Abstract: A hemodialysis apparatus 1 is provided with a dialyzer 2 for performing hemodialysis, a blood circuit 3 connected to the dialyzer, a dialysis solution circuit 4 connected to the dialyzer, a replacement fluid port 31 provided in the dialysis solution circuit and capable of being opened and closed by a lid member, and a replacement fluid passage 6 having its one end connected to the blood circuit and the other end connected to the replacement fluid port.

Abstract: A decontamination process device includes a chamber that contains a decontamination target, a heating device that generates decontamination vapor, an air sending part that sends the decontamination vapor into the chamber, a ventilation system that ventilates the chamber, a controller that controls operations of the decontamination process device. The controller performs a supply process that supplies the decontamination vapor into the chamber and an elimination process that eliminates a decontamination component after the supply process. The ventilation system adjusts an ventilation amount and the controller is set to repeat the supply processes at multiple times, and to perform a dry process between the repeated supply processes and to maintain the chamber at a positive pressure during the dry process.

Abstract: An electron beam detecting device detects a state of an electron beam radiated by an electron beam radiation device. A plurality of wire electrodes, which are conductors, are disposed corresponding to a plurality of filaments, the wire electrodes being electrically insulated from each other, in the area in which the electron beams are radiated. The electrical current flowing through each of the wire electrodes is measured by an electric current measuring instrument (measuring unit). A CPU (determining unit) determines the radiation level of the electron beams by receiving a signal output by the electric current measuring instrument. The CPU judges that when the measuring instrument measures a decrease of the current value, an abnormal condition exists in the filament corresponding to the conductor with the lower current value.

Abstract: A dialysis apparatus has a dialysate circuit 4 which is cleaned after dialysis by both opening/closing valves V101 and V102 being closed after a dialysate in the dialysate circuit 4 is replaced with a cleaning liquid. The opening/closing valve V12 is opened, and the cleaning liquid is circulated by pumps P1 and P4 while being heated by a heater H1, to clean the inside of the dialysate circuit 4. A deaeration tank 31 is provided downstream of the pump P1. Air bubbles generated from the cleaning liquid serving as hot water are deaerated by the deaeration tank 31 and are then discharged into a gas storage tank 48 via a deaeration passage 32. The pumps P1 and P4 can be reliably prevented from being unable to operate with the air bubbles generated from the cleaning liquid.

Abstract: A conductive ball mounting method for mounting conductive balls on a mount using an arraying mask, in which the mount includes mounting portions formed in a predetermined pattern, and the arraying mask is provided above the mount and includes through holes provided in portions corresponding to the mounting portions. The method includes providing a ball suction unit for sucking solder balls, the ball suction unit including a ball holding member capable of holding the conductive balls, sucking up the conductive balls below the ball suction unit, holding the conductive balls on a lower surface of the ball holding member while sucking up the conductive balls, and after the holding the conductive balls, falling the conductive balls held by the ball holding member to the mount.

Abstract: A boding device includes a light guiding part that guides laser beam oscillated from a laser oscillator, a bonding head that heats a chip with the laser beam, and a bonding head moving part that moves the bonding head between a supply position and a bonding position. The laser oscillator is separated from the bonding head. The light guiding part includes an irradiation barrel that is provided in the vicinity of the bonding position and, a shutter part that is provided in the irradiation barrel, and a light receiving part that is provided in the bonding head and guides the laser beam to the chip. When the bonding head moving part moves the bonding head to the bonding position, the shutter part is opened so that the laser beam from the irradiation barrel is guided to the bonding head through the light receiving part.

Abstract: A bonding system 1 includes a plurality of laser resonators 7 and a plurality of optical fibers f1 to f36 each having a laser beam inlet connected to one of the plurality of laser resonators. The optical fibers are bundled, and laser beam outlets of the optical fibers are disposed so as to optically face a heating region S of an electronic component 3, and the heating region is irradiated with spots of laser beams emitted from the laser beam outlets. The heating region S is divided into at least corner sub-regions S1 at the corners of the electronic component and an inner sub-region S2 inside the electronic component, and the laser power of the laser resonators whose laser beam outlets face the corner sub-regions is set higher than the laser power of the laser resonators whose laser beam outlets face the inner sub-region.

Abstract: A bonding head 6 is provided with a tool base 8 in a housing 6A and a laser for transmitting laser beam L is configured such that the laser beam L transmitted through this tool base 8 can heat an electronic component 3 and bond the same to a substrate 2. A surface of a heat-radiating member 15 is provided in contact with a surface of the tool base 8 on which the laser beam L impinges. This heat-radiating member 15 has a light transmittance for transmitting the laser beam L and also has a thermal conductivity higher than the thermal conductivity of the tool base 8. The tool base 8 is heated during bonding treatment, but heat transmitted to the tool base 8 rapidly escapes to the heat-radiating member 15 having a higher thermal conductivity.

Abstract: A device 2 for producing a three-dimensional structural body has an accommodating plate 3 in which an accommodating recess portion 3a for accommodating a cell mass 1 is formed, a support body 4 provided with a plurality of needle-shaped bodies 6 penetrating the cell mass, a suction nozzle 19 for adsorbing/holding the cell mass, and structure 20 for moving the suction nozzle.

Abstract: A bonding device includes: a plurality of laser oscillators that oscillate laser beams; a plurality of guide beam parts that guide the laser beams oscillated from the laser oscillators; a bonding tool that is irradiated and heated by the laser beams guided from the guide beam parts so that an electronic part held on the bonding tool is heated by the laser beams and is bonded to a base plate. The bonding tool is segmented into a plurality of heat regions, each of the heat regions is irradiated by the laser beams that are guided through the guide beam parts so that some of the heat regions are heated at a temperature different from other heat regions, and an insulation part is disposed at a middle section between two of the heat regions, the insulation part suppressing a heat transfer between the heat regions.

Abstract: An incubator includes filters in supply passages for supplying an environment-adjusting-medium. Divergent passages are connected to portions of the supply passages upstream from the filters. The divergent passages converge to a single supply/exhaust passage, which is provided with a pump. By driving the pump in a forward or reverse direction, decontamination gas is pumped from a culture space and discharged outside, and open air is introduced into the culture space. After sucking the contamination gas to adsorb it on the filter, open air is introduced so that the contamination gas is discharged into the culture space 6.

Abstract: A connection port 31 includes a cylindrical outer port 42 to which downstream piping 30b (discharge-side piping) is connected; an inner port 43 to which upstream piping 30a (supply-side piping) is connected, and which is provided in the outer port; and a lid member 44 which closes the inner port as well as the outer port. The inner port is provided so as to extend through the outer port from the outside of the outer port, and a heater H is provided on a portion of the inner port projecting outside the outer port. When the lid member is in a closed state, the inner port is heated with the heater to sterilize the portion of the inner port exposed to the outside, thus enabling the connection port to be cleaned at a higher level.

Abstract: An electron beam detecting device detects a state of an electron beam radiated by an electron beam radiation device. A plurality of wire electrodes, which are conductors, are disposed corresponding to a plurality of filaments, the wire electrodes being electrically insulated from each other, in the area in which the electron beams are radiated. The electrical current flowing through each of the wire electrodes is measured by an electric current measuring instrument (measuring unit). A CPU (determining unit) determines the radiation level of the electron beams by receiving a signal output by the electric current measuring instrument. The CPU judges that when the measuring instrument measures a decrease of the current value, an abnormal condition exists in the filament corresponding to the conductor with the lower current value.

Abstract: A chip attraction passage 23 is provided extending through a housing 5A, a tool base 13, and a bonding tool 14. When the chip attraction passage 23 is attracted by the vacuum source 32, a semiconductor chip 3 can be attracted to and held on the lower surface of the bonding tool 14. The tool base 13 is configured by laminating transmitting members 11 and 12. A connection passage 29, which is a main part of the chip attraction passage 23, is configured by a groove 12B formed on the upper surface of the transmitting member 12 and a through-hole 12A in the center of the transmitting member 12. When the semiconductor chip 3 is heated by laser beams L and bonded to a substrate 2, even if flux or the like adhering to bumps 35 transpires and adheres in the connection passage 29.

Abstract: An isolator system includes an isolator, passbox, clean booth, and decontamination gas supply. The isolator includes a sterile operation area and a wearing entity for an operator. The passbox enables introducing an object into the sterile operation area. The clean booth, encloses an insertion port of the wearing entity and an inlet port for introducing the object into the passbox. A clean gas supply supplies clean gas to the sterile operation area and to the clean booth. The decontamination gas supply supplies decontamination gas into the sterile operation area and the clean booth. After an interior of the sterile operation area and the clean booth are decontaminated, pressures of the sterile operation area and the clean booth are maintained at least equal to a building pressure and the pressure of the clean booth is maintained lower than a pressure of the sterile operation area.

Abstract: An incubator includes filters in supply passages for supplying an environment-adjusting-medium. Divergent passages are connected to portions of the supply passages upstream from the filters. The divergent passages converge to a single supply/exhaust passage, which is provided with a pump. By driving the pump in a forward or reverse direction, decontamination gas is pumped from a culture space and discharged outside, and open air is introduced into the culture space. After sucking the contamination gas to adsorb it on the filter, open air is introduced so that the contamination gas is discharged into the culture space 6.

Abstract: An article carrier includes a first supply wheel adjacent to a receiving wheel and a second supply wheel provided on the upstream side in the rotating direction of the receiving wheel from the first supply wheel. A switching device for switching a gripper of the first supply wheel between a use state so as to transfer a plastic bottle to a gripper of the receiving wheel and a retracted state so as not to interfere with the plastic bottle held by the gripper of the receiving wheel is also provided. When a first carrier path is used, the switching device brings the gripper of the first supply wheel into the use state, and when a second carrier path is used, the switching device brings the gripper of the first supply wheel into the retracted state.

Abstract: A harvested sample preparation system includes an operation isolator 3 in which aseptic manipulation is executed, a harvested sample preparation personal box 4 which can be connected with the operation isolator 3 and a storage 5 that stores a plurality of harvested sample preparation personal boxes 4. The harvested sample preparation personal box 4 includes a first housing chamber 4Aa and a second housing chamber 4Ab, and a fluid appropriate for cell culturing is supplied to the first housing chamber 4Aa from a fluid supply pipe 16 included by the storage 5 while cooling fluid is supplied to the second housing chamber 4Ab from a cooling fluid supply pipe 18. The harvested sample preparation system that prevents mix-up and cross-contamination with a simple configuration can be provided.

Abstract: A filling system with a supply conveyor, an infeed screw, a supply star wheel for a rinser, a rinser, a discharge star wheel for a rinser, an intermediate star wheel, a supply star wheel for a filler, a filler, a delivery star wheel for a filler/capper, a capper, a discharge star wheel for a capper, and a discharge conveyor is provided. Each component has a revolving body such as a star wheel. In case an abnormality occurs in any component, a control unit activates a brake for that component, which stops the star wheel of the component forcibly, while controlling servomotors for all of the other components, thereby stopping the star wheel of all of the other components where the abnormality does not occur. Even in the event of the abnormality in any component, each component is stopped nearly simultaneously, so that the filling system can prevent damage to all of the components.

Abstract: A boding device includes a light guiding part that guides laser beam oscillated from a laser oscillator, a bonding head that heats a chip with the laser beam, and a bonding head moving part that moves the bonding head between a supply position and a bonding position. The laser oscillator is separated from the bonding head. The light guiding part includes an irradiation barrel that is provided in the vicinity of the bonding position and, a shutter part that is provided in the irradiation barrel, and a light receiving part that is provided in the bonding head and guides the laser beam to the chip. When the bonding head moving part moves the bonding head to the bonding position, the shutter part is opened so that the laser beam from the irradiation barrel is guided to the bonding head through the light receiving part.