Abstract: A light-emitting diode (LED) lens for covering a LED light source includes a lens body made of a transparent material. The lens body has a light-exit surface and a light-entrance portion. The light-exit surface is configured along the longitudinal direction into a pair of convex surface areas and a concave surface area interconnecting the convex surface areas. The concave surface area has minimum dimensions smaller than maximum dimensions of each of the convex surface areas along first and second transverse directions. The light-entrance portion is adapted for receiving the LED light source, and has a light-incident surface. The light-incident surface has a pair of end portions opposite to each other along the longitudinal direction and extending inclinedly away from the light-exit surface and away from each other.

Abstract: A DC-to-AC converter circuit includes a step-up converter module and an inverter module. The step-up module includes first and second inductors that cooperate to form a transformer, first and second power switches, and first and second capacitors. When the first power switch and the second power switch conduct, the first inductor and the second inductor store energy from a first variable power source and a second variable power source respectively, and after the first capacitor and the second capacitor provide electrical energy to the inverter module, the inverter module converts the electrical energy provided thereto and outputs converted energy.

Abstract: A beam splitter includes a substrate unit, and first and second prisms disposed on surfaces at two opposite sides of the substrate unit, respectively. The substrate unit includes a substrate member, and a beam splitter film disposed at the substrate member and capable of beam splitting. The beam splitter film includes a plurality of thin film layers arranged in a stack. Each of the thin film layers is made of an inorganic material.

Abstract: A voltage boosting circuit includes a first inductor, a first switch, a second inductor, a second switch, a first clamping diode, and a first energy storing element. When the first switch and the second switch conduct, the first and second inductors are able to store energy of a power source signal. When the first switch is not conducting and the second switch conducts, the first inductor is able to release energy to the first energy storing element. When the first switch conducts and the second switch is not conducting, the second inductor and the first energy storing element are able to release energy to a load.

Abstract: A resonant power converting circuit is provided, which includes a resonant converting unit, a control unit, a voltage detecting unit and a frequency modulation unit. The control unit outputs switching signals to the resonant converting unit to adjust an output of the resonant converting unit. The voltage detecting unit is configured to detect an output voltage of the resonant converting unit. The frequency modulation unit may adjust a lowest switching frequency of the control unit according to the detected output voltage so as to increase a gain of the resonant converting unit and an output stability of the resonant converting unit.

Abstract: A miniaturization active sensing module includes a substrate unit, an active sensing unit, and an optical unit. The substrate unit includes a substrate body, a plurality of first bottom conductive pads disposed on the bottom side of the substrate body, and a plurality of first conductive tracks embedded in the substrate body. The substrate body has at least one first groove formed therein. The active sensing unit includes at least one active sensing chip embedded in the first groove. The active sensing chip has at least one active sensing area and a plurality of electric conduction pads disposed on the top side thereof, and each first conductive track has two ends electrically contacted by one electric conduction pad and one first bottom conductive pad, respectively. The optical unit includes at least one optical element, disposed on the substrate body, for protecting the active sensing area.

Abstract: A circuit board device includes a heat dissipation housing, a circuit board, and a heat conductive adhesive. The heat dissipation housing includes a panel, and at least one end plate connected to one end of the panel and formed with a retaining groove. The circuit board is disposed in the heat dissipation housing spaced apart from the panel and has one end inserted into the retaining groove. The heat conductive adhesive is adhered to the panel and the end plate, and covers the circuit board.

Abstract: A light emitting diode chip includes a substrate, an epitaxial layer, two inclined plane units, and two electrode units. The substrate has top and bottom surfaces. The epitaxial layer is disposed on the top surface of the substrate. Each of the inclined plane units is inclined downwardly and outwardly from the epitaxial layer toward the bottom surface of the substrate, and includes an inclined sidewall formed on the epitaxial layer, and a substrate inclined wall formed on the substrate. Each of the electrode units includes an electrode disposed on the epitaxial layer, and a conductive portion extending from the electrode to the substrate inclined wall along corresponding one of the inclined plane units.

Abstract: A method for setting and adjusting light emitted from an adjustable lighting device is disclosed. The adjustable lighting device includes a timing unit and anon-volatile memory (NVM) module for storing a record data which includes a memory flag changeable between a set state and a reset state, and a plurality of light setting values. In the method, the adjustable lighting device is configured to allow a user to select an illumination state of the light, and to change the memory flag in the record data to the set state and to store the record data with a corresponding one of the light setting values when a elapsed time counted by the timing unit is longer than a predetermined threshold time period.

Abstract: A substrate structure has a first surface and a second surface. A plurality of carrying members are formed on the first surface and a plurality of conductive traces are formed on the second surface. In addition, the substrate structure has a first, a second and a third thermal stress relief structures. The first thermal stress relief structure is that lengths of the substrate structure in different axial directions are substantially equal to each other. The second thermal stress relief structure is that a plurality of separated alignment marks are formed on the substrate structure. The third thermal stress relief structure is that the substrate structure has at least one clearance area extending along one of the axial directions of the substrate structure and the clearance area has no carrying members and no conductive traces formed thereon.

Abstract: A slim key includes a supporting plate, at least one key cap, at least one dome and a light-permeable circuit board. The supporting plate is disposed above the circuit board and has at least one frame part. Each frame part is formed with a light-permeable hole at a central portion thereof. The key pad is disposed on the top surface of the frame part correspondingly. The circuit board has at least one conductive circuit formed thereon under the dome correspondingly. The dome is correspondingly disposed between the frame part and the circuit board. According to one embodiment, the instant disclosure also provides an electronic device with the slim keypad structure.