Patents Assigned to Sensata Technologies, Inc.
  • Patent number: 9746390
    Abstract: Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: August 29, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Ernie Johannus Antonius Schoot Uiterkamp, Dedde Hedzer Wiersma, Frank Hendri Jacobs
  • Patent number: 9748678
    Abstract: A circuit assembly includes one or more electrical conductors. Each of the electrical conductors has a first axial end and a second axial end; the first axial end is disposed opposite the second axial end. The assembly further comprises a non-electrically conductive retainer component operable to: i) retain the electrical conductor and ii) contact a lateral side and/or tip of the electrical conductor onto a conductive pad of a circuit board. The retainer component exerts an appropriate force with respect to the one or more electrical conductors such that, a respective lateral side and/or tip of each of the electrical conductors contact a corresponding electrically conductive pad on the circuit board.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: August 29, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Neil S. Petrarca, Keith St. Pierre
  • Patent number: 9739673
    Abstract: In an embodiment, a sensor substrate includes a first end, a second end, and a body. The body contains provisions for accommodating one or more sense elements. The first end and the second end contain attachment points for attaching the sensor substrate to a shaft. In addition, the first end and the second end include curved portions. For a particular end, a spacing of the attachment points and/or a depth of the curved portion may define, in part, a flexibility of the end. This flexibility may be used to control a sensitivity of the sense elements.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: August 22, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Andrew LeGendre, Cory Bousquet, Neil Petrarca
  • Patent number: 9714876
    Abstract: Methods and apparatus for a semiconductor strain gauge pressure sensor. An apparatus includes a sense element configured to be exposed to a pressure environment, the sense element including at least one highly doped semiconductor strain gauge, the highly doped semiconductor strain gauge including a five pad single full Wheatstone bridge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that comprises the sense element, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: July 25, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Shihong Huo, Cory Bousquet, Daniel Goncalves
  • Patent number: 9709461
    Abstract: A multi-function sensor includes a body that includes a sensing circuit disposed on a substrate, the sensing circuit including a pressure sensor and a temperature sensor, the temperature sensor being disposed on a flexible portion of the substrate. A method of fabrication and additional embodiments are disclosed.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: July 18, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Joris Robert Jan Lenferink, Jorke Jellema, Paulus Thomas Johannes Gennissen
  • Patent number: 9709622
    Abstract: A thermal control unit (TCU) for controlling temperature of a device under test (DUT) includes a sealed evaporation chamber disposed therein, the evaporation chamber configured with a refrigerant inlet and a refrigerant outlet; and at least one surface for thermal engagement of the device under test and configured to conduct heat to the evaporation chamber. A test system and a computer program product are disclosed.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: July 18, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Christopher A. Lopez, Thomas F. Lemczyk, Rick A. Davis
  • Patent number: 9664705
    Abstract: In an embodiment, a speed sensor includes a first portion, a second portion, and a third portion. The first portion includes a sensing assembly for generating a signal associated with a movement of an object external to the speed sensor. The second portion includes a wiring harness for transferring the generated signal to a device external to the speed sensor. The first portion and the second portion are joined. The third portion is over-molded over a point of the speed sensor where the first portion joins the second portion. Over-molding the third portion at the point may act to seal the point from outside contaminants. Moreover, over-molding the third portion at the point may act to strengthen the speed sensor at the point.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: May 30, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Carleton M. Cobb, III, Andrew Amatruda
  • Patent number: 9638559
    Abstract: Featured are systems and methods for measuring differential and absolute pressure of a flowing fluid/gas in a fluid system. In such a method the fluid system is configured with first and second pressure taps that are spaced from each so the second pressure tap is downstream of the first pressure tap in a direction of flow. An absolute pressure sense element and a differential pressure sense element are provided, where the absolute pressure sense element is first fluidly coupled to one of the first or second pressure tap to measure an absolute pressure representative of the flowing fluid/gas. The differential pressure sense element is second fluidly coupled to each of the first and second pressure taps so as to measure a differential pressure of the flowing fluid/gas between the first and second pressure taps.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: May 2, 2017
    Assignee: Sensata Technologies Inc.
    Inventors: Peter Zummo, Victor Bender
  • Patent number: 9634479
    Abstract: Systems and methods of detecting arcing in a DC power system that can provide improved noise propagation immunity. The system includes at least two current sensors for monitoring at least two current outputs, respectively. The current sensors have reverse polarities, and are configured and arranged in parallel to provide a combined current output signal. The current sensors monitor the respective current outputs, which are provided for monitoring by the current sensors over at least two adjacent conductors. If arcing occurs at a location on a first conductor, then arcing (adjacent conductor crosstalk), having an arc current signature like that of the arcing on the first conductor, can occur at a location on the other adjacent conductor. The system can effectively cancel out such adjacent conductor crosstalk within a photovoltaic (PV) system, thereby improving the capability of an arc fault detection device for detecting arcing at the PV string level.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: April 25, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Jianhong Kang, Christian V. Pellon, Lee Martin, Keith W. Kawate
  • Patent number: 9612294
    Abstract: Disclosed are methods, systems, devices, sensors, and other implementations, including a programmable sensor system that includes a variable voltage source (“VVS”) to receive an external input voltage and provide a variable output voltage from the input voltage, the VVS configured to be controlled to adjust behavior of the VVS, and a programmable sensor coupled to an output of the VVS to receive the variable output voltage. The sensor is configured to be programmed when a programming voltage of at least a predetermined level is provided by the VVS to power the sensor, and to perform regular sensor operations when regular-operation voltage is provided by the VVS to power the sensor. The sensor system further includes a controller to cause controllable adjustment of the VVS to provide the programming voltage for a predetermined period of time to power the sensor so as to cause the sensor to be programmed.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: April 4, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventor: Rene Putinier
  • Patent number: 9594113
    Abstract: Methods and apparatus for a package on package (POP) thermal forcing device. A thermal interposer includes a test probe guide and insulator top, a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor, a test probe, and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC).
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: March 14, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Richard A. Davis, Christopher Lopez
  • Patent number: 9589755
    Abstract: A switch assembly including a housing. An escutcheon portion on the front surface of the housing has a raised platform. A transition ramp extends from the platform to a rest area and a finger area is adjacent the rest area. A perimeter frame encloses the finger area so that the escutcheon portion defines opposing notches aligned with the rest area. A handle has a hub with an axial bore so that a pivot pin insert through the axial bore rotatably couples the handle to the housing. A finger grip extends from the hub. The finger grip has a surface for selectively abutting against the rest area and a textured portion for manual actuation when a finger in inserted into the finger area.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: March 7, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Keith A. Singer, Clifford Buxton
  • Patent number: 9568388
    Abstract: A small form factor Microfused Silicon Strain gage (MSG) sensor incorporates an offset spring and feed-in features. A pressure sensor includes a spring having first and second coiled sections offset by a coiled center section in a middle that is used to make offset contact between two electrical contact pads.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: February 14, 2017
    Assignee: Sensata Technologies, Inc.
    Inventors: Cory Z. Bousquet, June Park
  • Patent number: 9564351
    Abstract: A positioning frame structure for the centering and positioning of an IC is disclosed, in which the positioning frame structure comprises an IC carrier having a first chamber defined therein and an IC positioning magnet disposed in the first chamber of the IC carrier. The positioning frame structure further comprises an IC holder disposed over the IC positioning magnet, and the IC is held on the IC holder, so as to provide centering and positioning of the IC relative to the IC positioning magnet. The present invention can be used to control the centering and positioning of the IC and the positioning magnet on the carrier. The positioning magnet can be made to be larger than the IC. In addition, a large air gap can be obtained so as to facilitate the subsequent operation of the IC. Furthermore, without the operation using adhesive, the technical solution of the present invention saves the cost of operation.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: February 7, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Tianshun Wu, Chengwei Huang, Xiaochi Xu
  • Patent number: 9557237
    Abstract: A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: January 31, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Mark P. McNeal, Douglas B. Strott, Stephen P. Greene
  • Patent number: 9499230
    Abstract: Methods and apparatus for a fixation adapter for a handlebar. An apparatus includes a fixation adapter mounted on a handlebar, the fixation adapter including a body having a pin on a bottom surface to secure the body to the handlebar and a latch on a top surface to fixedly lock to a control unit housing, and the control unit housing slidably mounted to the fixation adapter, the control unit housing including a mounting area for mating to the latch of fixation adapter.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: November 22, 2016
    Assignee: Sensata Technologies, Inc.
    Inventors: Benjamin Russ, Michael Stoffers
  • Patent number: 9500125
    Abstract: Disclosed is a pressure-measuring plug (100) for a combustion engine comprising a hollow plug body (102), a housing (110) attached to a distal end (102D) of the plug body (102), electronic components (116) arranged in the housing (110) and a sensing module (104) arranged in the hollow plug body and attached to a proximal end (102P) of the hollow plug body (102) The measuring plug further comprises an interconnection module (108) configured to electrically connect the electronic components (116) to the sensing module (104) through the hollow plug body. The interconnection module (108) comprises an elongated support structure (108A) with a first end (108P) provided with first terminals (108C) and a second end (108D) provided with second terminals (108B1), wherein the first terminals (108C) provide an electrical coupling which is flexible in axial direction. The interconnection module provides a reliable connection and could be used for mass production.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: November 22, 2016
    Assignee: Sensata Technologies, Inc.
    Inventors: Serge Groenhuijzen, Johan Te Riet, Jan-Willem Sloetjes
  • Patent number: 9502885
    Abstract: Systems and methods of detecting arcing in DC power systems that can differentiate between DC arcs and load-switching noise. The systems and methods can determine, within a plurality of predetermined time intervals, at least the pulse count (PC) per predetermined time interval, and the pulse duration (PD) per predetermined time interval, in which the PC and the PD can correspond to the number and the intensity of potential arcing events in a DC power system, respectively. The systems and methods can process the PC and PD using one or more arc fault detection algorithms, thereby differentiating between DC arcs and load-switching noise with increased reliability.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 22, 2016
    Assignee: Sensata Technologies, Inc.
    Inventors: Lee Martin, Jianhong Kang, Christian V. Pellon, Keith W. Kawate
  • Patent number: 9470594
    Abstract: A differential capacitive pressure sensor of an embodiment of the present invention has first and second diaphragms positioned on opposing sides of a single substrate. Each diaphragm of the pressure transducer is configured to be exposed to a transient fluid, with the first and second pressure transducers being arranged with their respective deflection surfaces directed outwardly from each other. The differential capacitive pressure sensor may be configured to output representations of differential and common mode pressure of the transient fluids, where a representation of a common mode is cancelled in generating the representation of the differential pressure. The transient fluids may be the same fluid at different locations within a flow path. The diaphragms may be constructed from a ceramic material to be able to withstand exposure to corrosive or caustic fluids.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: October 18, 2016
    Assignee: Sensata Technologies, Inc.
    Inventors: William D. Cornwell, Mark L. Urban, Marcos A. Nassar
  • Patent number: D777117
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: January 24, 2017
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Keith A. Singer, Clifford Buxton