Abstract: An LED lighting apparatus including a rectifier to rectify AC voltages having different magnitudes and generate driving voltages corresponding to rectified voltages, a buck converter connected to an output terminal of the rectifier and generate an LED driving current corresponding to the driving voltages, a variable reference voltage comparator to receive the driving voltages, and generate variable reference voltages that fluctuate in correspondence to magnitudes of the output driving voltages, compare the driving voltages and the variable reference voltages, and output signals for controlling an operation of the buck converter, an LED including at least one LED group and driven by the LED driving current generated by the buck converter, and a controller including a converter controller to control the operation of the buck converter and a constant current controller to constant current-control the LED driving current applied to the at least one LED group.

Abstract: A substrate for displays including a base, a plurality of first interconnects disposed on the base, a plurality of second interconnects disposed on the base to intersect with the first interconnects, and a plurality of sub-pixels disposed on the base and including one or more of the first and second interconnects, each of the sub-pixels including at least one interconnect extension protruding from at least one side of the second interconnect, first and second mounting portions formed between the at least one interconnect extension and the first interconnect, and a light emitting diode mounted on the first mounting portion, in which the second mounting portion is configured to mount another light emitting diode thereon.

Abstract: A display apparatus and a method of manufacturing the same are disclosed. The display apparatus includes at least one light emitting diode chip, a conductive portion disposed under the light emitting diode chip and coupled to the light emitting diode chip, and an insulating material surrounding the conductive portion. The conductive portion includes a first conductive portion and a second conductive portion, and the insulating material is formed to expose at least a portion of the upper surfaces of the first conductive portion and the second conductive portion.

Abstract: A light emitting diode package includes a housing including a body part, a first lead, a second lead, a light emitting diode chip, and a Zener diode. The body part has a cavity that is open at the top and has inclined side surfaces. The first lead and the second lead are supported by the housing and are disposed apart from each other so as to be electrically insulated. The light emitting diode chip is electrically connected to the first lead and the second lead and mounted within the cavity of the body part. The Zener diode is mounted on one side of the light emitting diode chip and inside the cavity of the body part.

Abstract: A displaying apparatus including: a panel substrate; a plurality of light emitting devices arranged on the panel substrate; and at least one connection tip disposed on one surface of each of the light emitting devices. Each of the light emitting devices includes a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first and second conductivity type semiconductor layers; and first and second electrode pads disposed on the light emitting structure.

Abstract: A light emitting device filament includes a substrate, light emitting device chips, two electrode pads, and connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extends in a first direction and has a width in a second direction. The light emitting device chips are disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The connection lines electrically connect the light emitting device chips and the electrode pads. At least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction.

Abstract: A light emitting device is adapted to realize white light and includes a first light emitting diode chip emitting light having a first peak wavelength in the range of 400 nm to 420 nm, a second light emitting diode chip emitting light having a second peak wavelength in the range of 420 nm to 440 nm, and a wavelength converter covering the first and second light emitting diode chips. The wavelength converter including a blue phosphor, a green phosphor, and a red phosphor. When a maximum value of a spectral power distribution of the light emitting device or a maximum of a reference spectral power distribution of black body radiation is 100%, a difference between the spectral power distribution of the light emitting device and the reference spectral power distribution is less than 20% at each wavelength in the wavelength range of 440 nm to 640 nm.

Abstract: A light emitting diode apparatus including a substrate, a plurality of light emitting diodes regularly arranged on the substrate and configured to emit ultraviolet (UV) light, the light emitting diodes including first, second, and third sub-light emitting diodes, a plurality of phosphor layers disposed on the light emitting diodes and to convert the wavelength of light emitted from the light emitting diodes, the phosphor layers including first, second, and third phosphor layers disposed on the first, second, and third sub-light emitting diodes, respectively, and a control unit configured to supply power to the light emitting diodes, in which the phosphor layers are spaced apart from each other by a blocking region, and the control unit is configured to cause at least a portion of the light emitting diodes to emit light.

Abstract: A display apparatus including a panel substrate including a TFT drive circuit for active matrix driving, a plurality of light emitting diodes, and an anisotropic conductive film electrically connecting the light emitting diodes to the panel substrate, in which the anisotropic conductive film includes an adhesive organic insulation material and conductive particles dispersed in the adhesive organic insulation material.

Abstract: A light emitting module including a light emitting device, and a lens disposed above the light emitting device to disperse light emitted from the light emitting device, in which the lens includes a light incident portion through which light emitted from the light emitting device enters the lens and a light exit portion through which the light exits the lens, in which each of the light incident portion and the light exit portion has a major axis and a minor axis in plan view, the major axis of the light incident portion is disposed at a right angle with respect to the major axis of the light exit portion, and a lower surface of the lens includes a horizontal surface and a slanted surface downwardly slanted from the horizontal surface in an outward direction of the lens.

Abstract: A display device and a manufacturing method thereof, wherein the display device includes a light emitting diode chip, including: a light emitting structure which includes a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first and second conductive semiconductor layers; a second electrode which is electrically connected to the second conductive semiconductor layer; an insulation unit which is disposed to cover a part of the top surface of the second electrode and side surfaces of the light emitting structure; and a second fixed part which covers the top surface of the insulation unit and is electrically connected to the second electrode, and at least a part of which extends to the side surfaces of the light emitting structure.

Abstract: Briefly, embodiments of systems and/or methods for synthesis of zinc oxide are described, including a chamber enclosure, a wafer substrate holder, a fluid handling system, and sequences for implementation.

Abstract: A light-emitting apparatus including a light-emitting element and a lens covering the light-emitting element. The lens includes an upper surface having a convex shape and a lower surface including a cavity to which light emitted from the light-emitting elements is incident, in which the cavity includes an apex facing an upper surface of the light-emitting element and configured to reduce Fresnel reflections emitted vertically.

Abstract: Briefly, embodiments of systems and/or methods for synthesis of zinc oxide are described, including a chamber enclosure, a wafer substrate holder, a fluid handling system, and sequences for implementation.

Abstract: A light-emitting device includes a light emitting diode chip, a first light transmitting resin part, a second light transmitting resin part, and a barrier part. The second light transmitting resin part covers an upper portion of the first light transmitting resin part and an upper portion of the light emitting diode chip. The barrier part surrounds side surfaces of the light emitting diode chip, the first light transmitting resin part and the second light transmitting resin part and a lower surface of the light emitting diode chip. Here, each of the first light transmitting resin part and the second light transmitting resin part has a width gradually increasing from a lower portion thereof to the upper portion thereof.

Abstract: The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.

Abstract: A light emitting diode package includes a light emitting diode chip provided at a lower side thereof with a first electrode pad and a second electrode pad, a first lead and a second lead spaced apart from each other and contacting the first electrode pad and the second electrode pad of the light emitting diode chip to be electrically connected thereto, respectively, and a housing formed to surround the first lead and the second lead and having a cavity open at a top portion thereof. The first lead and the second lead have a first lead exposing plane and a second lead exposing plane disposed on a lower surface of the cavity of the housing and partially exposing the first lead and the second lead, respectively.

Abstract: A light emitting device filament includes a substrate having a first surface and a second surface opposite to the first surface and extending in one direction, at least one light emitting device chip disposed on the first surface, and an auxiliary pattern disposed on the second surface and disposed at a position corresponding to the light emitting device chip.

Abstract: The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.

Abstract: A method of manufacturing a display apparatus according to an exemplary embodiment includes the steps of forming a plurality of light emitting diode chips on a first manufacturing substrate, coupling the plurality of the light emitting diode chips onto a second manufacturing substrate, separating the first manufacturing substrate from the plurality of the light emitting diode chips, and transferring the plurality of light emitting diode chips coupled onto the second manufacturing substrate to a substrate including first and second substrate electrodes.