Abstract: The disclosure relates to a sensor for detecting and/or analysing a gas. The sensor comprises a substrate, a recess or opening arranged in the substrate, a first bridge structure and a second bridge structure. The first bridge structure and the second bridge structure extend over said recess or opening and are anchored in the substrate. The first bridge structure forms a first hotplate and comprises a first patch of sensing material, in particular of a metal oxide material, arranged on the first hotplate, electrodes adapted to measure an electrical property of the first patch and a heater adapted to heat the first hotplate. The second bridge structure comprises a temperature sensor. The sensor comprises circuitry for driving the heater and for processing signals from the electrodes and the temperature sensor.

Abstract: Method of operating a flow sensor device (10) with a first sensor arrangement (11) for measuring a flow (F) of a fluid (g) and a further first fluid property (p1), and with a second sensor arrangement (12) for measuring a further second fluid property (p2); said method comprising the steps of operating said flow sensor device (10) for determining said further first fluid property (p1) by means of said first sensor arrangement (11), operating said flow sensor device (10) for determining said further second fluid property (p2) by means of said second sensor arrangement (12), comparing said further first fluid property (p1) and further second fluid property (p2) and producing a comparison result (R), and monitoring said comparison result and producing a fault signal (FS) in case of a fault state. The present invention relates to such a sensor device.

Abstract: A gas sensor module integrated onto a board comprising at least one radiation source configured for emitting radiation, at least one radiation detector unit configured to detect at least part of said radiation, and a radiation cell providing at least one radiation path from said radiation source to said radiation detector unit. Said board is provided with a recess and said radiation path is propagating within said recess.

Abstract: A sensor module comprises a master sensor unit for sensing a first environmental parameter, a slave sensor unit for sensing a second environmental parameter, a common substrate on which the master sensor unit and the slave sensor unit are mounted, and a digital bus interface for a communication between the master sensor unit and the slave sensor unit. The master sensor unit comprises a non-volatile memory for storing calibration data and configuration data of the master sensor unit and the slave sensor unit. The master sensor unit is embodied as a first chip, and the slave sensor unit is embodied as a second chip. Such sensor module is compact, robust and versatile.

Abstract: A method for processing a signal supplied by a sensor comprises receiving the sensed signal, and compensating the sensed signal for a contribution caused by one or more components thermally coupled to the sensor. The compensated signal in its dynamics, and the dynamics adjusted compensated sensor signal is provided.

Abstract: Some embodiments include an electrochemical sensor. The electrochemical sensor has a lid element comprising a substrate, multiple electrodes, multiple interior contacts electrically coupled to the multiple electrodes, a base element configured to be coupled to the lid element, and an electrolyte element. The base element includes a sensor cavity, multiple exterior contacts located at an exterior surface of the base element, and multiple signal communication channels comprising multiple signal communication lines, and the electrolyte element is located in the sensor cavity. When the lid element is coupled to the base element, the multiple electrodes are located in the sensor cavity, the multiple electrodes are in electrolytic communication with the electrolyte element, the multiple interior contacts are located in the sensor cavity, and the multiple interior contacts are electrically coupled to the multiple exterior contacts by the multiple signal communication lines.

Abstract: Some embodiments include an electrochemical sensor. The electrochemical sensor has a lid element comprising a substrate, multiple electrodes, multiple interior contacts electrically coupled to the multiple electrodes, a base element configured to be coupled to the lid element, and an electrolyte element. The base element includes a sensor cavity, multiple exterior contacts located at an exterior surface of the base element, and multiple signal communication channels comprising multiple signal communication lines, and the electrolyte element is located in the sensor cavity. When the lid element is coupled to the base element, the multiple electrodes are located in the sensor cavity, the multiple electrodes are in electrolytic communication with the electrolyte element, the multiple interior contacts are located in the sensor cavity, and the multiple interior contacts are electrically coupled to the multiple exterior contacts by the multiple signal communication lines.

Abstract: A particulate matter sensor device comprises an enclosure (21) defining a flow channel (2), a radiation source (3) for emitting radiation into the flow channel for interaction of the radiation with particulate matter in an aerosol sample in the flow channel, and a radiation detector (4) for detecting at least part of said radiation after interaction with the particulate matter. The sensor device comprises a flow modifying device (511) arranged upstream of the radiation detector and/or radiation source so as to reduce particulate matter precipitation onto the radiation detector, the radiation source and/or the channel wall sections in their proximity. The invention also relates to a method of determining parameters of particulate matter in an aerosol sample by using such a particulate matter sensor device.

Abstract: The invention relates to a sensor module (1), comprising: a circuit board (2), at least one temperature sensor (3) arranged on the circuit board (2) for measuring an ambient temperature, at least one further sensor (4) arranged on the circuit board (2), which further sensor (4) generates waste heat when the further sensor (4) is operated. According to the invention, the sensor module (1) is designed for thermal decoupling of the temperature sensor (3) from the further sensor (4) and/or for dissipating the waste heat of the further sensor (4).

Abstract: An infrared device comprises a substrate. A configuration for emitting infrared radiation is supported by the substrate. The configuration comprises an electrically conducting layer arrangement of less than 50 nm thickness between dielectric layers. In addition, a heater arranged for heating the configuration to emit the infrared radiation is supported by the substrate.

Abstract: A sensor chip comprises a sensing element providing a sensor signal, an on-chip memory, a configuration of a look up table of dimension N stored in the on-chip memory for assigning an output value to a combination of N input values, and a look up table engine for determining a corresponding output value in response to receiving a memory address for the look up table configuration and in response to receiving a sensor value derived from the sensor signal as one of the N input values.

Abstract: A thermal sensor comprises an active element (41), e.g., a heater or cooler, at least one temperature sensor (31), and processing circuitry (50). The processing circuitry causes a change of power supplied to the active element (41). It then determines, at a plurality of times, a thermal parameter based on an output signal of the temperature sensors and analyzes the transient behavior of the thermal parameter. Based on this analysis, the processing circuitry determines a contamination signal that is indicative of a contamination on a sensing surface of the thermal sensor. If the thermal sensor comprises a plurality of temperature sensors arranged in different sectors of the sensing surface, a multi-sector thermal signal can be derived from the outputs of the sensors, and determination of the contamination signal can be based on the multi-sector thermal signal.

Abstract: A sensor package comprises a sensor chip (3) with a sensitive element (31) exposed to an environment of the sensor package, and contact pads (2) for electrically contacting the sensor package. Electrical connections (5) are applied between the sensor chip (3) and the contact pads (2). A molding compound (1) at least partially encloses the sensor chip (3) and the contact pads (2). A unit (3,73) consisting of the sensor chip (3) and optionally of a die pad (73) supporting the sensor chip (3) is arranged such that a top surface (ts) of the unit (3,73) does not protrude from a level defined by a top surface (ts) of the contact pads (2), and a bottom surface (bs) of the unit (3,73) does not protrude from a level defined by a bottom surface (bs) of the contact pads (2).

Abstract: An accessory (40) for an inhaler (10) comprises a fastening structure (42) for fastening the accessory to the inhaler. The accessory has a pressure port (43). When the accessory is fastened to the inhaler, the pressure port is arranged upstream from a mixing zone (33) of the inhaler with respect to an air flow (F1) caused by inhalation by a patient through the inhaler. An electronic sensor (45) is in communication with the pressure port. The electronic sensor is sensitive to a pressure change at the pressure port caused by the air flow.

Abstract: The present invention relate to a pulsation damper for use with a flow sensor adapted to measure a mass flow of a fluid, particularly of a liquid, wherein the pulsation damper is configured to dampen a flow pulsation of the fluid, in case of which the fluid has alternating flow minima and flow maxima, wherein the pulsation damper comprises at least one conduit which extends in an axial direction and comprises a wall which surrounds an interior space of the conduit which is designed for the fluid to pass through, wherein the wall comprises a region extending in the circumferential direction of the wall and configured to be moved by a pressure maximum of the fluid in a direction of the conduit perpendicular to the axial direction from a first position outward to a second position, such that a cross-sectional area of the interior extending perpendicular to the axial direction is enlarged, wherein the cross-sectional area is non-circular when the region of the wall is in the first position.

Abstract: A printed gas sensor is disclosed. The sensor may include a partially porous substrate, an electrode layer, an electrolyte layer, and an encapsulation layer. The electrode layer comprises one or more electrodes that are formed on one side of the porous substrate. The electrolyte layer is in electrolytic contact with the one or more electrodes. The encapsulation layer encapsulates the electrode layer and electrolyte layer thereby forming an integrated structure with the partially porous substrate.

Abstract: The present invention relates to a vacuum cleaner device (1) for operation on a floor area (F), comprising: a suction duct (7) and an actuator (9) arranged and configured to generate an underpressure in the suction duct (7) so that air is sucked into the suction duct (7), a temperature sensor (10) configured to sample an air temperature in the vicinity of the device (1), wherein said temperature sensor (10) is arranged in the suction duct (7) or adjacent an opening (6d) of the suction duct (7), and an analyzing unit (3) configured to detect a wet spot (W) on said floor area (F) using said sampled air temperature.

Abstract: The disclosure relates to a sensor for measuring a gas concentration of a target gas in a sample of ambient air. The sensor comprises a first gas sensitive component comprising a first gas sensitive layer being arranged between a first pair of measuring electrodes, a second gas sensitive component comprising a second gas sensitive layer being arranged between a second pair of measuring electrodes and one or more heating elements to heat the first gas sensitive layer and the second gas sensitive layer. The first gas sensitive layer and the second gas sensitive layer comprise a metal oxide semiconductor. The first gas sensitive component is configured to measure the gas concentration of the target gas in a first concentration band and the second gas sensitive component is configured to measure the gas concentration of the target gas in a second concentration band.

Abstract: A device for processing microorganisms comprises a channel comprising an inlet for introducing a fluid sample into the channel, and an outlet. The channel is dimensioned to hold, between the inlet and the outlet, a volume in a range between 1 nl and 50 ?l of fluid. A size selective filter is arranged at the outlet for retaining microorganisms (M) in the channel. The size selective filter comprises pores of a size smaller than an average size of the microorganisms (M) to be processed.

Abstract: The invention relates to a flow sensor (1), comprising: a semiconductor module (2) on which a temperature sensing means (13a, 13b) and a heat source (12) are arranged, a flow channel (6) for guiding the fluid medium in a flow direction (D), and a wall (W) delimiting the flow channel, wherein said heat source (12) and said temperature sensing means (13a, 13b) are configured such that they are in thermal contact with said wall (W). According to the invention, said wall (W) comprises a glass member (4) and a metal member (3a), wherein the glass member (4) is connected to the metal member (3a).