fluid for operation of the ink, and the ink filling unit includes a supply ink receptor filled with ink for supply to the printing unit, and an ink supply unit mounted on the spray head to supply the ink supplied from the supply ink receptor to the spray head.

Abstract: Disclosed is a substrate processing apparatus and a substrate processing method that may increase the amount of substrates produced by preventing a main transfer robot that transfers a substrate between a liquid treatment chamber and a heat treatment chamber from transferring an edge-exposed substrate.

Abstract: Disclosed are an apparatus and a method for treating a substrate, and more particularly, an apparatus and a method for heat treating a substrate. The apparatus includes: a heating unit provided in the inner space, and providing a treatment space in which a heating process of the substrate is performed; a transfer plate positioned within the inner space, and movable between an inner position for loading the substrate into the treatment space or for unloading the substrate from the treatment space and an outer position provided outside the heating unit; and a gas injection unit positioned within the inner space, and for injecting atmosphere gas toward the substrate at the outer position.

Abstract: Disclosed is a container. The container includes a housing having an interior space, and a support part that supports an expendable component in the interior space, and the support part includes an alignment pin that aligns the expendable component.

Abstract: A substrate processing method and a substrate processing apparatus for removing material on a substrate are disclosed. In order to remove the material, a processing liquid including a chemical liquid and water is supplied on the substrate so that a liquid layer maintained by surface tension is formed. The material is removed from the substrate by a reaction between the material and the processing liquid. A size distribution of by-product particles formed by the reaction between the material and the processing liquid is measured by a dynamic light scattering method. A supply of the processing liquid is controlled based on the size distribution of the by-product particles.

Abstract: A substrate treating apparatus and a substrate treating system including the same are disclosed, in which the number of heat treatment chambers such as anneal chambers may be varied. The substrate treating apparatus includes a first chamber heat-treating a substrate; and a second chamber treating the substrate in another way different from heat-treatment, wherein the number of the first chambers is varied depending on the number of the second chambers that need heat treatment for the substrate.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes substrate treating apparatus comprising: a treating container having an inner space; a support unit configured to support and rotate a substrate within the inner space; an exhaust duct configured to exhaust the inner space; and at least one guide member combined with the treating container and configured to guide an airflow within the inner space, and wherein the at least one guide member is arranged such that the airflow within the inner space obliquely flows with respect to a rotation direction of the substrate supported by the support unit when seen from above.

Abstract: Provided are a control unit that predicts the life of an inkjet head unit and maximizes its life to be used, and a substrate treating apparatus including the same. The control unit performs maintenance of an inkjet head unit for discharging a substrate treatment liquid onto a substrate and comprises a count module for counting the number of discharges for each nozzle of the inkjet head unit, a comparison module for comparing the number of discharges with a reference value to determine whether the number of discharges is equal to or greater than the reference value, and an evaluation module for evaluating whether a life of the inkjet head unit has reached a usable life based on whether the number of discharges of each nozzle is equal to or greater than the reference value.

Abstract: A driving apparatus of semiconductor manufacturing equipment is disclosed. The driving apparatus includes a first driver for applying a signal driving a first motor and a second driver for applying a signal driving a second motor. The first driver and the second driver drive the first motor and the second motor in different schemes. The driving apparatus further includes a controller that performs integrated control of the first driver and the second driver. Each of the first driver and the second driver is connected with the controller through an I/O cable. The controller identifies the first driver or the second driver using information input through the I/O cable. The controller changes a signaling scheme depending on a driving mode of the motor corresponding to the identified driver.

Abstract: A substrate processing apparatus includes: a nozzle unit configured to discharge a processing liquid to a substrate; a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid; a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including at least one of a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and a control unit connected to the charge amount control unit.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber that provides a treatment space, in which a substrate is treated, in an interior thereof, a fluid supply unit that supplies a fluid into the process chamber, and an exhaust units including an exhaust line, through which the fluid in the process chamber is exhausted, the fluid supply unit includes a supply tank, in which the fluid is stored, a supply line connecting the supply tank and the process chamber, a branch line branched from the supply line at a first point of the supply line, and a controller that controls the fluid supply unit, and the controller controls the fluid supply unit such that the fluid is drained from the supply line through the branch line shortly before the fluid is supplied into the process chamber.

Abstract: A method for processing a substrate includes providing the substrate, a film being formed on the substrate, performing pretreatment to surface-treat the film formed on the substrate using a treatment gas in a plasma state, and performing, after the pretreatment, liquid treatment to remove the film from the substrate by supplying a treatment liquid onto the substrate.