Abstract: The inventive concept provides a substrate treating apparatus.

Abstract: Disclosed is a substrate processing device which includes a substrate transfer part on which a transfer object is received and a jetting system part includes an ink jet body that jets and prints ink on the transfer object over an upper surface of the substrate transfer part, an ink module transfer part that transfers the ink jet body, an encoder disposed around the ink module transfer part to output a movement signal per unit movement distance of the ink module transfer part, an ink ejection controller that interworks with the ink jet body to control an ink jetting timing of the ink jet body, and a signal splitter that interworks with the encoder to count the movement signal, reset a width of the counted movement signal, and transmit the movement signal, the width of which is reset, to the ink ejection controller.

Abstract: A tower lift includes a main frame, a first carriage module and a second carriage module connected with each other inside the main frame at left and right sides of the main frame, respectively, having the same weight as each other, and configured to be moved in a vertical direction, and a driving module installed on the main frame and configured to move the first carriage module and the second carriage module in the vertical direction.

Abstract: Provided are a container transporting apparatus for storing items such as FOUPs and reticle pods by utilizing the dead zone space located in an upper portion of the semiconductor manufacturing facility built in the FAB, and a container storage system having the same. The container storage system may include a first storage unit installed on a side of a movement path of a transporting device for transporting a container accommodating a substrate and for storing the container; a second storage unit installed on a side of the first storage unit and for storing the container; and a transporting unit moving between the first storage unit and the second storage unit and for transporting the container stored in the first storage unit to the second storage unit.

Abstract: Disclosed is a device for processing a substrate, the device including: a support unit including a spin chuck supporting a substrate, a rotation shaft supporting the spin chuck, and a driver providing rotational force to the rotation shaft; and a determination unit for determining whether the rotation shaft is defective, in which the determination unit determines whether the rotation shaft is defective based on a current value applied to the driver while the rotation shaft is rotating.

Abstract: A flow rate control apparatus with improved reliability is provided. The flow rate control apparatus comprises a flow rate measuring unit for measuring a flow rate of chemical solution in a chemical solution supply line, a flow rate control unit for comparing a preset target flow rate profile and an applied flow rate profile, and controlling the flow rate of the chemical solution so that the applied flow rate profile matches the target flow rate profile, and a processor for switching the flow rate control unit to a first mode in response to a signal for the flow rate of the chemical solution measured by the flow rate measuring unit being less than a preset level, wherein, in the first mode, the applied flow rate profile includes a profile of a flow rate estimation model simulated using a flow rate of chemical solution measured by the flow rate measuring unit.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus comprises a first treating part performing, a liquid treatment on a plurality of substrates in a batch-type treating, method and a second treating part treating the substrates which have been treated at the first treating part, and performing, the liquid treatment or a drying treatment on a single substrate a single-type treating method.

Abstract: An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.

Abstract: The inventive concept provides a method for treating a substrate. In the substrate treating method, a liquid film is formed by supplying a treatment liquid to the rotating substrate, and a wetting medium is sprayed in a form of fine particles to the substrate to help diffusion of the liquid film.

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an imaging unit that photographs loci of the one or more discharge liquids discharged from the plurality of nozzles, and an inspection unit that calculates impact points of the one or more discharge liquids discharged from the plurality of nozzles and determines whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal. The inspection unit includes an image synthesizing unit that synthesizes a plurality of images captured by the imaging unit, a pre-processing unit that pre-processes image data generated through the image synthesizing unit, and a calculation unit that calculates whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal by comparing the image data pre-processed by the pre-processing unit.

Abstract: A substrate processing apparatus using plasma capable of efficiently controlling the selectivity ratio of a silicon layer and an oxide layer is provided. The substrate processing apparatus comprises a first space disposed between an electrode and an ion blocker; a second space disposed between the ion blocker and a shower head; a processing space under the shower head for processing a substrate; a first supply hole for providing a first gas for generating plasma to the first space; a second supply hole for providing a second gas to be mixed with an effluent of the plasma to the second space; and a first coating layer formed on a first surface of the shower head facing the second space, not formed on a second surface of the shower head facing the processing space, and containing nickel.

Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a cup having a treatment space therein; a support unit configured to support a substrate within the treatment space, and including a rotatable support plate; and a liquid discharge unit configured to discharge a chemical liquid to the substrate supported by the support unit, in which the support unit includes: a plurality of pin members provided to the support plate to support the substrate placed on the support plate; and a discharge member coupled to the pin member to discharge charges to the air according to a rotation of the support plate, and the discharge member is provided as a conductive member.

Abstract: A substrate transferring apparatus including a non-contact type driving unit is provided. The substrate transferring apparatus comprises a stator assembly including a driving surface and an electromagnetic generating module, a first mover including a first magnet module facing the electromagnetic generating module and floating and moving on the driving surface, and including a first inclined surface, a second mover including a second magnet module facing the electromagnetic generating module and floating and moving on the driving surface, and including a second inclined surface, and a transfer member disposed between the first mover and the second mover and moving along the first inclined surface and the second inclined surface according to a distance between the first mover and the second mover.

Abstract: Disclosed is a substrate processing method including: a substrate loading operation of loading a substrate into a processing space provided by a body; a heating operation of placing the substrate, which has been loaded into the processing space, on a heating chuck and heating the substrate; and an atmosphere changing operation of changing an atmosphere of the processing space, in which the atmosphere changing operation includes: a gas discharging operation of injecting atmosphere changing gas in a state where the substrate is located closer to a baffle than in the heating operation, in which the baffle is provided on a top side of the heating chuck to face the heating chuck and injects the atmosphere changing gas; and a substrate lowering operation of lowering and placing the substrate onto the heating chuck while maintaining the injection of the atmosphere changing gas.

Abstract: A substrate treating apparatus is disclosed. The substrate treating apparatus includes a treating container having a treatment space to treat a substrate, a standby port positioned at one side of the treating container to allow a nozzle, which discharges a treatment liquid, to stand by, and a liquid supplying unit moving between the treating container and the standby port and having the nozzle. The standby port includes a nozzle receiving member including a nozzle receiving unit having a receiving space formed inside the nozzle receiving unit to receive the nozzle and a cleaning liquid and a discharge part having a discharge port provided at one side of the nozzle cleaning unit to discharge the cleaning liquid to the nozzle. The discharge port is provided to overlap at least a portion of the nozzle when viewed from above.

Abstract: An apparatus for treating a substrate includes a treating vessel having an inner space, a support unit that supports and rotates the substrate in the inner space, and an exhaust unit that releases an air flow in the inner space. The exhaust unit includes an air-flow guide duct into which the air flow is introduced in a tangential direction with respect to a rotating direction of the substrate supported on the support unit.

Abstract: A method of processing a substrate is provided. The method processes a substrate by using a substrate processing apparatus including a chamber, a shower head unit for supplying a cleaning gas into the chamber, a first electrode disposed on an upper portion of the shower head unit, a support unit for supporting the substrate, and a second electrode disposed inside the support unit, the method including supplying the cleaning gas into the chamber, and supplying a voltage of a first magnitude to the first electrode and supplying a voltage of a second magnitude greater than the first magnitude to the second electrode.

Abstract: The inventive concept relates to a substrate treating apparatus including a process chamber having a first and a second body, a support unit supporting a substrate, a heating unit heats the substrate, a driver moves any one of the first body and the second body, an interval state detection unit that detects an interval state between a side wall of the first body and a side wall of the second body when the first and the second body are placed in a process location, and a controller that controls the driver and the interval state detection unit, wherein the interval state detection unit includes a pressure provision line that provides a positive pressure or a negative pressure between the side wall of the first body and the side wall of the second body, and a pressure measurement member that measures a change in a pressure of the pressure provision line.

Abstract: According to an embodiment of the present invention, there is provided an article transport vehicle capable of speeding up and reducing vibration in a manufacturing plant, a rail assembly, and an article transport system including the same. The article transport vehicle that conveys an article between manufacturing facilities along a rail of an article transport system in a manufacturing plant includes an article holder, a vehicle body, a magnetic levitation actuator, and a linear motor coil.

Abstract: The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a beam to the substrate and heat the substrate, and the heating unit further includes an irradiation part that irradiates the beam, and a rotation part that rotates the beam.