Abstract: Provided is a method for producing a cured product of a heat-curable maleimide resin composition, that causes no curing failure and no appearance failure associated therewith. The method is for producing a cured product of a heat-curable maleimide resin composition containing: (A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; and (B) a radical polymerization initiator, wherein the method includes: a laminating step of obtaining a laminate by laminating a release sheet, a resin layer made of the heat-curable maleimide resin composition, and a base material, in such order; and a curing step of heating the laminate to a temperature at which the heat-curable maleimide resin composition of the resin layer cures, without removing the release sheet of the laminate.

Abstract: Provided is an agglutinant for pellicles that can reduce residues stuck onto an exposure original plate when a pellicle is peeled from the exposure original plate after being used in lithography, and also provided are a pellicle, an exposure original plate with a pellicle, a method for regenerating an exposure original plate, and a peeling residue reduction method.

Abstract: A silicone gel composition in which a crosslinking agent and a base polymer having a specific molecular structure are selectively used in combination, which contains micropowdered silica having a hydrophobized surface and a specific epoxy-group-containing siloxane oligomer, and which yields a silicone gel cured product having a degree of penetration of 10-100 as specified by JIS K6249 upon curing is liquid at room temperature (23° C.±15° C.) but spreads little during application and undergoes little change in shape before and after curing, and therefore is suitable for sealing electrical/electronic components such as photocouplers.

Abstract: PURPOSE: To provide a method capable of detecting a large oxygen deposit existing in a silicon single crystal obtained by a CZ method with good sensitivity. CONSTITUTION: A silicon single crystal is subjected to heat treatment for 30 to 300 minutes at 900 to 1050 deg.C in a dry O2 atmosphere, then, is subjected to heat treatment for 30 to 200 minutes at 1100 to 1200 deg.C in a wet O2 atmosphere. After this crystal is treated with a dilute hydrofluoric acid and an oxide film on the surface of the crystal is removed, the crystal is dipped in a seco solution for 1 to 30 minutes to etch selectively the face <100> and lastly, the number of pieces of OSFs, which appear on the silicon single crystal surface, is found by an optical microscope. Accordingly, by this two-stage heat treatment, as a large oxygen deposit in the crystal is turned into the selective OSFs and the OSFs appear on the crystal surface, an inspection of the quality of the silicon single crystal can be carried out with high sensitivity.

Abstract: The photosensitive resin composition can be used to form a fine size pattern. The photosensitive resin composition includes: (A) a silicone resin that has a silphenylene structure, a polysiloxane structure, and a fluorene structure at a main chain and has an acryloyl group or a methacryloyl group at a side chain; and (B) a photoradical generator.

Abstract: The resist composition comprises an onium salt of sulfonic acid which has a linkage of two iodized or brominated aromatic groups as the acid generator. The resist composition offers a high sensitivity, reduced LWR and improved CDU independent of whether it is of positive or negative tone. A pattern can be formed by using the resist composition.

Abstract: An absorption film of a reflective mask blank that is formed on a protection film and can be etched by ion beam etching or methanol etching is patterned by providing an etching prevention film contacted with both of the protection film and the absorption film, and a first hard mask film on the absorption film, and patterning the absorption film by ion beam etching or methanol etching with using a pattern of the first hard mask film as an etching mask.

Abstract: A resist composition comprises an onium salt of aromatic sulfonic acid having a linkage of two iodized or brominated aromatic groups as the acid generator is provided. The resist composition offers a high sensitivity, reduced LWR and improved CDU independent of whether it is of positive or negative tone. A pattern can be formed by using the resist composition.

Abstract: A negative electrode active material for a non-aqueous electrolyte secondary battery containing negative electrode active material particles in which the negative electrode active material particles include particles of a silicon compound (SiOx: 0.5?x?1.6), in which the negative electrode active material particles are at least partially coated with carbon material, the negative electrode active material particles contain Li in which content of the Li relative to the negative electrode active material particles is 9.7 mass % or more or less than 13.2 mass %, at least part of the Li is present as Li2SiO3, and when the negative electrode active material particles are measured by X-ray diffraction using Cu-K? rays, an intensity Ia of a peak around 2?=47.5° attributable to Si obtained by the X-ray diffraction and a peak intensity Tb of a peak around 2?=18.7° attributable to Li2SiO3 obtained by the X-ray diffraction satisfy 1?Ib/Ia?18.

Abstract: Provided is a silicone gel composition which contains, as a base polymer, a silicon-bonded alkenyl group-containing straight-chain or branched-chain organopolysiloxane containing a specific amount of a diphenylsiloxane unit in the molecule, and contains a specific blending amount of a cross-linking agent having a specific molecular structure, a platinum-based curing catalyst, a hydrophobized fine silica powder, and an isocyanuric acid derivative having a specific molecular structure having at least two trialkoxysilyl-substituted alkyl groups in the molecule, wherein the curing of the silicone gel composition gives a silicone gel cured product having a penetration of 10-100 as specified in JIS K6249.

Abstract: The present invention is a composition for forming an organic film, containing: (A) a polymer having a repeating unit represented by the following general formula (1); (B) a resin for forming an organic film; and (C) a solvent, where R1 represents a divalent organic group having 2 to 30 carbon atoms including an aliphatic moiety or an aromatic moiety, each R2 independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a hydroxy group, an alkoxy group having 1 to 6 carbon atoms, a halogen atom other than a fluorine atom, a cyano group, an amino group, or a nitro group, and “a” represents 0 or 1, “b” representing 1 to 4 and “c” representing 0 to 3 when “a” is 0, or “b” representing 1 to 6 and “c” representing 0 to 5 when “a” is 1. This can provide a composition for forming an organic film having excellent film-formability on a substrate and excellent filling property, and being excellent in hump-suppression at the time of an EBR process.

Abstract: A positive resist composition comprising a base polymer comprising repeat units consisting of a fluorinated carboxylate, fluorinated phenoxide, fluorinated sulfonamide, fluorinated alkoxide, fluorinated 1,3-diketone, fluorinated ?-keto ester or fluorinated imide anion and a nitrogen-containing cation having a tertiary ester structure exhibits a high sensitivity, high resolution, low edge roughness and small size variation, and forms a pattern of good profile after exposure and development.

Abstract: A method for producing a vinyl chloride type polymer is to produce the vinyl chloride type polymer by polymerizing a vinyl chloride monomer, or a mixture of a vinyl chloride monomer with a monomer copolymerizable with the vinyl chloride monomer in an aqueous medium by using a polymerization reactor. An aqueous solution of a copolymerized polyether having a weight-average molecular weight of 1,000 to 3,500 with a mole ratio of ethylene oxide to propylene oxide in the range of 10/90 to 60/40 and having an alkyl group or an aryl group at both the terminals thereof is charged into the polymerization reactor with an amount of 0.005 to 0.050 parts by weight as the copolymerized polyether relative to 100 parts by weight of the vinyl chloride monomer.

Abstract: An organic silicon compound having a ketimine structure having good storage stability can be obtained by a production method that produces an organic silicon compound having a ketimine structure indicated by formula (1) R1 and R2 each independently indicating a C1-10 alkyl group or a C6-10 aryl group, R3 and R4 each independently indicating a hydrogen atom, a C1-10 alkyl group, or a C6-10 aryl group, n indicating an integer of 1-3, and m indicating an integer of 1-12. The method includes steps (I) and (II) and has a chlorine atom content relative to the organic silicon compound indicated by formula (1) of less than 0.1 mass ppm. Step (I): an amino group-containing silicon compound indicated by formula (2) and a carbonyl compound indicated by formula (3) are caused to react. R1-R4, n, and m are as described above. Step (II): the chlorine atom content is reduced.

Abstract: A negative electrode active material for a non-aqueous electrolyte secondary battery containing a negative electrode active material particle which includes a silicon compound particle containing a silicon compound (SiOx: 0.5?x?1.6). The silicon compound particle contains a Li compound, at least a part of the silicon compound particle is coated with a carbon material, and at least a part of a surface of the silicon compound particle, a surface of the carbon material, or both of them is coated with a layer containing a compound having a silyl group.

Abstract: A thermal conductive silicone composition including: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 100,000 mm2/s and not containing an alkoxysilyl group; (B) an organopolysiloxane containing an alkoxysilyl group; (C) one or more thermal conductive fillers selected from irregular-shaped, round, and polyhedral fillers having a thermal conductivity of 10 W/m·K or more; and (D) hydrophobic spherical silica particles having a D50 in a range of 0.005 to 1 ?m and a D90/D10 of 3 or less in a volume-based particle size distribution and having an average circularity of 0.8 to 1, wherein an amount of the component (C) is 40 to 85% by volume of the entire thermal conductive silicone composition.

Abstract: The present invention is a compound for forming a metal-containing film, being a reaction product between a compound having two or more diol structures per molecule and a Sn compound, and being a monomolecular compound containing two or more Sn atoms per molecule. This can provide: a metal compound having better dry etching resistance than conventional organic underlayer film materials and also having high filling and planarizing properties; a composition for forming a metal-containing film containing the compound; and a patterning process in which the composition is used as a resist underlayer film material.

Abstract: Provided is a carbon nanotube water dispersion which is suitable for producing a highly-purified carbon nanotube unwoven cloth as well as a highly-purified carbon nanotube unwoven produced from the carbon nanotube water dispersion. The carbon nanotube water dispersion contains 100 parts by mass of water, 0.001 parts by mass or more of a basic compound, and 0.001 parts by mass or more of a cholic acid derivative.

Abstract: A chemically amplified negative resist composition comprising (A) a photoacid generator in the form of an onium salt containing an aromatic sulfonic acid anion having a bulky substituent-bearing aromatic ring structure and a fluorinated substituent and (B) a base polymer is provided. The resist composition exhibits a high resolution during pattern formation and forms a pattern with reduced LER and fidelity.

Abstract: The present invention is a compound for forming a metal-containing film, where the compound is represented by the following general formula (M), where R1 and R2 each independently represent an organic group or a halogen atom; and W represents a divalent organic group represented by the following general formula (W-1) or (W-2). This can provide: a compound for forming a metal-containing film having excellent dry etching resistance and also having high filling and planarizing properties; a composition for forming a metal-containing film containing the compound; and a patterning process in which the composition is used.