Patents Assigned to Shipley
  • Patent number: 6740425
    Abstract: A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: May 25, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Yoshihiro Sugita
  • Patent number: 6740467
    Abstract: The invention provides new photoresist compositions that contain a resin binder and a blend of non-ionic and ionic PAGS. Preferred resists of the invention preferably are imaged with 248 nm and/or 193 nm exposure wavelengths to provide highly resolved small dimension features.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: May 25, 2004
    Assignee: Shipley Company, L.L.C.
    Inventor: Peter Trefonas, III
  • Patent number: 6736954
    Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: May 18, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Patent number: 6738145
    Abstract: An optical fiber pressure sensor having a base layer 20 with an optical fiber hole, a fiber stop layer 28 and, optionally, an etch stop layer 24. The fiber stop layer optionally has a fiber stop hole 33 that is smaller than the optical fiber 22. A diaphragm cap layer 32 is bonded to the fiber stop layer 28. The diaphragm cap layer 32 has a diaphragm 34 spaced apart from the optical fiber. The optical fiber and diaphragm form an Etalon that changes cavity length with applied pressure. Optionally, the device is made almost entirely of silicon, and so has reduced mechanical stress problems caused by thermal expansion mismatches. This allows the present sensor to be used in high temperature environments such as internal combustion engines.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: May 18, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: David W Sherrer, Don E Leber, Dan A Steinberg
  • Patent number: 6736886
    Abstract: Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes gold ions in the plating bath, but does not cause substantial dissolution of nickel, cobalt or palladium in the plating bath, and iii) a polyethyleneimine compound. When a material to be plated is subjected to such a gold plating bath, corrosion of the base metal under the surface of the material to be plated is reduced by controlling the substitution reaction rate immediately after initiation of the reaction, and adhesion between the base metal and deposited gold coating is increased.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: May 18, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Kazuyuki Suda, Yasuo Ohta, Yasushi Takizawa
  • Patent number: 6737223
    Abstract: A fiber optic chip having one or more fiber-retaining channels and a respective number of lenslets disposed in registry with the channels is provided. The fiber optic chip includes a substrate having a first surface and an etch stop layer disposed proximate the first surface of the substrate. A fiber retaining channel is disposed within the substrate. The fiber channel has an end disposed proximate the first surface of the substrate and has a longitudinal axis extending along the channel. A lenslet is disposed on the etch stop layer and has an optical axis substantially aligned with the longitudinal axis of the channel. In addition, a process is provided for creating a fiber optic chip. The process utilizes the channels as an exposure mask to mark the locations of the lenslets relative to the channels to ensure that the lenslets are accurately registered relative to the respective channels.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: May 18, 2004
    Assignee: Shipley Company, L.L.C.
    Inventor: Dan A. Steinberg
  • Publication number: 20040089557
    Abstract: A process for electrolytic copper plating, that is suitable for the formation of filled vias without compromising the brightness of the deposit is provided. In this process, copper electroplating is carried out in the presence of a transition metal oxide.
    Type: Application
    Filed: November 7, 2002
    Publication date: May 13, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Hideki Tsuchida, Masaru Kusaka, Shinjiro Hayashi, Satoru Tsukagoshi
  • Publication number: 20040089538
    Abstract: A counter electrode for use in an electrochemical cell suitable for analysis of an electroplating composition, the counter electrode comprising a conductor; a sheath disposed about the conductor; an electrolyte disposed within the sheath; and an optionally porous element on the sheath, the porous element providing signal communication between the electrolyte and an analyte.
    Type: Application
    Filed: June 5, 2003
    Publication date: May 13, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Robert A. Binstead, Osnat Younes-Metzler, David A. Valeri, Robert D. Mikkola
  • Publication number: 20040084399
    Abstract: Provided for herein is a method of planarizing a printed circuit board substrate including contacting at least a portion of a printed circuit board substrate with a planarizing liquid, a planarizing surface, and an abrasive component that produces a surface texture on the planarized surface, the texture having a roughness less than the smallest wiring feature on the substrate, wherein the planarizing liquid includes a liquid carrier, and optionally components to remove material from the circuit board substrate and wherein the contacting comprises a plurality of contacting motions on the printed circuit board substrate.
    Type: Application
    Filed: May 28, 2003
    Publication date: May 6, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Lee M. Cook, Mark LeFebvre, Martin W. Bayes
  • Publication number: 20040086697
    Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;, &pgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.
    Type: Application
    Filed: July 16, 2003
    Publication date: May 6, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
  • Patent number: 6731857
    Abstract: Provided are photodefinable compositions. The compositions include a silsesquioxane oligomer that has polymerized units of the formula (RSiO1.5), wherein R is selected from hydroxyphenyl or hydroxybenzy, and a photoactive component. The solubility of the silsesquioxane oligomer is altered upon exposure to actinic radiation. Also provided are methods of manufacturing optical waveguides, optical waveguides and electronic devices.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: May 4, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: James G. Shelnut, Matthew L. Moynihan
  • Patent number: 6726372
    Abstract: A 2-dimensional optical fiber array having stacked sticks with fibers disposed between the sticks. The sticks are made by directional dry etching. The shape of the sticks is defined by a lithographic mask. Each stick has notches for holding the optical fibers. Since the sticks are defined by a lithographic mask, the fibers are accurately located in the 2-D array. In a alternative embodiment, the sticks are made by dry etching holes in a wafer, and then cleaving the wafer into sticks. To make the array. Fibers are disposed between the sticks and the sticks are reassembled so that cleaved surfaces are rejoined. Also, double-sided sticks can be made from a wafer having an etch stop layer. Directional dry etching is performed from both sides of the wafer.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: April 27, 2004
    Assignee: Shipley±Company, L.L.C.
    Inventors: David W Sherrer, Dan A Steinberg, Mindaugas F Dautartas
  • Patent number: 6727049
    Abstract: The present invention provides radiation sensitive compositions and methods that comprise novel means for providing relief images of enhanced resolution. In one aspect the invention provides a method for controlling diffusion of photogenerated acid comprising adding a polar compound to a radiation sensitive composition and applying a layer of the composition to a substrate; exposing the composition layer to activating radiation whereby a latent image is generated comprising a distribution of acid moieties complexed with the polar compound; and treating the exposed composition layer to provide an activating amount of acid.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: April 27, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: James W. Thackeray, Angelo A. Lamola
  • Patent number: 6728092
    Abstract: Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: April 27, 2004
    Assignee: Shipley-Company, L.L.C.
    Inventors: Andrew T. Hunt, Tzyy Jiuan Hwang, Helmut G. Hornis, Wen-Yi Lin
  • Publication number: 20040076910
    Abstract: Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.
    Type: Application
    Filed: April 5, 2003
    Publication date: April 22, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Edward W. Rutter, Cuong Manh Tran, Edward C. Orr
  • Publication number: 20040076906
    Abstract: The present invention includes polymers and photoresist compositions that comprise the polymers as a resin binder component. Photoresists of the invention include chemically-amplified positive-acting resists that can be effectively imaged at short wavelengths such as sub-200 nm, particularly 193 nm. Polymers of the invention contain in specified molar ratios both nitrile and photoacid labile groups that have an alicyclic moiety, particularly a bridged bicyclic or tricyclic group or other caged group. Polymers and resists of the invention can exhibit substantial resistance to plasma etchants.
    Type: Application
    Filed: October 10, 2003
    Publication date: April 22, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: George G. Barclay, Zhibiao Mao, Robert J. Kavanagh
  • Publication number: 20040074778
    Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, platinum, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
    Type: Application
    Filed: October 10, 2003
    Publication date: April 22, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Publication number: 20040072015
    Abstract: This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.
    Type: Application
    Filed: December 27, 2001
    Publication date: April 15, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Masaru Kusaka, Koichi Yomogida, Hidemi Nawafune, Syozo Mizumoto, Shingo Ikeda
  • Patent number: 6719932
    Abstract: Disclosed are a plurality of particles having a narrow particle size distribution, a processes for forming the same, and films containing the same. The plurality of particles, includes one or more discrete polymer shells, wherein at least one of the polymer shells is crosslinked with at least one monomer containing two or more double bonds polymerizable by free radical means; and a core material encased in the polymer shells, wherein the plurality of particles have a polydispersity of from 1.3 to 1.0.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: April 13, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Richard Roy Clikeman, Morris Christopher Wills, Katerina Elizabeth Dukes
  • Publication number: 20040067437
    Abstract: In a first aspect, organic coating compositions are provided, particularly spin-on antireflective coating compositions, that contain a component such as a resin that comprises an aryl dicarboxylate group. In a further aspect, organic coating compositions are provided, particularly spin-on antireflective coating compositions, that comprises a solvent component that comprises one or more oxyisobutyric acid esters such as methyl-2-hydroxyisobutyrate.
    Type: Application
    Filed: October 6, 2002
    Publication date: April 8, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Gerald B. Wayton, Peter Trefonas, Suzanne Coley, Tomoki Kurihara