Abstract: An extension of the LoRa modulation with an improved ranging mode. A master and a slave device exchange a request and a reply that contain sequences of chirps that are carefully aligned in time, frequency, and preferably also phase, such that the master device can ascertain the propagation delay to the slave by demodulating the reply. Request and reply include chirps having different slopes, preferably slopes of equal absolute value and opposite sign. The slope diversity permits an unbiased estimation of the Doppler shift.

Abstract: A leadframe is formed by chemically half-etching a sheet of conductive material. The half-etching exposes a first side surface of a first contact of the leadframe. A solder wettable layer is plated over the first side surface of the first contact. An encapsulant is deposited over the leadframe after plating the solder wettable layer.

Abstract: A proximity sensor for a portable wireless connected device, the sensor being arranged to determine whether a part of a user's body is near the portable connected wireless device. The sensor generates a time-averaged proximity that is alerted when the device is brought near a part of a user's body for a given time and may be periodically reset momentarily during the periods of proximity. An integration time comparable with that used in SAR testing, enables the sensor to reduce the radio power emitted by a portable device when it is near the body. The integration time can be obtained by a sigma/delta modulator configured as rate-compression unit.

Abstract: A transimpedance amplifier (TIA) for converting an input current at an input node into an output voltage at an output node, the TIA comprising: a first amplifier stage having a first input coupled to the input node and a first output; a feedback path between the first output and the first input; a second amplifier stage in the feedback path having a second input, the second input coupled to the first output of the first amplifier stage; a feedback resistor in the feedback path coupled between an output of the second amplifier stage and first input of the first amplifier stage; and an output stage, comprising: a load resistor coupled between a reference voltage node and a T-coil, the T-coil comprising first and second inductors coupled in series at an inductor node, the T-coil coupled between the first output and the load resistor, the inductor node coupled to the output node of the TIA.

Abstract: A semiconductor device has a substrate and leads formed on two or more sides of the substrate. An electrical component is disposed over the substrate and electrically connected to the lead with bumps or bond wires. The electrical component is encapsulated. A portion of the substrate is removed to form a wettable flank on at least three sides of the lead. The substrate has a molding compound and the lead is disposed within or adjacent to the molding compound. A portion of the molding compound can remain at corners of the substrate. The lead has a first surface or recessed surface on a first side of the lead, a second surface or recessed surface on a second side of the lead, and a third surface or recessed surface on a third side of the lead. A portion of a surface of the lead is plated.

Abstract: This application relates to transimpedance amplifier (TIA) apparatus, in particular to a TIA apparatus suitable for receiving data using burst mode communication. The apparatus has a transimpedance amplifier configured to generate a first voltage based on a current at an input node for an input signal. A controlled voltage source, such as a dummy TIA, generates a second voltage based on a first control current. A controller is configured to collectively control the first control current and a second control current based on an indication of input signal magnitude. The first control current controls the second voltage which may be used as a slicing level. The second control current is subtracted from the current at the input node and can provide a DC restore current.

Abstract: Environmental sensor circuit for a portable connected wireless device. The circuit includes a capacitive proximity sensor that determines when a user is close to the portable device. The device also has a magnetic field probe that provides a signal that indicates the position of a permanent magnet. The sensor circuit integrates both a digitizing unit and digital signal processing for the suppression of noise and drive in signals coming from the proximity sensor and from the magnetic field probe.

Abstract: There are provided methods for predicting timing advance (TA) with respect to a base station. According to some embodiments, the method includes determining, by a user equipment (UE), a set of TAs, each TA corresponding to a particular distance from the base station and measuring, by the UE, a set of instances of a power metric, each instance of the power metric associated with a respective distance from the base station. The method further includes determining, by the UE, a set of differences between each of the instances of the power metric and determining, by the UE, a new TA at least in part using the set of TAs and the set of differences.

Abstract: A semiconductor device has a substrate and leads formed on two or more sides of the substrate. An electrical component is disposed over the substrate and electrically connected to the lead with bumps or bond wires. The electrical component is encapsulated. A portion of the substrate is removed to form a wettable flank on at least three sides of the lead. The substrate has a molding compound and the lead is disposed within or adjacent to the molding compound. A portion of the molding compound can remain at corners of the substrate. The lead has a first surface or recessed surface on a first side of the lead, a second surface or recessed surface on a second side of the lead, and a third surface or recessed surface on a third side of the lead. A portion of a surface of the lead is plated.

Abstract: A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. A solder is deposited over the pillar bumps. The semiconductor wafer is singulated into a plurality of semiconductor die after forming the pillar bumps while the semiconductor wafer is on a carrier. An encapsulant is deposited around the semiconductor die and pillar bumps while the semiconductor die remains on the carrier. The encapsulant covers an active surface of the semiconductor die between the pillar bumps.

Abstract: A FIR filter (15), comprising an input terminal for receiving an input signal, a first filtering circuit comprising: a first transconductance device (30a) configured to generate a first current signal (i1) proportional to the input signal; a first analog switch (41a) commuted in n by a first digital gate signal (?1) and configured to block the current signal when the first digital gate signal has a first value and to transmit the current signal to a first integrating capacitor (45a) when the first digital gate signal has a second value; characterized in that the first digital gate signal (?1) comprises a periodic series of pulses, wherein the pulses have widths proportional to the filter coefficients.

Abstract: A method of characterizing a LoRa modulated signal or any such signals with a plurality of chirps as symbols. It foresees sampling and storing the signal, determining a phase of at least one chirp in the signal, and determining a timing error and/or a frequency error based on the phase, The timing error is extracted by the height of a discontinuous step in the phase at the position of the cyclical shift, while the frequency error is obtained by the slope of the phase. The method can be applied to a dedicated receiver for the characterization of LoRa transmitters.

Abstract: After transmitting first electrical signals to a receiver, a transmitter receives a burst absent mode signal from the receiver. While in a ready state, the transmitter receives a signal including a data burst, converts the signal to second electrical signals, including a settled DC offset, and transmits the second electrical signals to the receiver. The receiver transmits the burst absent mode signal to the transmitter after receiving the first electrical signals, detects a presence of the second electrical signals. In response to detecting the presence of the second electrical signals, the receiver removes the DC offset from the second electrical signals to generate output signals, and causes transmitting the output signals to a subsequent device. The receiver removes the DC offset by causing an instruction to discharge AC coupling capacitors. The burst absent mode signal is generated using a host reset instruction or an internally generated instruction.

Abstract: A packaged optical receiver, comprising: a photodiode configured to receive an optical signal; a transimpedance amplifier (TIA) coupled to the photodiode; and a signal pin; wherein the optical receiver is configured to receive, via the signal pin, a reset signal; and wherein the optical receiver is configured to output in response to the reset signal, via the signal pin, a received signal strength indication (RSSI) for the received optical signal.

Abstract: A compound semiconductor integrated circuit is disclosed, which includes biasing circuitry for generating a bias voltage at a bias output node. The biasing circuitry comprises a first circuit branch configured to extend between a defined voltage and a supply voltage. The first circuit branch includes a first transistor configured as a current source to generate a defined current in the first circuit branch and a controllably variable resistance. The bias output node is coupled to the first circuit branch at a first node which is between the controllably variable resistance and the first transistor. The biasing circuitry is operable so that the resistance value of the controllably variable resistance varies with a control voltage so as to vary the value of the bias voltage.

Abstract: A system may include a recovery circuit that may: receive a first detect signal for a first burst signal and a second detect signal for a second burst signal in a burst mode data path; receive a reference pattern signal from a continuous mode data path; generate a first lock signal locked to the first burst signal or locked to the reference pattern signal, and a second lock signal locked to the second burst signal; and output the reference pattern signal from the recovery circuit during a guard period. The frequency of the recovery circuit may be locked to the frequency of the reference pattern signal during the guard period. The guard period may start based on when the first detect signal de-asserts or when the first lock signal de-asserts. During the guard period, the recovery circuit does not output the first burst signal or the second burst signal.

Abstract: A signal driver may include a plurality of distributed drivers along a differential transmission line. Each of the plurality of the distributed drivers may include: an output tap configured to receive a portion of an incoming signal of the signal driver; and a T-coil connected to an output node of the output tap. The differential transmission line is connected to and intercepted by a first terminal and a second terminal of the T-coil, and a plurality of T-coils of the plurality of the distributed drivers are distributed along and spaced apart on the differential transmission line.

Abstract: Environmental sensor circuit for a portable connected wireless device. The circuit includes a capacitive proximity sensor that determines when a user is close to the portable device. The device also has a magnetic field probe that provides a signal that indicates the position of a permanent magnet. The sensor circuit integrates both a digitizing unit and digital signal processing for the suppression of noise and drive in signals coming from the proximity sensor and from the magnetic field probe.

Abstract: A decision feedback equalizer (DFE) may include a summer configured to receive a signal stream, and a plurality of feedback taps including a first feedback tap connected to the summer. The first feedback tap may include a pre-amplifier, a combined latch and a digital to analog converter (DAC). The pre-amplifier may be configured to be clocked by a first clock signal, wherein the pre-amplifier may be configured to receive an output signal of the summer and to receive a first postcursor generated by the DFE of a previous signal in the signal stream. The combined latch may be configured to be clocked by a first clock signal and a second clock signal. The DAC may be coupled to an output node of the combined latch. The first postcursor may be provided to the pre-amplifier without being provided to the summer.

Abstract: A decision feedback equalizer (DFE) may include a summer configured to receive a signal stream, and a plurality of feedback taps including a first feedback tap connected to the summer. The first feedback tap may include a pre-amplifier, a combined latch and a digital to analog converter (DAC). The pre-amplifier may be configured to be clocked by a first clock signal, wherein the pre-amplifier may be configured to receive an output signal of the summer and to receive a first postcursor generated by the DFE of a previous signal in the signal stream. The combined latch may be configured to be clocked by a first clock signal and a second clock signal. The DAC may be coupled to an output node of the combined latch. The first postcursor may be provided to the pre-amplifier without being provided to the summer.