Patents Assigned to Sensata Technologies, Inc.
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Publication number: 20180231429Abstract: A dual range sensor apparatus includes a single pressure transducer element coupled to respective inputs of two discrete signal conditioning modules, or to both inputs of a multiple input signal conditioning module that is configured to condition the output signal of two transducer elements. The disclosed sensor apparatus outputs a pressure signal in a limited pressure range with very high accuracy, and also provides a pressure signal in a wider pressure range with the same accuracy that can be achieved with traditional pressure sensor configurations. The sensor apparatus may provide output on a single output node in a multiplexed output signal format. The multiplexed output signal format may include several digital output formats and may be provided on a single output pin of the sensor apparatus.Type: ApplicationFiled: February 16, 2017Publication date: August 16, 2018Applicant: Sensata Technologies, Inc.Inventors: Erik Krommenhoek, Arnout van den Bos
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Patent number: 9979279Abstract: In electrical systems with DC-DC converters having synchronous rectification (SR) on the output stage, the input voltage can be monitored. When a potentially destructive transient occurs, the SR is rapidly turned on in a non-synchronous manner to “crowbar” the main power transformer. The resulting short circuit is reflected back to the DC input under current-limited pulse width modulation (PWM) control. In effect, the entire surge rating of the power train is applied to the potentially destructive input transient. The clamping capacity can be controlled accurately and is significantly more than what is available in prior art components and systems. When the input voltage is pulled down to safe levels, the clamp circuit disengages and the DC-DC converter returns to normal operation. DC output voltage regulation to the connected load is not maintained during this clamping event, but maintaining output voltage regulation during such destructive transients is not required.Type: GrantFiled: June 1, 2016Date of Patent: May 22, 2018Assignee: Sensata Technologies, Inc.Inventors: Kirk Randall Soldner, Gary Neil Johnson
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Patent number: 9978551Abstract: A circuit breaker having a first micro switch, a second micro switch and a transmission mechanism. The transmission mechanism drives the first micro switch and the second micro switch, which are arranged in a circuit breaker shell. The first micro switch and the second micro switch are arranged on one side of the shell side by side, and a corresponding first transmission rod and a corresponding second transmission rod in the transmission mechanism respectively drive the first micro switch and the second micro switch. Since the circuit breaker is provided with no external device, the space occupied by the circuit breaker is reduced, thereby facilitating construction and installation. Since the two micro switches are built-in side by side, different signals can be simultaneously output.Type: GrantFiled: November 15, 2016Date of Patent: May 22, 2018Assignee: Sensata Technologies, Inc.Inventors: Jian Chen, Jianjun Fu, Wei Zhou
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Patent number: 9921265Abstract: Featured are devices, systems and methods for testing an electronic device, such as an integrated chip. Such a testing method includes disposing a thermal clutch between a variable heat sink that absorbs heat energy and a heat source member that selectively delivers heat energy. When the thermal clutch is operated in a first manner the thermal clutch thermally couples the variable heat sink to the electronic device under test (DUT) and when operated in the second manner, the thermal clutch thermally de-couples the variable heat sink from the DUT. Also, when the thermal clutch is operated in the second manner, the heat source member is thermally coupled to the DUT and is operated so as to produce heat energy which is thus provided to the thermally coupled DUT.Type: GrantFiled: December 18, 2015Date of Patent: March 20, 2018Assignee: Sensata Technologies, Inc.Inventors: Christopher A. Lopez, Rick A. Davis
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Publication number: 20180073950Abstract: A combined pressure and temperature sensing device includes a sensor port geometry that provides improved contact between a fluid media being measured and a thermistor cavity of the sensor port. The increased contact area provides improved response time and accuracy compared to previously known integrated pressure-temperature sensors. A temperature sensor element is offset from a pressure sensor element relative to a central axis of the temperature-pressure sensor body/package to facilitate substantially increasing a pressures sensor cavity volume without increasing the overall sensor port diameter. A wire-bondable thermistor support portion facilitates high volume automated production line. The temperature sensing element may be resistance welded to the thermistor support portion in a parallel manufacturing process.Type: ApplicationFiled: September 14, 2016Publication date: March 15, 2018Applicant: Sensata Technologies, Inc.Inventors: Jun H. Bae, Nikhil B. Lal, Guanshi Li, Shuo Robert Chen, Mark W. McBrine
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Patent number: 9915577Abstract: An oil filled pressure sensor is provided. The sensor includes a drift-stabilized pressure sensing element mounted to and electrically isolated from a header body, the pressure sensing element immersed in an oil filled cavity and temperature stabilized for sensing pressure in the cavity without substantial signal drift. A method of fabrication is provided.Type: GrantFiled: December 2, 2014Date of Patent: March 13, 2018Assignee: Sensata Technologies, Inc.Inventors: Douglas B. Strott, Russell P. Brodeur, Keith R. Washburn
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Patent number: 9909947Abstract: In an embodiment, a pressure sensor includes a tip secured to a port. The tip includes an opening for receiving pressure to be measured by the pressure sensor. The port includes a threaded section for mounting the pressure sensor in a fixture such as, for example, a rail. The port also includes a flexible section, a cavity, and an opening. The opening in the tip receives pressure from an outside source and channels the pressure to the opening of the port. The opening of the port receives the pressure from the tip and channels the pressure to the cavity. The pressure received in the cavity applies a force to the flexible section which flexes in response to the force. Moreover, forces are provided by the tip and the threaded section to keep the tip secured to the port.Type: GrantFiled: November 13, 2015Date of Patent: March 6, 2018Assignee: Sensata Technologies, Inc.Inventors: Calvin S. Reuter, Ernie Schoot Uiterkamp, Daniel Goncalves, Andrew Willner, Mark McBrine, Prasanth Ambady
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Patent number: 9903777Abstract: In an embodiment, a pressure transducer includes a first portion, a second portion, and a third portion. The third portion is positioned in a cavity contained in the second portion. In addition, a seal is placed in the cavity. The first portion and second include provisions for applying a downward pressure on the third portion when the first portion and the second portion are joined. The downward pressure is applied by the third portion to the seal the cavity. The first portion also includes a stop and the second portion also includes a snap member. The snap member includes a prong that contains a first edge and a second edge. The snap member allows movement of the first portion after the first edge of the prong meets the stop and restricts movement of the first portion after the second edge of the prong meets the stop.Type: GrantFiled: February 18, 2016Date of Patent: February 27, 2018Assignee: SENSATA TECHNOLOGIES, INC.Inventors: Michael J. Lavado, Amin Younes, Stephanie Altrui, Christian Pellon, Timothy Janek
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Patent number: 9875834Abstract: A flexible printed circuit may include a flexible body portion and a flexible head end portion, where conductors and/or elongated cut outs may be formed in a pattern. The flexible body may include a proximal end and a distal end, wherein the proximal end is configured to be connected to a stationary object and the distal end is configured to be connected to a moving object that moves in relation to the stationary object. The head end of the flexible printed circuit may be located at the distal end of the flexible body. The head end may include a plurality of elongated cut-outs, and/or a plurality of electrical connection pads suspended from the flexible body by the plurality of elongated cutouts.Type: GrantFiled: June 16, 2016Date of Patent: January 23, 2018Assignee: Sensata Technologies, Inc.Inventors: Janselme M. Eral, Richard R. Guerrero
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Patent number: 9857260Abstract: In an embodiment, a pressure transducer includes a first portion, a second portion, and a third portion. The third portion is positioned in a cavity contained in the second portion. In addition, a seal is placed in the cavity. The first portion and second include provisions for applying a downward pressure on the third portion when the first portion and the second portion are joined. The downward pressure is applied by the third portion to the seal to seal the cavity.Type: GrantFiled: April 23, 2015Date of Patent: January 2, 2018Assignee: SENSATA TECHNOLOGIES, INC.Inventors: Michael J. Lavado, Mark C. Carlos, Jan klein Bluemink
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Patent number: 9857397Abstract: Modular packaging includes a solid state relay and a function module, wherein the function module comprises a housing containing a printed circuit board and an elevating screw. The elevating screw comprises a first end with an external threading and a second end with an external threading, where the elevating screw may be selectively altered between a first position and a second position within the housing. Related embodiments are disclosed.Type: GrantFiled: April 7, 2016Date of Patent: January 2, 2018Assignee: Sensata Technologies, Inc.Inventors: Oscar Rivera Hernandez, Mariela Reynoso Castillo, Ismael Favela Duran
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Patent number: 9746390Abstract: Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.Type: GrantFiled: February 26, 2015Date of Patent: August 29, 2017Assignee: SENSATA TECHNOLOGIES, INC.Inventors: Ernie Johannus Antonius Schoot Uiterkamp, Dedde Hedzer Wiersma, Frank Hendri Jacobs
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Patent number: 9748678Abstract: A circuit assembly includes one or more electrical conductors. Each of the electrical conductors has a first axial end and a second axial end; the first axial end is disposed opposite the second axial end. The assembly further comprises a non-electrically conductive retainer component operable to: i) retain the electrical conductor and ii) contact a lateral side and/or tip of the electrical conductor onto a conductive pad of a circuit board. The retainer component exerts an appropriate force with respect to the one or more electrical conductors such that, a respective lateral side and/or tip of each of the electrical conductors contact a corresponding electrically conductive pad on the circuit board.Type: GrantFiled: March 31, 2015Date of Patent: August 29, 2017Assignee: Sensata Technologies, Inc.Inventors: Neil S. Petrarca, Keith St. Pierre
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Patent number: 9739673Abstract: In an embodiment, a sensor substrate includes a first end, a second end, and a body. The body contains provisions for accommodating one or more sense elements. The first end and the second end contain attachment points for attaching the sensor substrate to a shaft. In addition, the first end and the second end include curved portions. For a particular end, a spacing of the attachment points and/or a depth of the curved portion may define, in part, a flexibility of the end. This flexibility may be used to control a sensitivity of the sense elements.Type: GrantFiled: August 5, 2015Date of Patent: August 22, 2017Assignee: Sensata Technologies, Inc.Inventors: Andrew LeGendre, Cory Bousquet, Neil Petrarca
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Patent number: 9714876Abstract: Methods and apparatus for a semiconductor strain gauge pressure sensor. An apparatus includes a sense element configured to be exposed to a pressure environment, the sense element including at least one highly doped semiconductor strain gauge, the highly doped semiconductor strain gauge including a five pad single full Wheatstone bridge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that comprises the sense element, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.Type: GrantFiled: March 26, 2015Date of Patent: July 25, 2017Assignee: Sensata Technologies, Inc.Inventors: Shihong Huo, Cory Bousquet, Daniel Goncalves
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Patent number: 9709622Abstract: A thermal control unit (TCU) for controlling temperature of a device under test (DUT) includes a sealed evaporation chamber disposed therein, the evaporation chamber configured with a refrigerant inlet and a refrigerant outlet; and at least one surface for thermal engagement of the device under test and configured to conduct heat to the evaporation chamber. A test system and a computer program product are disclosed.Type: GrantFiled: March 13, 2014Date of Patent: July 18, 2017Assignee: Sensata Technologies, Inc.Inventors: Christopher A. Lopez, Thomas F. Lemczyk, Rick A. Davis
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Patent number: 9709461Abstract: A multi-function sensor includes a body that includes a sensing circuit disposed on a substrate, the sensing circuit including a pressure sensor and a temperature sensor, the temperature sensor being disposed on a flexible portion of the substrate. A method of fabrication and additional embodiments are disclosed.Type: GrantFiled: November 30, 2012Date of Patent: July 18, 2017Assignee: Sensata Technologies, Inc.Inventors: Joris Robert Jan Lenferink, Jorke Jellema, Paulus Thomas Johannes Gennissen
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Patent number: 9664705Abstract: In an embodiment, a speed sensor includes a first portion, a second portion, and a third portion. The first portion includes a sensing assembly for generating a signal associated with a movement of an object external to the speed sensor. The second portion includes a wiring harness for transferring the generated signal to a device external to the speed sensor. The first portion and the second portion are joined. The third portion is over-molded over a point of the speed sensor where the first portion joins the second portion. Over-molding the third portion at the point may act to seal the point from outside contaminants. Moreover, over-molding the third portion at the point may act to strengthen the speed sensor at the point.Type: GrantFiled: January 28, 2015Date of Patent: May 30, 2017Assignee: SENSATA TECHNOLOGIES, INC.Inventors: Carleton M. Cobb, III, Andrew Amatruda
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Patent number: 9638559Abstract: Featured are systems and methods for measuring differential and absolute pressure of a flowing fluid/gas in a fluid system. In such a method the fluid system is configured with first and second pressure taps that are spaced from each so the second pressure tap is downstream of the first pressure tap in a direction of flow. An absolute pressure sense element and a differential pressure sense element are provided, where the absolute pressure sense element is first fluidly coupled to one of the first or second pressure tap to measure an absolute pressure representative of the flowing fluid/gas. The differential pressure sense element is second fluidly coupled to each of the first and second pressure taps so as to measure a differential pressure of the flowing fluid/gas between the first and second pressure taps.Type: GrantFiled: February 10, 2016Date of Patent: May 2, 2017Assignee: Sensata Technologies Inc.Inventors: Peter Zummo, Victor Bender
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Patent number: 9634479Abstract: Systems and methods of detecting arcing in a DC power system that can provide improved noise propagation immunity. The system includes at least two current sensors for monitoring at least two current outputs, respectively. The current sensors have reverse polarities, and are configured and arranged in parallel to provide a combined current output signal. The current sensors monitor the respective current outputs, which are provided for monitoring by the current sensors over at least two adjacent conductors. If arcing occurs at a location on a first conductor, then arcing (adjacent conductor crosstalk), having an arc current signature like that of the arcing on the first conductor, can occur at a location on the other adjacent conductor. The system can effectively cancel out such adjacent conductor crosstalk within a photovoltaic (PV) system, thereby improving the capability of an arc fault detection device for detecting arcing at the PV string level.Type: GrantFiled: December 23, 2013Date of Patent: April 25, 2017Assignee: SENSATA TECHNOLOGIES, INC.Inventors: Jianhong Kang, Christian V. Pellon, Lee Martin, Keith W. Kawate