Abstract: An electrical connector includes a male connector and a female connector. The female connector includes a female connector housing and a plurality of female contact pins. The female contact pins includes a contact portion, a stabilizer portion, and a tail portion. The contact portion extends from the stabilizer portion at an angle. A lateral distance spanned by the angled contact portion is substantially the same as or less than the width of the stabilizer portion in the same direction. The female contact pins are arranged on the female connector housing in clusters of four. The clusters are arranged in rows such that each pair of rows defines five rows of female contact pins. The male connector includes a male connector housing and a plurality of male contact pins. The male connector housing has a plurality of buttresses extending therefrom. The male contact pins are arranged on the male connector housing to correspond to the arrangement of female contact pins.

Abstract: An electrical connector includes a projection-type interconnect component and a receiving type interconnect component. The projection-type interconnect component includes an insulative buttress and a plurality of electrically conductive contacts. The contacts are spaced from each other around a circumference of the insulative buttress. The receiving-type interconnect component is adapted for receiving the projection-type interconnect component. The receiving-type interconnect component includes a plurality of flexible, electrically conductive contacts and a spacer movable relative to the flexible contacts. The spacer at least partially flexes the flexible contacts when the spacer is in a first position. The insulative buttress of the projection-type interconnect component displaces the spacer of the receiving-type interconnect component when the projection-type interconnect component is received by the receiving-type interconnect component.

Abstract: A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of forming a plurality of conductive leads, forming a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of said substrate, each of the side walls having a plurality of lead passages formed therethrough, and simultaneously inserting at least one of the conductive leads into the lead passage of one of the side walls for retention therein and at least one other of the conductive leads into the lead passage of another of the side walls for retention therein.

Abstract: A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts. A semiconductor die carrier may also include an insulative substrate; a plurality of leads each having an external portion extending out of the semiconductor die.

Abstract: A semiconductor die package includes a housing and a plurality of leads extending through openings in the housing. The package is designed to be mounted to a printed circuit board in both a horizontal configuration and in an upright configuration. In the horizontal configuration, the face of the die is held parallel to the surface of the printed circuit board. An edge of the die faces the printed circuit board when the package is mounted in an upright configuration. The leads are L-shaped so that either an end surface or an outer side surface of the lead can be surface mounted to the printed circuit board. The leads may extend from only one side wall of the housing. In this case, the housing may include a standoff on a bottom surface adjacent a side wall opposite the leads to balance the housing. Alternatively, stabilizing leads may be provided from the opposite side wall to improve horizontal mounting stability.