Abstract: Disclosed are new catalysts for electroless metallization deposition, particularly catalysts that can be selectively activated and may be free of palladium and/or tin. Catalysts of the invention are preferably employed for electroless copper deposition.

Abstract: Disclosed are trialkylindium compounds containing two bulky alkyl groups that are liquids or easily liquefiable solids and have sufficient vapor pressure for use in vapor deposition processes, as well as methods of depositing indium containing films using such compounds.

Abstract: Disclosed are electrolytes for copper electroplating that provide enhanced fill of small features with less overplate. Also disclosed are methods of plating substrates, such as electronic devices, using such electrolytes.

Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under heat, vacuum and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (136) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained.

Abstract: A system and method for providing training in a technical field to a student is provided and includes at least one educational institution that provides an educational program. Also included is at least one industry education provider that provides a training program in a technical field. An online education provider is also included wherein the online education provider is in communications with the at least one educational institution and the at least one industry education provider. The online education provider provides to the student a composite educational program including the educational program and the training program in said technical field.

Abstract: Disclosed are compositions suitable for electroless gold plating including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufacturing electronic devices using these compositions are also provided.

Abstract: A method for recovering catalytic metals from fluid compositions containing catalytic metal colloids. Fluid compositions such as aqueous rinse solutions or dragout baths containing catalytic metal colloids are passed through a porous metal filter that entraps the catalytic metal colloids. The catalytic metal colloids have a high affinity for the porous metal filter in contrast to other components of the fluids. The other components of the fluids pass through the porous metal filter while the catalytic metal colloids concentrate on the porous metal filter. The catalytic metal colloids that are captured on the porous metal filter are removed from the filter by backwashing the filter with a gas and/or a liquid. The backwashing forces the catalytic metal colloids off of the porous metal filter and through a solids discharge valve and into a solids collection container. The method is economically efficient with high catalytic metal recovery and is environmentally friendly.

Abstract: This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 &mgr;m or less, can be prepared that is otherwise difficult to prepare using conventional methods.

Abstract: The invention provides novel polymers and photoresist compositions that comprise the polymers as a resin component. Polymers of the invention contain two distinct groups which can undergo a deblocking reaction in the presence of photogenerated acid, wherein one of the deblocking moieties is an acetal group. The second photoacid-labile group is suitably an ester, particularly as provided by polymerization of an alkyl acrylate group, such as t-butylmethacrylate.

Abstract: Disclosed are methods for the reduction of defects during the manufacture of electronic devices. Also disclosed are electronic devices having reduced numbers of defects.

Abstract: The invention provides phenolic polymers, and methods for synthesis and photoresists that comprise such polymers. Synthetic methods of the invention include providing a polymer that contains esterified meta-phenolic units, and removing the ester group preferably by hydrolysis to provide a polymer with meta-phenolic units.

Abstract: New photoresists are provided that are suitable for short wavelength imaging, including sub-200 nm, particularly 193 nm. Resists of the invention contain a polymer that comprises fluoro substitution and alicyclic leaving groups, such may be provided by polymerization of an alkyl acrylate compound.

Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.

Abstract: The invention includes polymers that contain an alicyclic group (cage group) and acetal group which can undergo a deblocking reaction in the presence of photogenerated acid. The invention also provides photoresists that contain such polymers, particularly for imaging at short wavelengths such as sub-300 nm and sub-200 nm.

Abstract: Disclosed is a resistor structure for embedding in a dielectric material including a thin film resistive material disposed on a surface of a conductive layer wherein the surface has an isotropic surface roughness having a Rz (din) value of 3 to 10 &mgr;m and a peak-to-peak wavelength of 2 to 20 &mgr;m.

Abstract: The present invention relates to new polymers that contain photoacid-labile groups that comprise arylalkyl groups. Particularly preferred are polymers having a benzylic carbon directly linked to an ester oxygen. Polymers of the invention are useful as a component of chemically-amplified positive-acting resists.

Abstract: New photoacid generator compounds (“PAGs”) are provided and photoresist compositions that comprise such compounds. In particular, ionic PAGs are provided that include tri-naphthyl sulfonium, thienyl iodonium, thienyl sulfonium, pentafluorophenyl iodonium and pentafluorophenyl sulfonium compounds. PAGs of the invention are particularly useful as photoactive components of photoresists imaged at short wavelengths such as sub-300 nm, sub-200 nm and sub-160 nm such as 248 nm, 193 nm and 157 nm.

Abstract: Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a combination thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxidation of divalent tin ions. Also provided for is a method for electroplating comprising electroplating a substrate using an electroplating solution comprising a hydroxy benzene sulfonic acid or salt thereof in an amount effective to decrease the oxidation of tin ions.

Abstract: Tin deposits having greatly reduced whisker formation are provided. Methods of depositing tin layers or films having a reduced tendency to form whiskers are also provided.

Abstract: New photoresists are provided that are suitable for short wavelength imaging, including sub-300 nm and sub-200 nm such as 193 nm and 157 nm. Resists of the invention comprise a polymer component that contains one or more adhesion-promoting groups that can impart enhanced adhesion of a coating layer of a photoresist containing the polymer to an underlying substrate, including a SiON layer.