Abstract: Provided is a tool changing apparatus and method capable of easily and safely changing various tools usable for a table device or a pickup device of an equipment depending on materials such as semiconductor chips or semiconductor packages, the tool changing apparatus including a target tool detachably mountable on an equipment depending on a type or size of semiconductor chips or semiconductor packages, and a coupling device mounted between the equipment and the target tool to detachably fix the target tool to the equipment, wherein the coupling device includes a stud mounted on the target tool or the equipment, and a clamping module mounted in the equipment or the target tool to clamp the stud.

Abstract: Disclosed is a substrate transfer device and a substrate transfer method which may load more containers even in a narrow space when an Overhead Hoist Transport (OHT) temporarily loads containers. The substrate transfer device includes: an OHT for transferring a container while autonomously travelling along a rail; and a loading unit providing a plurality of layers of loading areas in which the container is loaded.

Abstract: Provided is a chemical liquid dispensing apparatus including: a head assembly including a channel unit through which a chemical liquid flows, and multiple nozzles through which the chemical liquid flows from the channel unit and dispensing the chemical liquid onto a substrate; and a pipe connected to the head assembly and through which the chemical liquid passes, wherein the channel unit includes a first flow path having a branched structure, and a second flow path connected to the first flow path and supplying the chemical liquid to the multiple nozzles.

Abstract: Provided are a fringe information measuring apparatus that measures information on a fringe region using a temperature sensor array and a substrate treating system including the same. The fringe information measuring apparatus comprises: a laser sensor configured to output a first laser light and a second laser light to intersect each other; a thermal sensor array configured to pass through a fringe region formed by the intersection of the first laser light and the second laser light; and a control module configured to measure a position of the fringe region based on information obtained when the thermal sensor array passes through the fringe region.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a head unit configured to discharge an ink to a substrate; a supply unit configured to supply the ink to the head unit and including a reservoir having an inner space; and a pressure adjusting unit configured to adjust a pressure of the inner space, and wherein the pressure adjusting unit comprises: a first pressure adjusting unit; and a second pressure adjusting unit in which a size for changing a pressure of the inner space per unit time is greater than the first pressure adjusting unit.

Abstract: Provided is a substrate treating method. The substrate treating method includes: a first supercritical processing operation of loading a first substrate into a supercritical chamber and supercritically processing the first substrate in the supercritical chamber; a resting operation of maintaining the supercritical chamber in an empty state for a first time until a temperature in the supercritical chamber becomes a preset temperature by opening the supercritical chamber after the first substrate is unloaded from the supercritical chamber; and a second supercritical processing operation of loading a second substrate into the supercritical chamber and supercritically processing the second substrate in the supercritical chamber.

Abstract: An apparatus for processing a substrate may include a processing module including at least one process chamber for performing a desired process on a substrate and an index module transferring the substrate into the processing module from an outside. The at least one process chamber may include a housing providing a process space therein, a supporting unit disposed in the housing to support a substrate, the supporting unit including a focus ring having a plurality of rings, a gas supply unit providing a process gas into the process space, and a plasma generating unit generating a plasma from the process gas in the process space. The focus ring may include a stepped structure having a plurality of stepped portions downwardly provided toward the substrate.

Abstract: Provided are a nozzle inspection method and a nozzle inspection apparatus capable of accurately detecting a defect in an inkjet head nozzle within a short time. The nozzle inspection method comprises discharging a plurality of droplets into a first region of interest of a substrate using a first nozzle to form an inspection pattern, and determining whether the first nozzle is defective based on the inspection pattern.

Abstract: Provided is a substrate treating apparatus including: a fluid supply unit supplying a supercritical fluid to the treatment space, a plurality of components installed in the fluid supply line; and a detection member detecting whether or not metal particles are released from the component. The detection member includes: an upstream detection port connected to the fluid supply line upstream from a first component which is one of the plurality of components; a downstream detection port connected to the fluid supply line downstream from the first component; and a detector provided to be coupled to a selected detection port between the upstream detection port and the downstream detection port, and detecting metal particles from a fluid flowing through the detection port from the fluid supply line.

Abstract: Disclosed is a substrate treatment apparatus including a rotation unit that supports and rotates a substrate, a chemical discharge unit that discharges a chemical solution to the rotation unit, a chemical recovery unit disposed close to the rotation unit and configured to recover the chemical solution scattering from the rotation unit, and a laser irradiation unit that applies a laser beam to the substrate and heats the substrate.

Abstract: Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.

Abstract: A stocker system including a stocker apparatus, a transfer robot including a sensing module and a robot arm, a manual port of the stocker apparatus, and a controller in communication with the transfer robot, wherein the controller communicates with the sensing module to determine that a container is transferrable by the robot arm between the manual port of the stocker apparatus and the transfer robot.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; and a fluid supply unit supplying a treating fluid to the chamber, and wherein the fluid supply unit includes: a supply tank storing the treating fluid; a supply line connecting the supply tank and the chamber; and a plurality of valves installed at the supply line, and wherein any one valve among the plurality of valves is provided as a safety valve, and wherein the safety valve is opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from a tank to the chamber.

Abstract: Provided are an apparatus for multi-level pulsing, which minimizes power reflection when generating plasma using an RF signal having a plurality of pulsing levels, and a substrate processing apparatus including the same. The apparatus includes an RF signal generator for generating an RF signal including a first pulsing level and a second pulsing level that are different from each other, and a matching network for receiving the RF signal and providing a corresponding output signal to a load, wherein the RF signal generator generates the RF signal so that a first target impedance of the first pulsing level and a second target impedance of the second pulsing level are different from each other.

Abstract: The substrate treating apparatus includes a processing module and an index module on which a cassette having the substrate received therein is placed and that includes an index robot that transfers the substrate between the cassette and the processing module. The processing module includes a process chamber and a transfer chamber. The process chamber includes a support unit. The support unit includes a support on which the substrate is placed and a ring member that surrounds the substrate placed on the support and that is provided so as to be detachable from the support. The apparatus further includes a carrier storage unit that stores a carrier that is mounted on a hand of the main transfer robot or the index robot and on which the ring member is placed when the ring member is transferred by the main transfer robot or the index robot.

Abstract: A heater assembly includes a housing having an accommodation space therein and having a cooling gas inlet communicating with the accommodation space, a heater coupled to the housing, and a porous block disposed in the accommodation space.

Abstract: The inventive concept provides a liquid treating apparatus.

Abstract: The present invention relates a robot detection and control system within a chamber capable of detecting a position of the robot within the chamber by using a plurality of UWB radars. To this end, the present invention provides a robot detection and control system within a chamber configured to include a UWB radar provided in the chamber; a position detection unit which detects a position of a robot moving in the chamber using data by the UWB radar; and a robot control unit which compares the position of the robot by the position detection unit with a position of an obstacle to control the movement of the robot. Therefore, according to the present invention, since the position of the robot within the chamber may be determined in real time, it is possible to determine whether the movement path of the robot is appropriate and prevent an emergency accident in advance.

Abstract: A substrate type sensor provided in an atmosphere accompanied by a temperature change to measure a horizontality of a support member that supports a substrate is disclosed. The substrate type sensor may include a base having a shape of the substrate, one or more sensors provided in the base and including 3 or more axis acceleration sensors or 6 or more axis measurement units (IMUs), a receiver configured to receive data collected by the one or more sensors and a power source configured to provide electric power to the one or more sensors and the receiver.

Abstract: A sealing member for use in sealing a chamber for treating a substrate, the sealing member inserted in a groove formed in the chamber, includes a bottom part, a top part opposite the bottom part, an inner part connecting a first side of the bottom part to the top part, an outer part opposite the inner part and connecting a second side of the bottom part to the top part, and a recessed portion between the top part and the outer part.