Patents Assigned to SILTECTRA GMBH
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Patent number: 10930560Abstract: A method for creating a detachment area in a solid, in particular for detaching the solid along the separating region. Said solid portion that is to be detached is thinner than the solid body from which the solid portion has been removed. Said method preferably comprises at least the following steps: the crystal lattice of the solid is modified by means of a modifying agent, in particular by means of at least one laser, in particular a pico- or femtosecond laser. The modifications, in particular the laser beams penetrate into the solid via a surface of the solid portion which is to be detached, several modifications are created in the crystal lattice, said crystal lattice penetrates, following said modifications, in the areas surrounding the modifications, at least in one particular part.Type: GrantFiled: November 27, 2015Date of Patent: February 23, 2021Assignee: Siltectra GmbHInventors: Christian Beyer, Jan Richter
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Patent number: 10858495Abstract: A polymer hybrid material, a film comprising the polymer hybrid material, the use of the polymer hybrid material, a splitting method using the polymer hybrid material, and a method for producing the polymer hybrid material are provided for increasing the total yield, i.e. the efficiency with respect to the raw materials used and other resources such as energy and workforce, of a splitting method. The polymer hybrid material for use in a splitting method has at least two solid-body sections produced from a solid-body starting material. The polymer hybrid material comprises a polymer matrix and a first filler and a second filler embedded into the polymer matrix.Type: GrantFiled: March 23, 2017Date of Patent: December 8, 2020Assignee: Siltectra GmbHInventors: Christian Beyer, Jan Richter, Marko Swoboda
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Patent number: 10843380Abstract: The invention relates to a method for producing a multi-layer assembly.Type: GrantFiled: April 7, 2016Date of Patent: November 24, 2020Assignee: Siltectra GmbHInventors: Franz Schilling, Wolfram Drescher, Jan Richter
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Patent number: 10825732Abstract: A method of splitting a semiconductor wafer includes: inducing a first stress distribution in the semiconductor wafer by exposing the semiconductor wafer to a first radiation process; inducing a second stress distribution in the semiconductor wafer by exposing the semiconductor wafer to a second radiation process, the second radiation process including applying laser energy to an edge of the semiconductor wafer; and splitting the semiconductor wafer after inducing the first stress distribution and the second stress distribution.Type: GrantFiled: January 7, 2020Date of Patent: November 3, 2020Assignee: Siltectra GmbHInventors: Lukas Lichtensteiger, Wolfram Drescher
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Patent number: 10707068Abstract: The present invention relates to a method for producing solid body layers. The claimed method comprises at least the following steps: providing a solid body (2) for separating at least one solid body layer (4), arranging a receiving layer (10) on the solid body for holding the solid body layer (4), said receiving layer being made of at least one polymer and an additional material, said receiving layer, in terms of volume, be made mainly of polymer, the additional material having a greater conductivity than the polymer, and the receiving layer (10) is subjected to thermal stress, in particular, mechanical stress, for generating voltages in the solid body (2), wherein a crack in the solid body (2) along a separation plane (8) expands due to the voltages, the solid layer (4) being separated from the solid body (2) due to the crack.Type: GrantFiled: September 24, 2015Date of Patent: July 7, 2020Assignee: Siltectra GmbHInventors: Jan Richter, Christian Beyer, Anas Ajaj
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Patent number: 10676386Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the centre (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).Type: GrantFiled: March 21, 2019Date of Patent: June 9, 2020Assignee: Siltectra GmbHInventors: Marko Swoboda, Christian Beyer, Franz Schilling, Jan Richter
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Patent number: 10661392Abstract: The invention relates to a method for creating a detachment zone (2) in a solid (1) in order to detach a solid portion (12), especially a solid layer (12), from the solid (1), said solid portion (12) that is to be detached being thinner than the solid from which the solid portion (12) has been removed.Type: GrantFiled: October 3, 2019Date of Patent: May 26, 2020Assignee: Siltectra GmbHInventor: Christian Beyer
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Patent number: 10593590Abstract: A method for the production of layers of solid material is contemplated. The method may include the steps of providing a solid body for the separation of at least one layer of solid material, generating defects by means of at least one radiation source, in particular a laser, in the inner structure of the solid body in order to determine a detachment plane along which the layer of solid material is separated from the solid body, and applying heat to a polymer layer disposed on the solid body in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the detachment plane, which crack separates the layer of solid material from the solid body.Type: GrantFiled: April 9, 2019Date of Patent: March 17, 2020Assignee: Siltectra GmbHInventors: Wolfram Drescher, Jan Richter, Christian Beyer
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Patent number: 10580699Abstract: The present invention relates to a method for the production of layers of solid material, in particular for use as wafers. The method may include the following steps: providing a workpiece for the separation of the layers of solid material with the workpiece optionally having at least one exposed surface, producing and/or providing a carrier unit for receiving at least one layer of solid material having the carrier unit optionally having a receiving layer for holding the layer of solid material, attaching the receiving layer to the exposed surface of the workpiece forming a composite structure, producing a break initiation point by means of pre-defined local stress induction in the peripheral region, including at the edge, of the workpiece, and separating the layer of solid material from the workpiece starting from the break initiation point.Type: GrantFiled: February 13, 2019Date of Patent: March 3, 2020Assignee: Siltectra GmbHInventors: Lukas Lichtensteiger, Wolfram Drescher
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Patent number: 10312135Abstract: A method for the production of layers of solid material is contemplated. The method may include the steps of providing a solid body for the separation of at least one layer of solid material, generating defects by means of at least one radiation source, in particular a laser, in the inner structure of the solid body in order to determine a detachment plane along which the layer of solid material is separated from the solid body, and applying heat to a polymer layer disposed on the solid body in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the detachment plane, which crack separates the layer of solid material from the solid body.Type: GrantFiled: October 8, 2014Date of Patent: June 4, 2019Assignee: Siltectra, GmbHInventors: Wolfram Drescher, Jan Richter, Christian Beyer
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Patent number: 10280107Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the center (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).Type: GrantFiled: June 23, 2016Date of Patent: May 7, 2019Assignee: Siltectra, GmbhInventors: Marko Swoboda, Christian Beyer, Franz Schilling, Jan Richter
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Patent number: 10269643Abstract: The present invention relates to a method for the production of layers of solid material, in particular for use as wafers. The method may include the following steps: providing a workpiece for the separation of the layers of solid material with the workpiece optionally having at least one exposed surface, producing and/or providing a carrier unit for receiving at least one layer of solid material having the carrier unit optionally having a receiving layer for holding the layer of solid material, attaching the receiving layer to the exposed surface of the workpiece forming a composite structure, producing a break initiation point by means of pre-defined local stress induction in the peripheral region, including at the edge, of the workpiece, and separating the layer of solid material from the workpiece starting from the break initiation point.Type: GrantFiled: May 5, 2014Date of Patent: April 23, 2019Assignee: Siltectra, GmbHInventors: Lukas Lichtensteiger, Wolfram Drescher
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Publication number: 20190071552Abstract: A polymer hybrid material, a film comprising the polymer hybrid material, the use of the polymer hybrid material, a splitting method using the polymer hybrid material, and a method for producing the polymer hybrid material are provided for increasing the total yield, i.e. the efficiency with respect to the raw materials used and other resources such as energy and workforce, of a splitting method. The polymer hybrid material for use in a splitting method has at least two solid-body sections produced from a solid-body starting material. The polymer hybrid material comprises a polymer matrix and a first filler and a second filler embedded into the polymer matrix.Type: ApplicationFiled: March 23, 2017Publication date: March 7, 2019Applicant: SILTECTRA GMBHInventors: Christian BEYER, Jan RICHTER, Marko SWOBODA
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Patent number: 10141219Abstract: A method for producing layers of solid material is contemplated.Type: GrantFiled: October 8, 2014Date of Patent: November 27, 2018Assignee: Siltectra GmbHInventors: Wolfram Drescher, Jan Richter
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Patent number: 10079171Abstract: The present invention relates to a method for the production of at least one three-dimensional layer of solid material, in particular for usage as wafer, and/or at least one tree-dimensional solid body.Type: GrantFiled: October 8, 2014Date of Patent: September 18, 2018Assignee: Siltectra, GmbHInventor: Jan Richter
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Publication number: 20180233347Abstract: The present invention relates to a method for producing solid body layers. The claimed method comprises at least the following steps: providing a solid body (2) for separating at least one solid body layer (4), arranging a receiving layer (10) on the solid body for holding the solid body layer (4), said receiving layer being made of at least one polymer and an additional material, said receiving layer, in terms of volume, be made mainly of polymer, the additional material having a greater conductivity than the polymer, and the receiving layer (10) is subjected to thermal stress, in particular, mechanical stress, for generating voltages in the solid body (2), wherein a crack in the solid body (2) along a separation plane (8) expands due to the voltages, the solid layer (4) being separated from the solid body (2) due to the crack.Type: ApplicationFiled: September 24, 2015Publication date: August 16, 2018Applicant: Siltectra GMBHInventors: Richter Jan, Christian Beyer, Anas Ajaj
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Publication number: 20180233373Abstract: The overall yield of a splitting method for division of a solid-state starting material into at least two solid-state pieces is increased by use of a polymer hybrid material comprising one or more fillers in a polymer matrix. A corresponding splitting method comprises the steps of providing the solid-state starting material with at least one exposed surface, applying a polymer hybrid material comprising fillers in a polymer matrix to at least one exposed surface of the solid-state starting material, so as to result in a composite structure, and subjecting the composite structure to a stress field such that the solid-state starting material is split along a plane within the solid-state starting material into at least two solid-state pieces.Type: ApplicationFiled: October 6, 2015Publication date: August 16, 2018Applicant: SILTECTRA GMBHInventors: Wolfram DRESCHER, Jan RICHTER, Christian BEYER
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Patent number: 10029277Abstract: The invention relates to a method of producing at least one layer of solid material.Type: GrantFiled: December 4, 2014Date of Patent: July 24, 2018Assignee: Siltectra, GmbHInventors: Lukas Lichtensteiger, Jan Richter, Wolfram Drescher
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Publication number: 20180009130Abstract: The present invention relates to a device (1) for separating at least one wafer from a donor substrate (2). The device (1) according to the invention comprises at least a housing (4) with a receiving space (6) for receiving at least one multi-layer arrangement (8) which consists of at least one donor substrate (2) and a receiving layer (10) arranged or generated thereon, and an application device (12) for the contactless application of the multi-layer arrangement (8) for generating crack-conducting stresses in the multi-layer arrangement (8).Type: ApplicationFiled: January 13, 2016Publication date: January 11, 2018Applicant: SILTECTRA GmbHInventor: Jan Richter
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Publication number: 20180001416Abstract: The invention relates to a method for cutting off at least one portion (4), in particular a wafer, from a solid body (2). The method comprises at least the following steps: modifying the crystal lattice of the solid body (2) by means of a modifier (18), wherein a number of modifications (19) are produced to form a nonplanar, in particular convex, detachment region (8) in the interior of the solid body, wherein the modifications (19) are produced in accordance with predetermined parameters, wherein the predetermined parameters describe a relationship between a deformation of the portion (4) and a defined further treatment of the portion (4), detaching the portion (4) from the solid body (2).Type: ApplicationFiled: January 13, 2016Publication date: January 4, 2018Applicant: SILTECTRA GmbHInventor: Jan Richter