LED package

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Description

FIG. 1 is a perspective view of a “LED package” showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and

FIG. 8 is a perspective view viewed from another visual angle thereof; and,

FIG. 9 is a perspective view with a LED chip showing the practical usage thereof.

The dashed lines in the drawings are for illustrative purpose only and form no part of the claimed design.

Claims

The ornamental design for a “LED package,” as shown and described.

Patent History
Patent number: D674361
Type: Grant
Filed: Mar 30, 2012
Date of Patent: Jan 15, 2013
Assignees: Silitek Electronic (Guangzhou) Co., Ltd. (Guangzhou), Lite-On Technology Corporation (Taipei)
Inventors: Chen-Hsiu Lin (New Taipei), Yi-Chien Chang (Taipei)
Primary Examiner: Selina Sikder
Application Number: 29/417,114
Classifications