Abstract: A semiconductor device includes etch stop films formed on the first gate electrode, the first source region, the first drain region, and the shallow trench isolation regions, respectively. First interlayer insulating films are formed on the etch stop film, respectively. Deep trenches are formed in the substrate between adjacent ones of the first interlayer insulating films to overlap the shallow trench isolation regions. Sidewall insulating films are formed in the deep trenches, respectively. A gap-fill insulating film is formed on the sidewall insulating film. A second interlayer insulating film is formed on the gap-fill insulating film. A top surface of the second interlayer insulating film is substantially planar and a bottom surface of the second interlayer insulating film is undulating.

Abstract: A trench capacitor includes a trench disposed in a substrate; an inner electrode disposed in a central portion of the trench and having a top surface and a bottom surface; an outer electrode disposed symmetrically with respect to the inner electrode, the outer electrode having a depth shallower than a depth of the inner electrode with respect to a top surface of the substrate; a thick bottom insulating layer disposed below the inner electrode and the outer electrode; and a capacitor dielectric layer surrounding the outer electrode. The outer electrode protrudes above the top surface of the substrate and has a top surface that is higher than the top surface of the inner electrode.

Abstract: A manufacturing method of a semiconductor device, includes providing a substrate; forming a stacked gate, including a floating gate and a control gate, on the substrate; forming a stacked gate by a deposition of a select gate conductive layer on the stacked gate; forming a trench in the stacked gate by etching the stacked gate to separate a first select gate pattern and a second select gate pattern; and forming a first select gate, a second select gate, a first transistor, and a second transistor simultaneously through an etch-back process of the stacked gate.

Abstract: A power device and a guard ring structure surrounding the power device are provided. The power device includes: a buried layer of a first conductivity type and a buried layer of a second conductivity type disposed within a substrate; a body region of the first conductivity type and a drift region of the second conductivity type disposed on the buried layer of the first conductivity type; and a gate electrode, a source electrode, and a drain electrode disposed on the body region of the first conductivity type and the drift region of the second conductivity type. The guard ring structure includes: a first guard ring of the second conductivity type adjacent to the power device; a second guard ring of the first conductivity type adjacent to the first guard ring; and a third guard ring of the second conductivity type adjacent to the second guard ring.

Abstract: A semiconductor device includes a first junction-gate field-effect transistor (JFET) having a first pinch-off voltage, and a second JFET having a second pinch-off voltage higher than the first pinch-off voltage. The first JFET includes a first top gate region disposed on a surface of a substrate, a first channel region surrounding the first top gate region, and a first bottom gate region disposed under the first channel region. The second JFET includes a second top gate region disposed on the surface and having a same depth with the first top gate region relative to the surface, a second channel region surrounding the second top gate region and disposed deeper than the first channel region relative to the surface, and a second bottom gate region disposed under the second channel region and being deeper than the first bottom gate region relative to the surface.

Abstract: A semiconductor device polysilicon resistor formation method is provided. A third ion implantation and a fourth ion implantation are performed in a polysilicon resistor region, so that a high-resistance polysilicon resistor can be formed without an additional mask process.

Abstract: A semiconductor device includes a memory cell array including a plurality of memory cells, a bit line selection circuit, including a first main select transistor, and a plurality of first sub-select transistors connected in parallel with each other, and the plurality of first sub-select transistors configured to be the first memory cell through the first bit line to transfer the read current from the first bit line to the first memory cell; and a sense amplifier configured to compare a reference current having a predetermined current value with a memory current drawn by the first memory cell, and output an output signal based on an input voltage, the sense amplifier including an active load, connected to the first main select transistor, comprising a PMOS diode or a NMOS diode configured to lower the input voltage at a sense node.

Abstract: A semiconductor device manufacturing method includes forming a tunneling gate insulating layer and a floating gate Poly-Si layer in a substrate, an inter-poly dielectric layer on the floating gate Poly-Si layer, a control gate Poly-Si layer on the inter-poly dielectric layer, and a control gate hard mask layer on the control gate Poly-Si layer, performing a patterning process on the control gate hard mask layer, the control gate Poly-Si layer, the inter-poly dielectric layer, the floating gate Poly-Si layer and the tunneling gate insulating layer to form a gate stack, forming a select gate insulating layer on the gate stack, and a select gate disposed on the select gate insulating layer, performing a removing process on the select gate insulating layer and the control gate hard mask to expose a top surface of the control gate, and forming a silicide layer on the control gate.

Abstract: A semiconductor device includes a ring-shaped gate electrode having an opening area disposed on a substrate, a source region and a bulk tap region disposed in the opening area, a well region disposed to overlap the ring-shaped gate electrode, a drift region disposed to be in contact with the well region, a first insulating isolation region disposed, on the drift region, to partially overlap the gate electrode, a second insulating isolation region enclosing the bulk tap region, a drain region disposed to be spaced apart from the ring-shaped gate electrode, and a deep trench isolation region disposed adjacent to the drain region.

Abstract: A method for manufacturing a semiconductor die includes forming a front side of a semiconductor wafer; etching a surface of the semiconductor wafer to a predetermined depth to form a first aperture in the front side of the semiconductor wafer; forming a protective layer on the front side of the semiconductor wafer and performing a first turning-over of the semiconductor wafer to a back side of the semiconductor wafer; exposing a bottom of the first aperture to form a second aperture in the back side of the semiconductor wafer; and performing a second turning-over of the semiconductor wafer to the front side of the semiconductor wafer and removing the protective layer.

Abstract: A silicon-controlled rectifier (SCR) includes a first P-type well region and a N-type well region in a substrate. The first P-type well region includes a first P+ region, a first N+ region, and a first P+ electrically non-contacted region. The N-type well region includes a first N+ electrically non-contacted region, a second N+ region, a second P+ region and a third P+ region, each of which is disposed on opposite sides of the second N+ region, and a second N+ electrically non-contacted region.

Abstract: A power device and a guard ring structure surrounding the power device are provided. The power device includes: a buried layer of a first conductivity type and a buried layer of a second conductivity type disposed within a substrate; a body region of the first conductivity type and a drift region of the second conductivity type disposed on the buried layer of the first conductivity type; and a gate electrode, a source electrode, and a drain electrode disposed on the body region of the first conductivity type and the drift region of the second conductivity type. The guard ring structure includes: a first guard ring of the second conductivity type adjacent to the power device; a second guard ring of the first conductivity type adjacent to the first guard ring; and a third guard ring of the second conductivity type adjacent to the second guard ring.

Abstract: A method of manufacturing a semiconductor device includes: forming a deep trench in a substrate; performing an ion implantation process to form a lower electrode along with the deep trench; forming a dielectric layer on the lower electrode; filling a first conductive layer into the deep trench; performing a planarization process on the first conductive layer to form an upper electrode in the deep trench such that a trench capacitor is formed in the deep trench; forming a shallow trench adjacent to the deep trench; forming a logic gate insulating layer adjacent to the shallow trench; forming a logic gate electrode on the logic gate insulating layer; and forming a source region and a drain region adjacent to the logic gate electrode. The logic gate electrode is made of a same material as the upper electrode.

Abstract: A trench capacitor manufacturing method is provided. The method includes forming a deep trench in a wafer, forming a trench capacitor structure including a plurality of dielectric films and a plurality of conductive layers in the deep trench; determining if the wafer has a tensile stress based on the forming of the trench capacitor structure; performing a high temperature heat treatment to the trench capacitor structure to change a form of the wafer to a direction that offsets the tensile stress; forming an inter-layer insulating film on the trench capacitor structure; and forming a metal interconnect on the inter-layer insulating film.

Abstract: A semiconductor device includes a source region and a drain region disposed in a substrate, a gate stack including a floating gate and a control gate disposed between the source region and the drain region, a select gate insulating layer disposed on a sidewall of the gate stack, and a select gate disposed on the select gate insulating layer, the select gate having a height higher than a height of the gate stack or a height of the control gate.

Abstract: A multi time program device with a power switch and a non-volatile memory implementing the power switch for multi time program is provided. The device performs a program operation or an erase operation of a non-volatile memory cell in a non-volatile memory device.

Abstract: A trench power MOSFET includes a body region disposed on a semiconductor substrate, a trench passing through the body region, an top electrode and a bottom electrode spaced apart from each other in a vertical direction in the trench, an inter-electrode dielectric layer disposed between the top electrode and the bottom electrode, and a plurality of dielectric layers, disposed between a sidewall of the trench and the bottom electrode, comprising a first oxide layer disposed on the sidewall of the trench, an barrier layer disposed on the first oxide layer, and a second oxide layer disposed on the barrier layer. The barrier layer is formed of a material different from materials of the first and second oxide layers.

Abstract: An electrostatic discharge (ESD) protection device, incudes an N-type well and a P-type well formed in a semiconductor substrate; a first N-type diffusion region and a first P-type diffusion region formed in the N-type well, separated by a first separation film, and each connected to an Anode terminal; a second N-type diffusion region and a second P-type diffusion region formed in the P-type well, separated by a second separation film, and each connected to a Cathode terminal; a P-type floating region, formed in the P-type well, spaced apart from the second N-type diffusion region and the second P-type diffusion region; and a non-sal layer covering the P-type floating region.

Abstract: An eFuse one-time programmable (OTP) memory is provided. The eFuse OTP memory supports inter integrated circuit (I2C) communication, and an operation method thereof. The eFuse OTP memory includes: an eFuse intellectual property (IP) which data writes once and data reads multiple times for a plurality of addresses; and an I2C slave which communicates with an I2C master based on a serial clock line and a serial data line, and performs the data write and the data read to and from the eFuse IP.

Abstract: A semiconductor device includes a semiconductor substrate comprising a P-type lightly doped semiconductor layer; an undoped silicon layer formed on the P-type lightly doped semiconductor layer; a first deep trench isolation and a second deep trench isolation formed from an upper surface of the semiconductor substrate to the undoped silicon layer and filled with insulating films; and a first N-type highly doped buried layer formed on the undoped silicon layer, and disposed between the first deep trench isolation and the second deep trench isolation, wherein the undoped silicon layer surrounds bottoms of the first and second deep trench isolations, and has a thickness greater than a thickness of the first N-type highly doped buried layer.