Patents Assigned to Shipley
  • Publication number: 20030209515
    Abstract: New organic-based radiation absorbing compositions are provided that are suitable for use as an antireflective coating composition (“ARC”) for an overcoated photoresist. These compositions also serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectively from an undercoated dielectric layer.
    Type: Application
    Filed: June 9, 2003
    Publication date: November 13, 2003
    Applicant: Shipley Company, L.L.C.
    Inventor: Edward K. Pavelchek
  • Publication number: 20030209197
    Abstract: An apparatus and method for preparing high aspect ratio domes employed to enhance aerodynamic performance in missiles and aircraft. The apparatus and method of the present invention also provide transmissive domes for infrared sensors used for navigation, targeting and guidance systems. The apparatus is employed in chemical vapor deposition furnaces for chemical deposition of materials on mandrels to form domes. The mandrels of the apparatus are arranged in the deposition chamber such that the flow of gaseous reactants does not impinge on the mandrels. The reactants diffuse onto the mandrels to form domes with high aspect ratios.
    Type: Application
    Filed: April 24, 2003
    Publication date: November 13, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Jltendra S. Goela, Zlatko Salihbegovic
  • Patent number: 6645364
    Abstract: Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
    Type: Grant
    Filed: October 19, 2001
    Date of Patent: November 11, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Jeffrey M. Calvert, Robert A. Binstead
  • Patent number: 6645695
    Abstract: Disclosed are new photoresist compositions including polymeric particles as binders and a photoactive component. Also disclosed are methods of forming relief images using these photoresist compositions.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: November 11, 2003
    Assignee: Shipley Company, L.L.C.
    Inventor: Anthony Zampini
  • Patent number: 6645698
    Abstract: The invention provides photoresist compositions comprising a resin binder having acid labile blocking groups requiring an activation energy in excess of 20 Kcal/mol. for deblocking, a photoacid generator capable of generating a halogenated sulfonic acid upon photolysis and optionally, a base additive. It has found that linewidth variation is substantially reduced when using the halogenated sulfonic aced generator in a process involving a high temperature post exposure bake.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: November 11, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: James W. Thackeray, James F. Cameron, Roger F. Sinta
  • Publication number: 20030207200
    Abstract: The present invention relates to new polymers that contain repeat units of phenol and photoacid-labile esters that contain an alicyclic group, preferably a bulky group that suitably may contain 7 to about 20 carbons, such as an alkyladamantyl, ethylfencyl, tricyclo decanyl, or pinanyl group. Polymers of the invention are useful as a component of chemically-amplified positive-acting resists.
    Type: Application
    Filed: December 6, 2002
    Publication date: November 6, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: George G. Barclay, Ashish Pandya, Wang Yueh, Anthony Zampini, Gary Ganghui Teng, Zhibiao Mao
  • Publication number: 20030205476
    Abstract: Disclosed is a method of analyzing organic components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
    Type: Application
    Filed: June 9, 2003
    Publication date: November 6, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Jeffrey M. Calvert, Robert A. Binstead
  • Publication number: 20030203310
    Abstract: The present invention provides radiation sensitive compositions and methods that comprise novel means for providing relief images of enhanced resolution. In one aspect the invention provides a method for controlling diffusion of photogenerated acid comprising adding a polar compound to a radiation sensitive composition and applying a layer of the composition to a substrate; exposing the composition layer to activating radiation whereby a latent image is generated comprising a distribution of acid moieties complexed with the polar compound; and treating the exposed composition layer to provide an activating amount of acid.
    Type: Application
    Filed: June 9, 2003
    Publication date: October 30, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: James W. Thackeray, Angelo A. Lamola
  • Publication number: 20030197038
    Abstract: A method for dispensing a chemical solution in the small-scale manufacture of semiconductors is provided. The method includes associating a dispensing unit with a semiconductor coat/develop track machine and a pneumatic syringe of a chemical solution with the dispensing unit. A dispensing pressure is applied to the pneumatic syringe. The flow control diaphragm is opened to allow the dispensing pressure to drive the chemical solution from the dispensing nozzle, while the drip prevention diaphragm is moved from a first position to a second position. The flow control diaphragm is closed to prevent the dispensing pressure from driving the chemical solution from the dispensing nozzle, while the drip prevention diaphragm is returned to the first position to generate a suck-back force in the flow path at the dispensing nozzle.
    Type: Application
    Filed: November 27, 2002
    Publication date: October 23, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Karen Kvam, James B. Wickman
  • Publication number: 20030196906
    Abstract: Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 4 to 9, and a ratio of nickel ions to chloride ions of 1 or less.
    Type: Application
    Filed: December 27, 2002
    Publication date: October 23, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Makoto Kondo, Haruki Enomoto, Motoya Shimazu
  • Publication number: 20030196685
    Abstract: A cleaning composition and method for removing built-up residue and scum on a substrate.
    Type: Application
    Filed: December 12, 2002
    Publication date: October 23, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Edgardo Anzures, Robert K. Barr, Daniel E. Lundy, John P. Cahalen
  • Publication number: 20030199406
    Abstract: A cleaning composition composed of a non-chelating organic acid, salt or ester thereof, and a chelating organic acid, salt or ester thereof that may be used to clean residue and scum from a substrate. The cleaning composition is suitable for cleaning residue and scum derived from photoresist.
    Type: Application
    Filed: February 5, 2003
    Publication date: October 23, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Edgardo Anzures, Robert K. Barr, Daniel E. Lundy, Corey O'Connor
  • Publication number: 20030199704
    Abstract: Disclosed are methods of preparing monoalkyl Group VA metal dihalide compounds in high yield and high purity by the reaction of a Group VA metal trihalide with an organo lithium reagent or a compound of the formula RnM1X3-n where R is an alkyl, M1 is a Group IIIA metal, X is a halogen and n is an integer fro 1 to 3. Such monoalkyl Group VA metal dihalide compounds are substantially free of oxygenated impurities, ethereal solvents and metallic impurities.
    Type: Application
    Filed: November 23, 2002
    Publication date: October 23, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Deodatta Vinayak Shenai-Khatkhate, Michael Brendan Power, Artashes Amamchyan
  • Patent number: 6633691
    Abstract: A first waveguide holding member has a principal surface which confronts the principal surface of a second waveguide holding member. Each principal surface has a stepped configuration defined by an upper surface region, a lower surface region and a transverse region which separates the upper and lower surface regions. At least guide member guides the first and second waveguide holding members to operatively couple and decouple opposing ends of first and second optical waveguides which terminate at the transverse regions of the first and second waveguide holding members, respectively.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: October 14, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan A. Steinberg, David W. Sherrer
  • Publication number: 20030191333
    Abstract: Trialkylindium compounds are prepared by reacting indium trihalide with a trialkylaluminum compound in the presence of a fluoride salt, wherein the molar ratio of the indium trihalide to the fluoride salt is at least 1:4.5. Such trialkylindium compounds are particularly suitable for use in metalorganic vapor phase epitaxy.
    Type: Application
    Filed: April 5, 2003
    Publication date: October 9, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Deodatta Vinayak Shenai-Khatkhate, Michael Brendan Power, Ronald L. Dicarlo
  • Publication number: 20030186168
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Application
    Filed: March 22, 2003
    Publication date: October 2, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Publication number: 20030183531
    Abstract: A method for producing conductor coating on dielectric surface may be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method, conductor coatings are obtained when dielectric items are etched in acidic solutions containing oxidising agents, then treated in trivalent bismuth compound solution and additionally treated in sulphide solution.
    Type: Application
    Filed: March 31, 2003
    Publication date: October 2, 2003
    Applicant: Shipley Company, L.L.C.
    Inventor: Mykolas Baranauskas
  • Publication number: 20030183526
    Abstract: A via filling method that provides superior filling properties and superior planarization of the deposited metal layer is provided. This is achieved by a method having a F/R ratio, the ratio of the electric current densities between the forward electrolysis and the reverse electrolysis, is in the range of 1/1 to 1/10 in a PPR electric current method applied with a cycle wherein the forward electrolysis interval is from 1 to 50 msec and the reverse electrolysis interval is from 0.2 to 5 msec.
    Type: Application
    Filed: December 20, 2002
    Publication date: October 2, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Masaru Kusaka, Hideki Tsuchida
  • Publication number: 20030186169
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Application
    Filed: March 22, 2003
    Publication date: October 2, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Patent number: 6627096
    Abstract: Methods for making a micromachined device (e.g. an microoptical submount) having positive features (extending up from a device surface) and negative features (extending into the device surface). The present techniques locate the postive feature and negative features according to a single mask step. In one embodiment, a hard mask is patterned on top of the device layer of an SOI wafer. Then, RIE is used to vertically etch to the etch stop layer, forming the positive feature. Then, the positive feature is masked, and metal or hard mask is deposited on the exposed areas of the etch stop layer. Then, portions of the device layer are removed, leaving the patterned metal layer on the etch stop layer. Then, the etch stop layer is removed in an exposed area, uncovering the handle layer. Then, the handle layer is etched in an exposed area to form the negative feature.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: September 30, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: David W. Sherrer, Gregory A. Ten Eyck, Dan A. Steinberg, Neal Ricks