Abstract: A wafer cluster tool comprising a series of processes has a scheduler which synchronizes all events in the system. Events in the cluster tool are scheduled to occur at regular, periodic intervals, thereby improving throughput and quality. The scheduler also eliminates conflicts for transportation resources between modules in the cluster tool. Wafers are loaded into the cluster tool at a regular interval, referred to as a sending period. All events in the system are synchronized with the sending period, and all event timings are normalized in terms of the sending period. The conflicts are resolved by selectively adding delays in modules which can tolerate them without degrading throughput or performance in the system; modules that cannot tolerate delays are exempted. The periodicity of the scheduled cluster tool enables the identification of wafers in the cluster tool. The identification of the order in which a wafer was loaded also identifies a module path followed by the wafer.

Abstract: A hot plate assembly includes a base plate, a lid and a housing positioned between the base plate and the lid. The housing, lid and base plate form a process chamber. An insulator is positioned adjacent to the base plate in the process chamber. An air gap is formed at least partially between a bottom surface of the insulator and a top surface of the base plate. A hot plate is positioned adjacent to the insulator in the process chamber. At least a first reflective member is positioned between the hot plate and the insulator.

Abstract: The present invention provides a method and system for controlling the refractive index of gaseous mixture of the projection optics of a lithographic tool. In one embodiment, the present invention corrects projection optic aberrations due to altitude specific barometric pressure variations. Furthermore, the present invention provides control over the aberrations of an optical system, the ability to compensate for altitude changes, the ability to compensate for pressure changes, and the ability to purge gases from the optical system. In an embodiment, the system of the present invention includes at least one gas supply to provide a gas for a mixture, at least one mass flow controller associated with each gas supply, where the mass flow controller measures and controls the quantity of a respective gas for the mixture, and at least one flow gauge to substantially maintain laminar flow within the lithography apparatus.

Abstract: This invention is a thermal management method for efficient, rapid, controllable and uniform thermal management over a wide temperature range. The method integrates a thermal source, thermal sink and a thermal diffuser. According to the invention, a thermal diffuser is positioned stationary relative to the wafer surface and coupled to a thermal source and a thermal sink, which are also stationary relative to the wafer surface. The thermal sink comprises a heat-carrying media with a controllable temperature. The wafer is heated from a first processing temperature to a second processing temperature during a heating time interval and then cooled to the first processing temperature from the second processing temperature during a cooling time interval. During heating and cooling, the wafer is constantly held in a fixed position. Zonal control of the thermal source and non-uniform flow of the thermal sink enable sensitive mitigation of thermal non-uniformity on a heating surface.

Abstract: This invention relates generally to a method of trench isolation used in the fabrication of semiconductor devices, wafers and the like. More specifically, the present invention related to a method of trench isolation using chemical vapor deposition (CVD) with TEOS and ozone to deposit a trench fill oxide prior to growing a thermal oxide layer or liner on sidewalls of the trench. The method provides void-free as-deposited dielectric CVD films into gaps or trenches with non-vertical, vertical and or re-entrant profiles.

Abstract: A reticle cleaning apparatus that utilizes an ultraviolet light source in an oxygen-containing environment to cleanse organic contaminants from a reticle. The reticle cleaning apparatus of the present invention enables the storage of multiple reticles for use in a lithography tool in an environment which contains organic contaminants. A stored reticle is translated to a reticle cleaning station within the lithography tool in order to cleanse the reticle of organic contaminants. This cleaning can be performed while the projection optics of the tool exposes a wafer using another reticle previously cleaned by the reticle cleaning apparatus. Upon completion of the reticle cleaning process, the reticle is immediately translated to the exposure path of the lithography tool. The reticle cleaning process is performed during normal operation of the lithography tool at room temperature, atmospheric pressure and in an oxygen-containing environment.

Abstract: A windowless system and apparatus are provided that prevent outgases from contaminating the projection optics of an in-vacuum lithography system. The outgassing mitigation apparatus comprises a chimney that is substantially closed at one end, a duct fluidly coupled to the chimney, and a baffle disposed within the chimney. The chimney of the outgassing mitigation apparatus is funnel shaped at the end that is substantially closed. This end of the chimney has an opening that permits a beam or bundle of light to pass through the chimney. A rotating barrier, having at least one aperture for the passage of light, can be positioned near the chimney so that the rotating barrier substantially closes an open end of the chimney except when one of the apertures of the rotating barrier is passing by the chimney. This rotating barrier can be chilled by a refrigerator unit, which is radiantly coupled to a portion of the rotating barrier. A motor is used to rotate the barrier.

Abstract: A semiconductor wafer processing system including a multi-chamber module having vertically-stacked semiconductor wafer process chambers and a loadlock chamber dedicated to each semiconductor wafer process chamber. Each process chamber includes a chuck for holding a wafer during wafer processing. The multi-chamber modules may be oriented in a linear array. The system further includes an apparatus having a dual-wafer single-axis transfer arm including a monolithic arm pivotally mounted within said loadlock chamber about a single pivot axis. The apparatus is adapted to carry two wafers, one unprocessed and one processed, simultaneously between the loadlock chamber and the process chamber. A method utilizing the disclosed system is also provided.

Abstract: An optical reduction system for use in the photolithographic manufacture of semiconductor devices having one or more quarter-wave plates operating near the long conjugate end. A quarter-wave plate after the reticle provides linearly polarized light at or near the beamsplitter. A quarter-wave plate before the reticle provides circularly polarized or generally unpolarized light at or near the reticle. Additional quarter-wave plates are used to further reduce transmission loss and asymmetries from feature orientation. The optical reduction system provides a relatively high numerical aperture of 0.7 capable of patterning features smaller than 0.25 microns over a 26 mm×5 mm field. The optical reduction system is thereby well adapted to a step and scan microlithographic exposure tool as used in semiconductor manufacturing. Several other embodiments combine elements of different refracting power to widen the spectral bandwidth which can be achieved.

Abstract: An optical reduction system with polarization dose sensitive output for use in the photolithographic manufacture of semiconductor devices having variable compensation for reticle retardation before the long conjugate end. The variable compensation component(s) before the reticle provides accurate adjustment of the polarization state at or near the reticle. The variable compensation components can be variable wave plates, layered wave plates, opposing mirrors, a Berek's compensator and/or a Soleil-Babinet compensator. The catadioptric optical reduction system provides a relatively high numerical aperture of 0.7 capable of patterning features smaller than 0.25 microns over a 26 mm×5 mm field. The optical reduction system is thereby well adapted to a step and scan microlithographic exposure tool as used in semiconductor manufacturing. Several other embodiments combine elements of different refracting power to widen the spectral bandwidth which can be achieved.

Abstract: A protective shield and a semiconductor processing system including a protective shield is provided. The shield includes a frame assembly including a pair of spaced end walls and a pair of side walls extending between and mounted to the end walls, and a plurality of shield bodies carried by the frame assembly. Each of the shield bodies includes a base having a continuous unit frame, a perforated sheet carried by said continuous frame, a plenum between the base and the perforated sheet, and a gas delivery device for delivering an inert gas to the plenum at a flow rate such that the gas diffuses through the perforated sheet.

Abstract: Characterization of an optical system is quickly and easily obtained in a single acquisition step by obtaining image data within a volume of image space. A reticle and image plane are positioned obliquely with respect to each other such that a reticle having a plurality of feature sets thereon, including periodic patterns or gratings, is imaged in a volume of space, including the depth of focus. Metrology tools are used to analyze the detected or recorded image in the volume of space through the depth of focus in a single step or exposure to determine the imaging characteristics of an optical system. Focus, field curvature, astigmatism, spherical, coma, and/or focal plane deviations can be determined. The present invention is particularly applicable to semiconductor manufacturing and photolithographic techniques used therein, and is able to quickly characterize an optical system in a single exposure with dramatically increased data quality and continuous coverage of the full parameter space.

Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.

Abstract: A process for drying a polymeric material present on a substrate is provided. Temperatures of the polymeric material is measured and the ambient temperature in the vicinity of the substrate. A temperature of the substrate is also measured. A variation in the measured ambient temperature is detected. The substrate temperature, polymeric temperature, ambient temperature or a substrate drying spin speed is adjusted in response to the detected variation in the measured ambient temperature.

Abstract: A calcium fluoride (CaF2) stress plate provides a predetermined amount of optical delay. The CaF2 stress plate has surfaces that lie in CaF2 cubic planes, and delays an optical wavefront that is incident to a set of cubic planes along a transmission axis. To implement the desired delay, the CaF2 stress plate has a first index of refraction that is seen by a first field component of the optical wavefront, and a second index of refraction that is seen by a second field component of the optical wavefront. The optical delay of the stress plate is proportional to the differences between the two indexes of refraction. Embodiments of the invention include a method of fabricating the CaF2 stress plate from a sample of CaF2 material. The method includes the step of determining the orientation of the cubic planes for the CaF2 sample, as the sample is typically oriented along the cleave planes. Next, the sample is processed to generate a CaF2 plate whose surfaces are oriented in CaF2 cubic planes.

Abstract: The present invention provides systems and methods of dispensing liquids. In one embodiment, the system includes a pump with a removable pump module with at least one displacement piston and at least one piston valve. A motor and base assembly provide the supporting components of the pump which can be used in environments where precise small volumes of ultra-pure liquids must be transferred from a reservoir to a point of use. The preferred embodiment of the system prevents contaminants and air bubbles from being introduced into the liquid to be dispensed by placing a filter across the discharge line downstream from the pump, and providing a separate drawback line for performing the drawback of the liquid in the dispensing nozzle.

Abstract: A method and apparatus for providing a purged optical path between an optical source surface and an optical target surface and for permitting relative movement between the optical source surface and the optical target surface is described. The apparatus includes a body, a central cavity, at least one gas supply bore, and at least one gas removal bore. The body defines first and second opposing surfaces. The first opposing surface is configured for positioning closely adjacent to the optical target surface. The second opposing surface is configured to mate with the optical source surface. The central cavity is formed in the body for passing light through the body, the central cavity being open at the first and second opposing surfaces. The at least one gas supply bore is formed in the body for suppling a flow of a purge gas to the central cavity.

Abstract: An apparatus, system, and method for precision positioning and alignment of a lens in an optical system, wherein a first support for coupling to the peripheral edge of the lens is connected to a concentric second support using a plurality of positioning devices. At least one positioning device is configured to move the first support in an axial direction relative to the second support. Each positioning device comprises a lever, an actuator, and a flexure. The lever has a pivot point and is mounted on the second support. The actuator is connected to the lever and used to operate the lever about its pivot point. The flexure has a first end connected to the lever between the actuator and the pivot point. A second end of the flexure is connected to the first support. A second positioning device is used to move the first support relative to the second support in a direction substantially perpendicular to the axial direction.

Abstract: The present invention provides an illumination system for varying the size of an illumination field incident to a scattering optical element. The illumination field is subsequently imaged to a reticle in a photolithographic process. The illumination system includes, in series along an optical axis of the illumination system, an optical source, a beam conditioner, a first optical integrator, a first or input collimating lens, a zoom array integrator (ZAI), a second or output collimating lens, the optical scattering element, a relay lens, and the reticle. The ZAI includes an assembly of fixed and moveable lens components arranged to vary the size of the illumination field throughout a zoom range of the ZAI while maintaining telecentric illumination at a substantially fixed numerical aperture. Illumination telecentricity and substantially fixed numerical apertures are maintained at both the scattering optical element and the reticle throughout the zoom range.

Abstract: A scanning framing blade apparatus includes a stationary assembly having a plurality of magnets; first and second carriage assemblies that each have a plurality of coils. The first and second carriage assemblies are supported on the stationary assembly by a plurality of air bearings that permit the first and second carriage assemblies to move in only one degree of freedom. In addition, the scanning framing blade apparatus includes first and second framing blades that are attached to the first and second carriage assemblies, respectively. The scanning framing blade apparatus also includes a controller that is coupled to the plurality of coils. The controller is adapted to energize at least one of the plurality of coils, thereby causing at least one of the carriage assemblies and corresponding framing blade to move in the one degree. This motion controls illumination onto a reticle during a substrate scanning process.