Patents Assigned to Sensata Technologies, Inc.
  • Patent number: 8707774
    Abstract: Techniques disclosed herein include systems and methods for sensor systems for measuring pressure in an exhaust conduit of a combustion engine. The sensor system includes an electronics module assembly and a housing assembly for housing the electronics module assembly. The electronics module assembly can include several components such as sensing element carrier element with a sensing element, an electronics module carrier element carrying electronic components. Electrical connections can be provided between the electronic module carrier element and the sensing element carrier element. Another component includes a main carrier element for supporting the sensing element carrier element and the electronic module carrier element.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: April 29, 2014
    Assignee: Sensata Technologies, Inc.
    Inventors: Erik Eduard Krommenhoek, Frank Gerald Daniel Morsink, Arnout Gerbrand van den Bos, David J. DiPaola
  • Patent number: 8710386
    Abstract: A pressure responsive electric switch is described having an elongated base containing an electrical switch and terminals. The base is attached to a sensor assembly which actuates and de-actuates the electric switch in response to pressure to be measured. The sensor assembly has a composite actuator member comprising a plurality of stacked snap-acting disc members which includes at least one snap-acting disc member of a chosen low coefficient of thermal expansion and at least one snap-acting disc member of chosen high coefficient of thermal expansion material so as to provide precise pressure activation/deactivation points over a wide temperature range. In a second embodiment, the composite actuator member includes a thermal adjustment member.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: April 29, 2014
    Assignee: Sensata Technologies, Inc.
    Inventors: Peter J. Tavilla, Richard T. Gordon, Adam M. Haag, Bryan J. Dague
  • Publication number: 20140076057
    Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a MEMS die for pressure measurement. The MEMS die is attached to a glass pedestal member. The pedestal member is mechanically held in place via a mounting frame that attachable to a pressure port of a fluid-containing enclosure. Techniques herein provide a strong connection of a MEMS die to a pressure sensor while decoupling thermal expansion stress from the MEMS die. With such decoupling techniques, pressure sensing reliability and accuracy can be improved. With thermal expansion stress decoupled from the MEMS die, sensor sealing materials can be selected for their robust chemical properties instead of structural properties. Such techniques provide an accurate, durable, and cost-effective pressure sensor.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: SENSATA TECHNOLOGIES, INC.
    Inventors: Rob Slakhorst, Gerard Klaasse, Erik Hop, Arnout van den Bos, Wico Hopman
  • Publication number: 20140076059
    Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a microelectromechanical system (MEMS) sensor for pressure measurement. The MEMS sensor is attached to a glass tube which is compressively sealed to a mounting frame that is attachable to a pressure port of a fluid-containing enclosure. Techniques disclosed herein provide an hermetic seal between the tube and the mounting frame and a rigid seal between the MEMS sensor to a pressure sensor while decoupling thermal expansion stress from the MEMS sensor. With such decoupling techniques, pressure sensing reliability and accuracy can be improved because thermal expansion stress is decoupled from the MEMS sensor. Such techniques provide an accurate, durable, and cost-effective pressure sensor.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: SENSATA TECHNOLOGIES, INC.
    Inventors: Erik Hop, Gerard Klaasse, Rob Slakhorst, Wico Hopman, Arnout van den Bos
  • Patent number: 8499642
    Abstract: The invention relates to a fluid pressure sensing device comprising a pressure sensing transducer having a support structure and a diaphragm attached to said support structure, the diaphragm having a fluid facing side. A housing has a transducer receiving cavity defined by a bottom wall and a housing sidewall extending upwardly from the bottom wall. The bottom wall is formed with a fluid pressure receiving recess. A fluid pressure port is formed in the housing in communication with the recess. The diaphragm is positioned between the support structure and the fluid pressure receiving recess and a seal material around a support structure sidewall fixes the pressure sensing transducer in the housing and provides a hermetic seal.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: August 6, 2013
    Assignee: Sensata Technologies, Inc.
    Inventors: Wico Hopman, Robert Zwijze, Paul Gennissen, Maarten van Noorden, George van der Donk, Jans Kruise
  • Publication number: 20130153379
    Abstract: Techniques disclosed herein include a conversion technique that converts an aircraft circuit breaker having male auxiliary connectors (micro switch connectors) to an aircraft circuit breaker having female auxiliary connectors, such as those conventionally used on European-made aircraft. Techniques include adding a barrier to a conventional aircraft circuit breaker approved for U.S. markets. This barrier includes female auxiliary connectors integrated with the barrier, as well as a flexible circuit that connects the male connectors with the female connectors such that the female connectors can still receive separate male connectors in the female receptacles. Such a technique converts conventional aircraft circuit breakers into a European-style breaker without requiring a full European rebuild and re-qualification. Embodiments can include single and multiple phase versions, and configurations for use with high and low amperage.
    Type: Application
    Filed: December 14, 2011
    Publication date: June 20, 2013
    Applicant: SENSATA TECHNOLOGIES, INC.
    Inventors: Keith Richard Washburn, Stephen J. Bryant, William John Bentley
  • Publication number: 20130140417
    Abstract: Techniques disclosed herein include a mounting clip for use with large body thermal switches, which have can a length substantially longer than a diameter of refrigeration tubing. The mounting clip snaps onto the thermal switch, and then snaps or locks onto the refrigeration tubing as well. Embodiments can include a one-piece or two-piece mounting clip that removable presses and holds the thermal switch against a refrigeration tube by encompassing both the refrigeration tube and the thermal switch. The mounting clip can be sized small enough to fit within relatively small space constraints of evaporator units.
    Type: Application
    Filed: December 2, 2011
    Publication date: June 6, 2013
    Applicant: SENSATA TECHNOLOGIES, INC.
    Inventors: Alan Gerard Amore, Bryan Dague
  • Patent number: 8429956
    Abstract: A piezoresistive pressure-measuring plug for a combustion engine. The pressure-measuring plug includes a plug body having a threaded plug body part with an external thread for screwing the plug body into a cylinder of the combustion engine, and a sealing plug body part forming a tip of the plug for providing a seal between the plug body and the combustion engine. The plug body further includes a sensing body part positioned between the threaded plug body part and the sealing plug body part. The sensing body part includes a cylindrical body part, a moving part, and a sensing structure that form a single integral piece. The sensing structure forms a connection between the cylindrical body part and the moving part, and allows the moving part to move relatively to the cylindrical body part along a cylinder axis of the cylindrical body part.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: April 30, 2013
    Assignee: Sensata Technologies, Inc.
    Inventors: Marc Gerard Johan Borgers, Serge Groenhuijzen, Cristobal Ruiz Zwollo, Jan-Willem Sloetjes
  • Patent number: 8365607
    Abstract: According to one configuration, a base component of a pressure sensor assembly includes a hollowed volume (e.g., chamber, bore, space, etc.) in which to house components such as a pressure sensor element and pressure sensor circuitry. Opposite an opening to the hollowed volume, the base component further includes a port through which to receive a fluid. An inside wall of the first end of the metallic base component includes grooves. The grooves can be created on the inner wall based on a metalworking operation known as broaching. To produce the pressure sensor assembly, at least a portion of the first end of the metallic base component including the grooves is crimped inward to fixedly couple a connector component to the metallic base component and retain the pressure sensor electronics and pressure sensor circuitry within the hollowed volume.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: February 5, 2013
    Assignee: Sensata Technologies, Inc.
    Inventors: Stephen E. Mitchell, Juan P. Sanchez
  • Publication number: 20120293165
    Abstract: Magnetic proximity sensor, comprising a magnetic sensor element, and a magnet assembly having a first pole surface and a second pole surface, wherein the first pole surface of the magnet assembly is positioned adjacent to a sensor target surface of the magnetic proximity sensor, and the sensor element is positioned at a first distance from the second pole surface of the magnet assembly remote from the sensor target surface.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 22, 2012
    Applicant: Sensata Technologies, Inc.
    Inventors: Albert Ferdinand Zwijze, Dale Reed Sogge
  • Patent number: 8297115
    Abstract: A piezoresistive pressure-measuring plug for a combustion engine for measuring a pressure. The piezoresistive pressure-measuring plug: includes a plug body for insertion into a cylinder of the combustion engine, a rod that is arranged in the plug body, a sensing structure comprising a piezoresistive element, that is arranged between the rod and the plug body such that the sensing structure is acted upon, when in use, by the pressure prevailing in the combustion chamber of the cylinder. The sensing structure is arranged in the plug body and, when in use, is compressed in an axial direction by the force applied to the sensing structure and a piezoresistive element mounted on the sensing structure. A PWB is also arranged in the plug body. Such a pressure-measuring plug provides improved bandwidth and reduced build-in height.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: October 30, 2012
    Assignee: Sensata Technologies, Inc.
    Inventors: Marc Gerard Johan Borgers, Cris Ruiz Zwollo, Robert Zwijze, Paulus Thomas Johannes Gennissen, Tim Tiek, Huub Toneman, Serge Groenhuijzen
  • Patent number: 8256300
    Abstract: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: September 4, 2012
    Assignee: Sensata Technologies, Inc.
    Inventors: Andrew F. Willner, Louis Tomasso, Giovanni Fraone, Prasanth Ambady
  • Patent number: 8156816
    Abstract: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: April 17, 2012
    Assignee: Sensata Technologies, Inc.
    Inventors: Andrew F. Willner, Giovanni Fraone, Prasanth Ambady, Lauren Snedeker
  • Patent number: 8129624
    Abstract: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: March 6, 2012
    Assignee: Sensata Technologies, Inc.
    Inventors: Andrew F. Willner, Lauren Snedeker, Brian Wilkie, Gifford Plume, Prasanth Ambady
  • Patent number: 7992441
    Abstract: A pressure sensor module is disclosed. The pressure sensor module comprises a sensing element (1) mounted on a front side (3) of a support member (5). The support member (5) comprises a hole (7) through the support member (5) from the front side (3) to a back side (9). The sensing element (1) covers the hole (7) at the front side (3). A back side barrier (6) provided at the back side (9) of the support member (5) surrounds a surface of the back side (9) of the support member (5) and forms an enclosed area (8), wherein the enclosed area (8) and the hole (7) form a pressure channel (10). A back side protective member (2) fills the hole (7) and at least partially the enclosed area (8). The support member (5), back side barrier (6) and back side protective member (2) form a module that can be placed during production of the pressure sensor in a housing of the pressure sensor.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: August 9, 2011
    Assignee: Sensata Technologies, Inc.
    Inventors: Sean P. Mulligan, Frank Morsink, Jun Bae, Gerald Spijksma, Tom te Boekhorst
  • Patent number: 7939772
    Abstract: A linear vehicle transmission switch (10) has first and second interfitting housing members (12, 14) each having an electrically conductive lead frame (12m) insert molded in electrically insulative material and formed with exposed segments (12f) of lead frame material along linear tracks. An elongated actuator (16) is slidably received in a channel of one of the housing members and is disposed along a side of the tracks. A paddle (16b) extends transversely across the tracks. Ribs are disposed between tracks and dimensioned to limit rotational movement of the paddle. A pair of stabilized contact switches is disposed on the paddle for each track. The housing members have a selected camber to lower the force required to move the actuator. The lead frames are plated to reduce contact resistance and improve wear.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: May 10, 2011
    Assignee: Sensata Technologies, Inc.
    Inventors: David J. DiPaola, George P. Krajewski, Bonnie L. Moore, Denis J. Villiard
  • Patent number: 7779701
    Abstract: A high pressure, miniature pressure sensor has a cup-shaped housing having an open end closed by a metal substrate. A raised stress isolation pedestal portion is formed on the substrate that receives a stress isolation glass pedestal element and in turn a silicon pressure sense element, all having closely matched CTEs to minimize temperature induced stresses. A fluid passageway is formed through the substrate and glass pedestal and an O-ring is placed around the passageway on the lower side of the substrate. A flexible circuit having a slit tail formed with two lobes for receipt respectively in the housing and on the substrate allows easy access of a solder iron during assembly. Mounting flanges extend from the substrate to facilitate mounting of sensor and minimize transfer of mounting stresses to the sense element.
    Type: Grant
    Filed: May 27, 2009
    Date of Patent: August 24, 2010
    Assignee: Sensata Technologies, Inc.
    Inventors: David J. DiPaolo, Jeffrey P. Silveria
  • Patent number: 7762140
    Abstract: A combined fluid pressure transducer and temperature sensor (10) has a housing (12) containing a variable capacitor (14) having a rigid substrate (14a) and attached flexible diaphragm (14b) in sealed, spaced apart relation. The capacitor is mounted in the housing so that the outer face surface of the diaphragm is exposed to a fluid pressure chamber (12k). A temperature responsive sensor element (28) is disposed on the outer face surface of the diaphragm and covered by a thin protective layer. A fluid flow diffuser (30) is disposed in the fluid pressure port (12b) for directing fluid flow across the temperature sensor.
    Type: Grant
    Filed: December 11, 2008
    Date of Patent: July 27, 2010
    Assignee: Sensata Technologies, Inc.
    Inventors: Jared E. Girroir, Nicholas Moelders
  • Patent number: 7601008
    Abstract: A socket adaptor 10 made of an electrically insulating material has a main adaptor body 12 on which a plurality of through holes 14 containing an upper opening and a lower opening has been formed. In certain preferred embodiments a probe pin 60 and coil spring 62 is placed in each through hole 14. An electrical engagement clipping part 68 for clipping a contact inserted in a respective through hole from said upper opening is formed on the upper end of each probe pin 60. The coil spring 62 is installed on each probe pin and biases the respective probe pin toward a position so that a tip formed on the lower end of the probe pin protrudes from the lower opening.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: October 13, 2009
    Assignee: Sensata Technologies, Inc.
    Inventors: Hideyuki Takahashi, Kiyokazu Ikeya
  • Patent number: 7592819
    Abstract: An improved system and method of performing capacitance measurements that provides a fast digital response and a reduced output error. The capacitance measurement system includes a circuit configuration that has a variable capacitor and at least one reference capacitor connected to one another at a common node, which in turn is connected to the input of an analog-to-digital converter. The circuit configuration further includes an array of switches coupled between the variable and reference capacitors and the supply voltage, a reference voltage, and ground, respectively. The switched variable and reference capacitors are employed in conjunction with the A-to-D converter to perform, at the common node, a plurality of direct voltage measurements for use in generating an expression defining the capacitance of the variable capacitor.
    Type: Grant
    Filed: February 23, 2007
    Date of Patent: September 22, 2009
    Assignee: Sensata Technologies, Inc.
    Inventors: Keith W. Kawate, John A. Powning, Mark Genovese, Eric M. Visser