Patents Assigned to Semiconductors GmbH
  • Patent number: 12294039
    Abstract: A semiconductor structure comprises an n-doped first layer, a p-doped second layer doped with a first dopant, and an active layer disposed between the n-doped first layer and the p-doped second layer and having at least one quantum well. The active layer of the semiconductor structure is divided into a plurality of first optically active regions, at least one second region, and at least one third region. Here, the plurality of first optically active regions are arranged in a hexagonal pattern spaced apart from each other. The at least one quantum well in the active region comprises a larger band gap in the at least one second region than in the plurality of first optically active regions and the at least one third region, the band gap being modified, in particular, by quantum well intermixing. The at least one second region encloses the plurality of first optically active regions.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: May 6, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Andreas Biebersdorf, Stefan Illek, Felix Feix, Christoph Klemp, Ines Pietzonka, Petrus Sundgren, Christian Berger, Ana Kanevce
  • Patent number: 12288830
    Abstract: In an embodiment a method for singulating components from a component composite includes providing the component composite comprising a structured substrate including component carrier bodies and connecting portions arranged between the component carrier bodies, and a base material, in which the connecting portions of the structured substrate are at least partially embedded, removing the base material in separating regions of the component composite, which include the connecting portions and singulating the component composite at the separating regions to form the components.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: April 29, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Andreas Dobner, Matthias Goldbach, Georg Bogner
  • Patent number: 12289937
    Abstract: In an embodiment a method for manufacturing at least one electronic component includes providing a second surface area of the component adjacent to a first surface area, wherein the second surface area is repulsive to a first fluid to be applied, applying the first fluid without additional pressurization to the first and/or second surface area, wherein the first surface area is wetted by the first fluid and the first fluid is repelled from the second surface area and applying a second fluid to the first surface area, to the second surface area and/or to a surface area of the solidified first fluid, after solidification of the first fluid applied to the first surface area, wherein applying the second fluid includes applying a positive pressure, a plasma action and/or a compression molding, and wherein the second fluid wets the second surface area.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: April 29, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Daniel Leisen, Simon Jerebic, Max Wenzel
  • Patent number: 12283648
    Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: April 22, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Hubert Halbritter, Laura Kreiner
  • Patent number: 12284847
    Abstract: In an embodiment an optoelectronic component includes a carrier with a mounting area, an optoelectronic semiconductor chip, a dielectric protective layer and a dielectric encapsulation, wherein the protective layer is directly located at the mounting area in a chip mounting region, wherein the semiconductor chip is located at the protective layer in the chip mounting region and is electrically conductively connected with the carrier, wherein the encapsulation is directly located at the mounting area in a region adjacent to the chip mounting region and is directly located at the protective layer in an overlap region, and wherein the encapsulation is arranged exclusively in the region adjacent to the semiconductor chip.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: April 22, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Ivar Tangring
  • Patent number: 12279854
    Abstract: In an embodiment a pulse sensor includes two light sources configured to emit light in a direction of a perfused tissue of a living being so that the perfused tissue scatters the light and so that the scattered light is modulated on basis of a pulse of the living being, at least one luminescent concentrator including an entry face, an exit face smaller than the entry face, and a fluorescent material arranged in a light path between the entry face and the exit face, wherein the luminescent concentrator is configured to receive at least some of the modulated scattered light entering through the entry face, convert the entered light by the fluorescent material and emit the modulated converted light from the exit face, and one light detector configured to detect at least some of the modulated converted light emerging from the exit face, wherein, in plan view, the luminescent concentrator is strip-shaped and extends perpendicular to a connecting line between the two light sources, wherein side faces of the lumines
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: April 22, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Tobias Schmidt
  • Patent number: 12278318
    Abstract: A component comprising a structural element, a leadframe and a shaped body, in which component the structural element and the leadframe are enclosed at least in regions by the shaped body in lateral directions and the leadframe does not project beyond side faces of the shaped body. The leadframe has at least one first subregion and at least one second subregion which is laterally spaced apart from the first subregion, wherein the structural element is electrically conductively connected to the second subregion by a planar contact structure. Furthermore, the structural element is arranged, in plan view, on the first subregion and projects laterally beyond the first subregion at least in regions, so that the structural element and the first subregion form an anchoring structure at which the structural element and the first subregion are anchored to the shaped body. Further specified is a method for producing such a component.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: April 15, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Thomas Schwarz
  • Patent number: 12278319
    Abstract: The invention relates to a component with a support and a plurality of semiconductor chips, in which the support has a single-ply, electrically conducting support layer, wherein the support layer is structured and has a plurality of sublayers. The support layer has a mounting surface, on which the semiconductor chips are arranged, wherein the semiconductor chips are mechanically supported by the support layer and electrically conductively connected to the sublayers. The support has a common electrode for semiconductor chips of a group of a plurality of semiconductor chips, wherein the common electrode is formed by one of the sublayers or by a plurality of electrically connected sublayers of the support layer. The invention further relates to a method for producing a component of this kind.
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: April 15, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Thomas Schwarz
  • Patent number: 12278194
    Abstract: An optoelectronic component includes at least one optoelectronic semiconductor chip and an electronic first storage medium. The first storage medium electrically stores first component information. The component can be uniquely identified via the first component information. The optoelectronic component also includes a second storage medium which can be read out wirelessly at least in an unmounted state of the component. The second storage medium stores second component information that is representative of the first component information.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: April 15, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Michael Brandl
  • Patent number: 12279466
    Abstract: An optoelectronic semiconductor device may include a first and second semiconductor layer having a first and second conductivity type, respectively, a first contact structure, a contact layer, and a separating layer. Contact holes are arranged in the separating layer. The optoelectronic semiconductor device may include portions of a conductive layer arranged over a side of the separating layer facing away from the contact layer. The portions of the conductive layer are each connected to a conducting material in the contact holes. The first contact structure is connected to the contact layer via the portions of the conductive layer and the conducting material. A length of each of the portions is greater than a greatest width of the portions. The length denotes a shortest distance between an associated contact hole and a conductive material between adjacent portions, and the width is measured perpendicular to the length.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: April 15, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Franz Eberhard
  • Patent number: 12266641
    Abstract: A support structure for receiving planar microchips, comprising a planar support substrate and at least two receiving elements. The receiving elements are connected to the carrier substrate and configured in such a way that they detachably hold a flat microchip between the at least two receiving elements in such a way that the microchip can be moved out with a defined minimum force transversely to a support structure plane.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: April 1, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Alexander Pfeuffer, Korbinian Perzlmaier, Kerstin Neveling
  • Patent number: 12266744
    Abstract: In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: April 1, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Mei See Boon, Hui Chiang Teoh, Tomin Liu, Hui Ying Pee, Asliza Alias, Lay Teng Tan, Yuan Liang, Alex Kheng Hooi Lim, Wing Yew Wong
  • Patent number: 12261242
    Abstract: In an embodiment a semiconductor chip includes a semiconductor body having a first region, a second region, and an active region between the first region and the second region, indentations in the first region, a TCO material in the indentations and a carrier, wherein the indentations of the first region are arranged on a side of the first region facing away from the carrier, and wherein the TCO material is flush with a surface of the first region facing away from the active region.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: March 25, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Brendan Holland
  • Patent number: 12261256
    Abstract: The invention relates to various aspects of an optoelectronic component or an arrangement comprising such a component for various applications, in particular in the automotive sector and for visual displays. The arrangements are characterized by simple manufacture and fast switching times.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: March 25, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Hubert Halbritter, Erwin Lang, Julia Stolz, Andreas Rausch, Simon Schwalenberg
  • Patent number: 12255263
    Abstract: A method for producing a radiation emitting semiconductor chip may include providing a semiconductor layer sequence having an active region configured to generate electromagnetic radiation, applying a reflective layer sequence over the semiconductor layer sequence, generating a first recess through an opening of a mask where the first recess completely penetrates the reflective layer sequence and the active region, and applying a dielectric mirror layer in the first recess through the same opening of the same mask. Furthermore, a radiation emitting semiconductor chip is disclosed.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: March 18, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Brendan Holland
  • Patent number: 12256498
    Abstract: In an embodiment a storage device includes a base carrier extending along a main surface having a surface structuring, a carrier foil including a first main surface and a second main surface, wherein the first main surface is fixable to or arrangeable on the main surface of the base carrier, and wherein the components are fixable to the second main surface and a fixing frame fixing the carrier foil, which is fixed or positioned to the main surface of the base carrier, to the base carrier and acting as a releasable clamp so that the carrier foil is clampable and securable in or to the base carrier.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: March 18, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Ronny Simon
  • Patent number: 12249672
    Abstract: In an embodiment a method for manufacturing a semiconductor device include providing a growth substrate, depositing an n-doped first layer, depositing an active region on the n-doped first layer, depositing a second layer onto the active region, depositing magnesium (Mg) in the second layer and subsequently to depositing Mg, depositing zinc (Zn) in the second layer such that a concentration of Zn in the second layer decreases from a first value to a second value in a first area of the second layer adjacent to the active region, the first area being in a range of 5 nm to 200 nm.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: March 11, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Philipp Kreuter, Andreas Biebersdorf, Christoph Klemp, Jens Ebbecke, Ines Pietzonka, Petrus Sundgren
  • Patent number: 12247922
    Abstract: In an embodiment an apparatus includes at least one optoelectronic laser configured to provide excitation radiation to a sample, the excitation radiation being generated by an electric current flowing through the at least one optoelectronic laser, a transistor configured to modulate the electric current flowing through the at least one optoelectronic laser in order to switch on and off generation of the excitation radiation and a spectrometer configured to analyze Raman light scattered from the sample in response to exposing the sample to the excitation radiation, wherein the Raman light includes one or more spectral components, wherein the spectrometer includes a diffraction element configured to split the Raman light into the spectral components, and wherein the diffraction element includes at least a photonic crystal or a plasmonic Fabry Perot filter.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: March 11, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ann Russell, Hubert Halbritter, Christoph Goeltner
  • Patent number: 12249597
    Abstract: A display device with a connection carrier and a plurality of pixels, which are drivable via row lines and column lines, is specified. The row lines and the column lines are arranged on the connection carrier. At least one row line is interrupted at an imaginary crossing point with a column line on the connection carrier. A bridging component is arranged on the connection carrier, which bridges the row line at the imaginary crossing point in an electrically conductive manner.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: March 11, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Sebastian Wittmann, Thomas Schwarz
  • Patent number: 12250842
    Abstract: A semiconductor component includes a radiation exit surface; a semiconductor body having an active region that generates radiation; wherein a molded body molded onto the semiconductor body; contacts for external electrical contacting of the semiconductor component are accessible on an outer side of the molded body; a deflection structure arranged between the active region and the radiation exit surface; a planarization layer arranged on the deflection structure; and a polarizer arranged on a side of the planarization layer facing away from the semiconductor body; wherein the semiconductor body on a side facing away from the radiation exit surface includes a mirror structure having at least one dielectric layer and a metallic connection layer, and the dielectric layer is arranged at locations between the semiconductor body and the metallic connection layer.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: March 11, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Berthold Hahn, Georg Bogner