Abstract: The invention provides a method of manufacturing a composite wafer structure. In particular, the method, according to the invention, is based on the fracture mechanics theory to actively control fracture induced during the manufacture of the composite wafer structure and to further protect from undesired edge damage. Thereby, the method, according to the invention, can enhance the yield rate of industrial mass production regarding the composite wafer structure.

Abstract: The invention discloses a semiconductor light-emitting device and a method of fabricating the same. The semiconductor light-emitting device according to the invention includes a substrate, a buffer layer, a multi-layer structure, and an ohmic electrode structure. The buffer layer is selectively formed on an upper surface of the substrate such that the upper surface of the substrate is partially exposed. The multi-layer structure is formed to overlay the buffer layer and the exposed upper surface of the substrate. The multi-layer structure includes a light-emitting region. The buffer layer assists a bottom-most layer of the multi-layer structure in lateral and vertical epitaxial growth. The ohmic electrode structure is formed on the multi-layer structure.

Abstract: A lithium aluminum oxide (LiAlO2) substrate suitable for a zinc oxide (ZnO) buffer layer is found. The ZnO buffer layer is grown on the LiAlO2 substrate. Because the LiAlO2 substrate has a similar structure to that of the ZnO buffer layer, a quantum confined stark effect (QCSE) is effectively eliminated. And a photoelectrical device made with the present invention, like a light emitting diode, a piezoelectric material or a laser diode, thus obtains an enhanced light emitting efficiency.

Abstract: The present invention is a light emitting device which uses a specific phosphor powder. The phosphor powder is a combination of cerium (Ce) and lithium aluminum oxide (LiAlO2). They are mixed under a specific range of composition ratio. With the specific phosphor powder applied, the light emitting device has advantages in a low cost, a reduced power consumption, an easy production, a long life, and so on. In addition, a transformation efficiency of the phosphor powder is high and so a light emitting efficiency of the light emitting device is enhanced.

Abstract: A light emitting diode (LED) is made. The LED had a LiAlO2 substrate and a GaN layer. Between them, there is a zinc oxide (ZnO) layer. Because GaN and ZnO have a similar. Wurtzite structure, GaN can easily grow on ZnO. By using the ZnO layer, the GaN layer is successfully grown as a single crystal thin film on the LiAlO2 substrate. Thus, GaN defect density is reduced and lattice match is obtained to have a good crystal interface quality and an enhanced light emitting efficiency of a device thus made.

Abstract: The present invention polishes a lithium aluminum oxide (LiAlo2) crystal several times with three different materials and then the LiAlo2 crystal are soaked into an acid solution to be washed for obtaining a LiAlo2 crystal of film-free, scratch-free with smooth surface.