Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a support plate configured to support a substrate, a base plate under the support plate, a thermal insulation layer between the support plate and the base plate, a bonder bonding the base plate and the thermal insulation layer to each other, and a sealing member disposed around a side surface of the bonder to prevent damage to the bonder.

Abstract: Disclosed is a method of forming a semiconductor device, the method including: forming at least one metal catalyst layer on a rear surface of a semiconductor substrate, on which at least one buried power rail for power transfer is formed, to be at least partially aligned with the buried power rail; and forming at least one rear surface via hole by supplying an etchant to the semiconductor substrate so that the semiconductor substrate between the metal catalyst layer and the buried power rail is anisotropically etched while the metal catalyst layer descends to an inside of the semiconductor substrate using metal-assisted chemical etching (MACE).

Abstract: An apparatus for performing heat treatment with respect to a substrate is provided. The apparatus for treating the substrate includes a substrate support member to seat a substrate on the substrate support member, a treating bowl to surround the substrate support member, a base plate provided to face a bottom surface of the substrate seated on the substrate support member, and an edge nozzle member mounted on the base plate to spray a treating liquid to a bottom edge part of the substrate seated on the substrate support member. The edge nozzle member includes a main body mounted on the base plate, a nozzle arm to mount an edge nozzle on the nozzle arm to slidably move on the main body, and a fixing member to maintain the nozzle arm at a setting position on the main body.

Abstract: Provided is an apparatus for processing a substrate including a spin head on which a substrate is placed, a container provided to surround the spin head, an upper nozzle member supplying a processing solution downwards, a bottom cleaning member located to be a certain distance from the bottom of the spin head, wherein the bottom cleaning member sprays a cleaning solution to the bottom of the spin head.

Abstract: Disclosed is a substrate treating apparatus, which includes a chamber having a space for treating a substrate in an interior thereof, a substrate support assembly including a support plate situated in the chamber and which supports the substrate, a gas supply unit which supplies a gas into the interior of the chamber, a plasma generating unit which excites the gas in in the interior of the chamber into a plasma state, and a substrate temperature control unit which controls a temperature of the substrate, and the substrate temperature control unit includes a plurality of heaters installed in different areas of the support plate, a power supply part which supplies electric power to the plurality of heaters, a ferrite core which interrupts a low-frequency signal introduced to the power supply part, and a plurality of air cores which interrupts a high-frequency signal introduced into the power supply part.

Abstract: A light source uniformity adjusting device is provided, which easily and exactly performs a coiling task of an optical fiber. The light source uniformity adjusting device includes a base plate including a plurality of holes therein; a first fixing portion on one side of the base plate, fixing a first portion of an optical fiber; a second fixing portion disposed on another side of the base plate, fixing a second portion of the optical fiber; and a post portion inserted into at least one hole from among the plurality of holes, the post portion routing the optical fiber on the base plate such that the optical fiber has at least one curved shape between the first portion and the second portion.

Abstract: A maintenance assembly for an inkjet head may include a housing having an upper face facing a nozzle face on which nozzles for discharging a chemical liquid on a substrate are arranged, and a fluid supplying part for providing a humidity control fluid onto the nozzles and the nozzle face such that a humidity of the nozzles and a humidity of the nozzle face are adjusted to a set humidity if the humidity of the nozzles and the humidity of the nozzle face are different from the set humidity.

Abstract: There is provided a substrate processing apparatus including a chamber having a processing space therein, a dielectric window arranged at an upper portion of the chamber and configured to cover an upper surface of the chamber, and an RF source disposed on the dielectric window and configured to supply RF power to generate plasma from gas in the processing space, wherein the RF source includes an RF electrode disposed on the dielectric window and an RF plate disposed on the RF electrode, the dielectric window includes a groove extending vertically downward from an uppermost surface of the dielectric window, and the RF plate has a ring shape.

Abstract: A substrate processing device is provided. The substrate processing device includes: a substrate supporter configured to support a substrate; a heating ring horizontally surrounding the substrate supporter; and an edge ring horizontally surrounding the heating ring and configured to cover a top surface of the heating ring.

Abstract: A maintenance assembly for an inkjet head may include a housing having an upper face facing a nozzle face on which nozzles for discharging a chemical liquid on a substrate are arranged, and an atmosphere generating part for providing an atmosphere including humidity around the nozzles and the nozzle face such that a humidity of the nozzles and a humidity of the nozzle face are adjusted to a set humidity if the humidity of the nozzles and the humidity of the nozzle face are different from the set humidity.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes discharging a treating liquid including a polymer and a solvent onto a substrate; and solidifying a liquid film of the treating liquid by volatilizing the solvent from the treating liquid on the substrate, and wherein the solidifying a liquid film comprises a first period of stopping the rotation of the substrate or rotating the substrate at a first speed for a first time period.

Abstract: An apparatus for transporting a substrate includes an actuator, a robot arm, operation of which is controlled by the actuator, a robot hand including at least one intake vent having a predetermined separation distance from the supported substrate, a fixing unit that fixes the substrate supported on the robot hand, and an intake unit connected with the intake vent.

Abstract: Provided is a plasma processing apparatus. The plasma processing apparatus includes a chamber configured to isolate a plasma region where plasma is formed from an outside, a core located on the chamber and configured to form a magnetic field in the chamber, and a plurality of coils located adjacent to the core, wherein the core includes a first core having a donut shape, and the plurality of coils include first and second upper outer coils located on a top surface of the first core.

Abstract: A substrate processing apparatus includes a spraying unit installed in an inner space of a chamber member in which a substrate is processed, spraying a cleaning liquid into the inner space of the chamber member so as to clean devices for discharging a chemical liquid to the substrate and then collecting the chemical liquid, and spraying a drying gas for drying the remaining cleaning liquid into the inner space of the chamber member, a management unit removing a residue remaining on the spraying unit after the spraying unit sprays the cleaning liquid, and a controller controlling the spraying unit and the management unit.

Abstract: A substrate treating apparatus includes a process module including a plurality of process units that perform a plurality of steps included in a substrate treating process and that perform the substrate treating process on substrates sequentially placed in the process units based on process recipes for the substrates, a scheduler that controls operations of the process module and the process units included in the process module, a storage that stores transfer paths information of the substrates, and a selection module that selects a process unit to proceed, by a result of feeding back the transfer paths information stored in the storage to the scheduler. The substrate treating apparatus may further include a measuring instrument that measures defect values of the transfer paths information along which the substrates are transferred. The storage may store the defect values measured by the measuring instrument according to the transfer paths information of the substrates.

Abstract: Provided is a treatment liquid ejection method and apparatus capable of significantly increasing productivity and quality by greatly reducing a maintenance time of a head unit, the treatment liquid ejection method including (a) obtaining test image information by test-photographing a treatment liquid test-printed by a head unit, (b) generating nozzle-specific characteristic information by using the test image information, (c) generating print file information to be printed, in consideration of the nozzle-specific characteristic information, (d) reflecting recipe information of a substrate or the head unit to prepare the print file information in an outputtable state, and (e) printing, on the substrate by the head unit, the print file information to which the recipe information is reflected.

Abstract: A tube includes an outer layer including a first material having flexibility, an inner layer including a second material having flexibility and chemical resistance, and an intermediate layer arranged between the outer layer and the inner layer and including an electrically conductive material.

Abstract: Disclosed is a transfer plate set. More particularly, the transfer plate set serves to guide a substrate transfer unit to move, the transfer plate set including a first plate part; and a second plate part inserted and fixed to the first plate part, wherein the first plate part includes a first base; a first guide member disposed on the first base; and a receiving part formed to be stepped on a side facing the second plate part, and wherein the second plate part includes a second base; a second guide member disposed on the second base; and an insertion part formed to protrude from a side facing the first plate part and provided to be inserted into the receiving part.

Abstract: Provided is a substrate processing apparatus including a substrate floating unit for floating a substrate, a nozzle unit positioned above the substrate floating unit to eject a liquid chemical onto the substrate, a measurement unit for measuring a floating amount of the substrate, and a controller for obtaining a serial number of the substrate and providing control to change, based on the serial number, reference signal data used by the measurement unit to measure the floating amount of the substrate.

Abstract: An apparatus and method for dispensing treatment liquid, which enable treatment liquid to be accurately dispensed to an intended position on a substrate having a non-planar surface on the basis of measurement information obtained by three-dimensionally measuring the substrate. The apparatus may include: a substrate support unit on which a substrate is seated; a three-dimensional (3D) measurement device configured to three-dimensionally measure the substrate seated on the substrate support unit; a head unit configured to dispense treatment liquid onto the substrate seated on the substrate support unit; and a controller configured to receive actually measured 3D substrate information of the substrate from the 3D measurement device, generate printing pattern image information based on the actually measured 3D substrate information, and apply printing command information to the head unit according to the generated printing pattern image information.